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SEMI Press Release

SEMI and 16 Industry Groups Send Letter to President Biden Urging Support for CHIPS Act Funding and Investment Tax Credit

MILPITAS, Calif. – February 18, 2021 – In a letter sent to President Biden today, SEMI, the industry association serving the global electronics design and manufacturing supply chain, and 16...
February 18, 2021
Member Press Release

PNI Sensor’s New TargetPoint Tilt-Compensated Compass Module (TCM) Provides Accurate Heading in any Environment

SANTA ROSA, Calif., – February 17, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, today announced...
February 17, 2021
Member Press Release

Qurv and Infineon Win for Leading MEMS and Image Sensors Innovations at SEMI Technology Showcase

BERLIN, Germany – 17 February, 2021 –Qurv and Infineon Technologies have won the MEMS & Imaging Sensors Technology Showcase at the Technology Unites Global Summit, SEMI announced today. The Qurv...
February 17, 2021
Member Press Release

ClassOne’s Next-generation SoftSeal Plating Rotor Enhances Performance of Solstice Electroplating Systems

Semiconductor equipment manufacturer ClassOne Technology has just released its proprietary new SoftSeal™ Plating Rotor, designed to enhance processing performance on the company’s Solstice®...
February 17, 2021
Blog

SEMI Smart Mobility Lead Weighs in on Chip Shortage

In my role as lead for the Smart Mobility initiative at SEMI, I recently spoke with Automotive Logistics Magazine about the growing importance of the semiconductor supply chain’s connection with the...
By Bettina Weiss
February 15, 2021
SEMI Press Release

SEMICON West Rescheduled to December 2021 for Inaugural Colocation with Design Automation Conference

MILPITAS, Calif. – February 16, 2021 – SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced that SEMICON West 2021 and the Design...
February 16, 2021
SEMI Press Release

European SEMI Award Honors KU Leuven, TU Dresden and CEA-Leti for Key Chip Industry Contributions

BERLIN, Germany ─ February 15, 2021 ─ The Catholic University of Leuven, Technical University of Dresden and CEA-Leti have won the 2019 European SEMI Award at the SEMI Technology Unites Global Summit...
February 15, 2021
Member Press Release

Safer medical devices with Picosun’s antimicrobial ALD coatings

ESPOO, Finland, 12th February 2021 – Picosun Group, the leading provider of AGILE ALD® (Atomic Layer Deposition) thin film coating technology and solutions, reports excellent aseptic properties...
February 12, 2021
SEMI Press Release

SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight

BERLIN, Germany – 15 February, 2021 – SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry...
February 15, 2021
Member Press Release

New offer dedicated to research from the ECM Group - ECM Lab Solutions

ECM Lab Solutions is a new offer from the ECM Group, dedicated to laboratories, research centers and universities. This offer combines equipment from three companies and four brands: ECM...
February 10, 2021
By Administrator
February 10, 2021
Blog

Critical Subsystems Service and Support Revenues on Course to Reach $3.5 Billion by 2025

Revenues from service and support related to critical subsystems reached $2.3 billion in 2020 and are on track to exceed $3.5 billion by 2025. Growth in the installed base of tools, high-utilization...
February 9, 2021