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Event Presentation
SEMICON China 2019: Advanced Packaging Forum (4 Presentations)
SEMICON China 2019 Advanced Packaging Forum Presentations
Event Presentation
Design For 5G Baseband Chips in Advanced FinFet Process Technology
Presentation from SEMICON China 2019: Design For 5G Baseband Chips in Advanced FinFet Process Technology. Advanced Manufacturing.
Blog
Fab Owners Alliance: Enabling Global Manufacturing Efficiency Through Collaboration
Imagine a world where there are chips in about everything we touch on a daily basis. It is not hard to do with semiconductors already at the core of many leading-edge electronic devices. These...
Blog
Size Matters … at Least in the Critical Subsystems Supply Chain
Clouds continue to persist over the semiconductor supply chain with little sign of lifting. In March, the decline in week-over-year chip sales appeared to be slowing, providing a glimmer of hope for...
SEMI Press Release
2019 FLEX Korea Highlights Flexible Hybrid Electronics Technology Innovations and Opportunities
SEOUL, Korea – May 21, 2018 – More than 200 industry experts and thought leaders from academia will gather June 19-20 at 2019 FLEX Korea for critical insights into the latest flexible hybrid...
Blog
SEMI Monitors Escalating U.S.-China Trade Tensions
SEMI, the association representing the end-to-end global electronics industry supply chain, today provided the following statement from Mike Russo, VP of Global Industry Advocacy, regarding the...
Event Presentation
EUV Patterning: Challenges and Opportunities
Frederic Lazzarino, R&D Manager, IMEC, discusses EUV industry trends and outlook. Topics include cost, EUV readiness, HVM implementation and more.
SMC Korea 2019 - Seoul, Korea
Event Presentation
Wet-Chemical Process Challenges for Advanced Logic Device Fabrication
Dr. Dennis H van Dorp, Sr. Researcher of Surface and Interface Chemistry outlines the wet process challenges associated with Advance Logic Device Fabrication. Areas of focus include high aspect...
Event Presentation
Advanced Transistor Evolution - Technologies for 5 nm and Beyond
Naomi Yoshida, Director, Distinguished MTS at Applied Materials, discusses trends and challenges associated with scaling beyond 5nm. She also provides insight on new technologies that allow for...
Blog
SEMI High Tech U Launches in Southeast Asia at SEMICON SEA 2019
On May 8, a group of students gathered at SEMICON Southeast Asia for a one-of-a-kind experience. These students would be the first in the region to participate in SEMI High Tech U (HTU) – diving into...
Member Press Release
Trymax Receives Multi-System Orders from a Top 10 Semiconductor Packaging House
Multi-site shipment in Taiwan and China for 200mm and 300mm bumping descum solutions.
NIJMEGEN, THE NETHERLANDS - May 15, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma...
SEMI Press Release
SMC Korea 2019 this Week: Semiconductor Materials Trends, Opportunities in Focus
Seoul, Korea – May 14, 2019 – SMC Korea 2019, the region’s premier electronics materials conference, will gather more than 400 industry experts and top executives from every segment of semiconductor...