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Blog
Inspiring Future Generations of Chip Industry Workers
High Tech U Expands to Reach Younger Students
This past school year marked a significant turning point for the SEMI Foundation's education initiatives with the launch of High Tech U...
SEMI Press Release
Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
MILPITAS, Calif. — September 21, 2023 — Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 13 new 200mm volume fabs...
SEMI Press Release
SEMI MEMS & Imaging Sensors Summit Opens Tomorrow with Sustainability and Innovation in Focus
GRENOBLE, France – September 18, 2023 – Innovation will take center stage at the SEMI MEMS & Imaging Sensors Summit as the event opens tomorrow at the World Trade Center in...
Blog
New Plasma Power Technologies for Next-Gen Semiconductor Manufacturing
Addressing the need for Angstrom Era precision and control
As chip designs push the limits of speed, size and complexity, the semiconductor industry has set its sights on angstrom-scale device...
Blog
CHIPS Research and Development Standards Summit to Launch Effort to Speed Chip Innovation
Standards play a pivotal role in shaping industries and driving progress in a world driven by technology, innovation, and precision. That’s why SEMI is excited to announce the inaugural CHIPS...
SEMI Press Release
2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports
MILPITAS, Calif. — September 12, 2023 — Global fab equipment spending for front-end facilities in 2023 is expected to decline 15% year-over-year (YoY) to US$84 billion from a record...
SEMI Press Release
ASMC 2024 Call for Abstract Submissions Opens
MILPITAS, Calif. — September 11, 2023 — The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is now accepting abstract submissions for its 2024 event,...
SEMI Press Release
Q2 2023 Global Semiconductor Equipment Billings Dips 2% Year-Over-Year, SEMI Reports
MILPITAS, Calif. – September 6, 2023 – Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in the second quarter of 2023, while quarter-over-quarter billings...
Member Press Release
MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high...
SEMI Press Release
SEMICON Taiwan 2023 Kicks Off With Press Conference Spotlighting Critical Semiconductor Industry Themes
TAIPEI, Taiwan – September 5, 2023 – Industry luminaries gathered today for a press conference to kick off SEMICON Taiwan 2023, opening tomorrow with companies from across the electronics...
Member Press Release
Sikama International Announces Full Commercialization of Acid-Free “Electron Attachment” Fluxless Solder Reflow System
SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA)...
SEMI Press Release
Dr. Lawrence T. Pileggi of Carnegie Mellon University to be Honored With 2023 Phil Kaufman Award
Dr. Pileggi Will be Recognized for His Significant Contributions to the Electronic System Design Industry
MILPITAS, Calif. – September 5, 2023 – Dr. Lawrence Pileggi, Coraluppi Head...