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Member Press Release
Russ Sanchez Joins YES as VP of Quality and Managing Director of YES Technology Center
Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Russ...
Member Press Release
Micron to Select Athinia™ for Pioneering Data Collaboration
A long-term, strategic, enterprise-level technology collaboration aims to further increase production efficiencies and reduce costs for Micron and its suppliers.
Cambridge, MA, July 13, 2022 – Today,...
SEMI Press Release
SEMI FlexTech Announces 2022 FLEXI Award Winners for Outstanding Achievements in Flexible Electronics
SAN FRANCISCO — July 14, 2022 — Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), SEMI FlexTech, a SEMI Technology Community, yesterday...
Member Press Release
PEER Group employees recognized for contributions to the semiconductor industry
Kitchener, Ontario, July 13, 2022
PEER Group®, the largest supplier of innovative semiconductor factory automation software, is proud to share that two members of its engineering team have been...
Member Press Release
RoodMicrotec N.V.: Invitation to the presentation of the first half-year’s results for 2022
Deventer, July 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, will publish the Company’s first half-year report for 2022 before stock...
SEMI Press Release
SEMI Standards’ Leaders Honored at SEMICON West 2022 Hybrid
SAN FRANCISCO, Calif. — July 13, 2022 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, announced it honored industry leaders for their...
SEMI Press Release
SEMI Announces Election and Re-Election of Board Members
SAN FRANCISCO — July 12, 2022 — SEMI today announced at SEMICON West 2022 Hybrid the election of Tim Archer, President and CEO of Lam Research; Doris Hsu, Chairperson and CEO of GlobalWafers...
Member Press Release
MRSI launches new Die Bonder with improved throughput for high power laser manufacturers
MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD,...
Presentation
SEMI Bylaws
SEMI Bylaws governing the association's Name and Offices (Article I), Membership (Article II), Board of Directors (Article III), Methods of Giving Notice (Article IV), Officers (Article V),...
Member Press Release
Sikama International at SEMICON West 2022 – “Reliable, Repeatable, Responsible Reflow”
Sikama International is excited to exhibit at SEMICON West 2022 this July, presenting the innovative Electron Attachment fluxless reflow technology, our upcoming 40th anniversary, and an extensive...
SEMI Press Release
Global Total Semiconductor Equipment Sales On Track to Record $118 Billion in 2022, SEMI Reports
SAN FRANCISCO — July 12, 2022 — Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a record $117.5 billion in 2022, rising...
Member Press Release
Breker Verification Systems and Codasip Announce Cooperation to Drive Open, Commercial-Grade RISC-V SoC Verification Processes
Breker Verification Systems, the leading provider of advanced test content synthesis solutions, including RISC-V Cache Coherency, and Codasip, the leading supplier of customizable RISC-V processor...