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SEMI Press Release
SEMI 3D & Systems Summit to Advance Heterogeneous Systems Integration with Focus on AI, Hybrid Bonding, and Europe's Chiplet Ecosystem
DRESDEN, Germany — May 6, 2026 — Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden,...
Member Press Release
Brewer Science Earns 2026 USA TODAY Top Workplaces Award
Brewer Science Earns 2026 USA TODAY Top Workplaces Award
Employee-Owner Feedback Recognizes Company’s People-First Culture
Rolla, MO – April 14, 2026 – Brewer Science, Inc., a global leader in...
Member Press Release
Closing the Loop – Integrated Waste Gas & Water Treatment Solutions at SEMICON Southeast Asia 2026
Kuala Lumpur, Malaysia, 29 April 2026 – DAS Environmental Experts presents its latest sustainable technologies at SEMICON SEA 2026 (May 5–7, MITEC, Booth 1174). The focus is on closing resource loops...
Blog
Edge AI in Semiconductor Manufacturing: Powering Smart, Resilient Fabs
With edge AI emerging as a clear driver of smart manufacturing, SEMI hosted a two-day workshop detailing the future of this technology. The workshop, Smarter Sensors, Smarter Fabs: AI at...
SEMI Press Release
SEMI Europe Highlights Six Key Policy Recommendations to Optimize the Chips Act 2.0 into a Strategic Instrument for Europe
BRUSSELS – April 27, 2026 – SEMI Europe today announced the publication of its Position Paper on the Chips Act 2.0, presenting a set of strategic recommendations aimed at reinforcing...
SEMI Press Release
SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
SEMI Veteran to Lead Global Programs Supporting EDA and Semiconductor EcosystemMILPITAS, Calif. — April 30, 2026 — SEMI, the industry association serving the global semiconductor...
SEMI Press Release
SEMI ESD Alliance 2026 Executive Outlook Explores How Agentic AI Will Change Chip Design and Verification
Experts from Breker, ChipAgents, Moores LabAI, Silimate, Verific to survey early implementation successes of agentic AI tools and applicationsExecutives to discuss collaboration between...
Member Press Release
yieldWerx and Enlight Technology Extend Design-to-Test Data Continuity Across Taiwan’s Semiconductor Ecosystem
Date: April 21, 2026
Location: Hsinchu, Taiwan
yieldWerx is expanding its presence in Taiwan through a collaboration with Enlight Technology Co., Ltd., bringing advanced test data aggregation and...
Blog
Siemens EDA’s Joe Kwan on Design Team and Foundry Collaboration for Successful Chip Manufacturing
Today’s post is the last of four Q&A-style feature posts based on presentations during SEMICON West 2025’s “The Convergence of Semiconductor Manufacturing and Design” organized by the ESD...
SEMI Press Release
SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
AI-driven Demand and Signs of Broad-based Recovery Boost Global Silicon Wafer Shipments, Despite Mixed Market ConditionsMILPITAS, Calif. — April 29, 2026 — The SEMI Silicon Manufacturers Group...
Blog
SEMI ISS Europe 2026: Navigating Geopolitics and Shaping Europe’s Semiconductor Future
As competition within the semiconductor industry continues to intensify, the need for Europe to strengthen its current position within the global supply chain and develop new partnerships are more...
SEMI Press Release
SEMI’s ASMC Event Spotlights Practical Strategies for Overcoming Today’s Biggest Semiconductor Manufacturing Challenges
MILPITAS, Calif. — April 22, 2026 — SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced the program for its...