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SEMI Press Release

SEMI Smart Manufacturing Initiative Releases Groundbreaking Industry Benchmark Survey

MILPITAS, Calif. – July 1, 2019 – The SEMI Smart Manufacturing Initiative today released the semiconductor industry’s first Benchmark Survey to assess the current implementation level of automation...
July 1, 2019
SEMI Press Release

SEMI Americas and Semiconductor Digest Announce 2019 “Best of West” Award Finalists: CyberOptics, Advantest and Edwards

MILPITAS, Calif. – July 1, 2019 – SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2019, July 9-11 at the Moscone Center in San...
July 1, 2019
Member Press Release

Picosun accelerates growth with a notable Finnish investment

ESPOO, Finland, 28th June 2019 – Finnish investors make significant investments in Picosun, a manufacturer of ALD equipment, increasing the company’s share capital by 12 million euros. New investors...
June 28, 2019
Member Press Release

Aspinity Enables 10x Less Power for Always-on Sensing

-- RAMP “analyze-first” edge-architecture minimizes data handling, maximizes battery life for smart speakers, wearables/hearables, IoT products PITTSBURGH — June 25, 2019 – Aspinity, a pioneer in...
June 25, 2019
Blog

Korea Expected to Maintain Equipment Spending Lead Over Other Regional Markets

Despite recent global economic uncertainties and a downbeat memory market outlook for the second half of 2019, new 300mm fab construction in Korea is still going strong. The graph below, based on the...
By Sungho Yoon
June 27, 2019
SEMI Press Release

SEMI Teams with Cornell University to Accelerate Technology Development Using Machine Learning and AI

Milpitas, Calif. – June 27, 2019 – SEMI today announced a research and development (R&D) project to speed technology progress and problem-solving in microelectronics manufacturing and across the...
June 27, 2019
Blog

Industry Giants TSMC and Intel Vow to Focus on 3D IC Packaging

Post-Conference Report: SEMI Heterogeneous Integration SummitDemand for high-performance computing (HPC) chips is exploding. These super-speedy chips are critical for data centers and cloud computing...
By Emmy Yi
June 26, 2019
SEMI Press Release

What to Make of the ‘Quantum Advantage’ at SEMICON West?

What to Make of the ‘Quantum Advantage’ at SEMICON West? IBM demos its model of the bleeding-edge Q Computer, while the Quantum Economic Development Consortium lays out first steps toward creation...
June 25, 2019
Blog

Taking Atoms to Systems in Next-Generation SoC Designs

New system-on-chip (SoC) devices are driving new memory architectures and photonic interfaces, while specialized new intellectual property (IP) requires analysis down to the nanometer and atomic...
By Nanette Collins
June 25, 2019
Blog

SEMI China Members Day 2019 — Robust Supply Chain Key to Buildout of China’s Semiconductor Industry

Shenyang is on an unwavering path to maturing its integrated circuit (IC) equipment manufacturing industry over the next few decades in response to the Made in China 2025 Strategy. Since the...
By Cherry Sun
June 25, 2019
Blog

Multi-Sensor Metrology Tools for Hybrid Metrology

SEMI spoke with Thomas Fries, founder and CEO of FRT GmbH, about how hybrid metrology is shaping multi-sensor metrology tools to enhance measurement precision as the industry moves away from a...
By Serena Brischetto
June 24, 2019
SEMI Press Release

North American Semiconductor Equipment Industry Posts May 2019 Billings

MILPITAS, Calif. — June 20, 2019 — North America-based manufacturers of semiconductor equipment posted $2.06 billion in billings worldwide in May 2019 (three-month average basis), according to the...
June 20, 2019