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SEMI Press Release
SEMI 3D & Systems Summit Keynotes Spotlight 5G, HPC and System-in-Package Innovations
DRESDEN, Germany – 14 January, 2020 – Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020,...
SEMI Press Release
SEMICON Korea 2020 Keynotes to Highlight Future of AI
SEOUL, South Korea – January 14, 2020 – Semiconductor industry innovators SK hynix, Intel, imec and Graphcore will kick off SEMICON Korea 2020 with keynotes focusing on the future of artificial...
Member Press Release
Vesper Microphones Power Smart Home Fire Safety Device, LifeDoor
BOSTON – (January 7, 2020) – Vesper, a leading provider of intelligent sensors, today announced that its ZeroPower Listening™ microphones were chosen to bring extended battery life and durability to...
Blog
2019 in Review – A Transformational Year for SEMI Global Advocacy
When we entered 2019, our priorities in SEMI Global Advocacy were crystal clear: Continue to advance our public policy priorities under the 4 T’s – Trade, Tax, Talent and Technology – and move toward...
Blog
Chip Industry Shines in Award-Winning Sustainable Development Online Course Offered by University of Bristol
In a shining hour for Prof. Mike Czerniak, environmental manager for Edwards Ltd., a SEMI member company, and Chemistry Prof. Simon O’ Doherty of the University of Bristol, the educators presented a...
Blog
SEMI Taiwan Eyes Collaboration with Hsinchu City to Upgrade Local Microelectronics Industry Clusters
High-tech industry clusters in the bustling northern Taiwan port city of Hsinchu look set for an upgrade. Long a world-class hub of the semiconductor and optoelectronic technology industries, Hsinchu...
Member Press Release
Picosun’s ALD technology enables 3D silicon-integrated microcapacitors with unprecedented performance
ESPOO, Finland, 2nd January 2020 – Picosun Group, global provider of leading AGILE ALD® (Atomic Layer Deposition) thin film coating solutions, reports record performance of silicon-integrated,...
SEMI Press Release
North American Semiconductor Equipment Industry Posts November 2019 Billings
MILPITAS, Calif. —December 19, 2019—North America-based manufacturers of semiconductor equipment posted $2.12 billion in billings worldwide in November 2019 (three-month average basis), according to...
Blog
Industry Awards for SOI Luminaries at UCLouvain, Lattice, NXP & Soitec
The industry continues rewarding luminaries of the SOI ecosystem. Recently recognized are Jean-Pierre Raskin for RF-SOI, Lattice Semi and NXP for FD-SOI products, and Bich-Yen Nguyen for her work in...
Blog
Japan Symposium ‘19 Summaries Part 1 – 5G/RF-SOI
The SOI Consortium’s Japan Symposium this past fall covered a wide array of topics over two days. The first day was devoted to IP and products for RF and ultra-low-power (ULP) on SOI. The second day...
Member Press Release
Cohu Introduces LiDAR Optical Test and Inspection Solution
POWAY, Calif.--(BUSINESS WIRE)--Dec. 10, 2019-- Cohu, Inc. (NASDAQ: COHU), a global leader in back-end semiconductor equipment and services, today announced the introduction of a new complete...
Blog
Skills for Industry: METIS to Support Europe’s Curriculum Guidelines 4.0
We live in the New Industrial Age. Manufacturing is undergoing a profound transformation, driven not only by technological (e.g. Artificial Intelligence, robotics, IoT) but also societal, market and...