Showing 1465-1476 of 2675
Member Press Release
Lanza techVentures Becomes Member of SEMI ESD Alliance
Lanza techVentures, an early-stage investment firm that supports entrepreneurs to realize their innovative, new ideas in technologies, products and business models, today became a member of the...
Member Press Release
Brooks Instrument Introduces First Fully Pressure-Insensitive Pressure-Based Mass Flow Controller for Etch and CVD Processes in Semiconductor Manufacturing
Brooks Instrument, a leader in precision fluid measurement and control technology, has released the new GP200 Series, the first fully pressure-insensitive pressure-based mass flow controller (P-MFC)...
Blog
Intel Sets Out to Tackle Power Delivery Challenges for Heterogeneous Systems
As monolithic scaling slows down, the semiconductor industry is increasingly relying on advanced packaging technologies to extend Moore’s law through heterogeneous integration. Higher on-package...
Blog
Work Remains for Congress to Strengthen U.S. Semiconductor Supply Chain as SEMI Continues Engagement with Policymakers
Congress has left most of the semiconductor industry’s legislative priorities unfinished even as chip shortages continue to buffet global supply chains for a number of key industries. However,...
Member Press Release
ViTrox Exhibits in the SEMICON Southeast Asia (SEA) 2021
PENANG MALAYSIA - August 2021 - ViTrox Technologies, the world’s most trusted technology company for the semiconductor and electronic packaging industries, announces its participation in the SEMICON...
Member Press Release
Official Launch of ViTrox 360-Degree Virtual Tour
PENANG MALAYSIA - August 2021 - ViTrox Technologies, the world’s most trusted technology company for the semiconductor and electronic packaging industries, is pleased to announce that its 360-Degree...
Member Press Release
Bioh Kim Joins YES Senior Executive Team as President of YES Korea
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Bioh...
SEMI Press Release
North American Semiconductor Equipment Industry Posts July 2021 Billings
MILPITAS, Calif. — August 23, 2021 — North America-based semiconductor equipment manufacturers posted $3.86 billion in billings worldwide in July 2021 (three-month average basis), according...
Blog
Exploring the Move to Bespoke Silicon and 3D IC Designs with Ansys
Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design...
Member Press Release
Odyssey and EKK Eagle Semicon Components Sign Distribution Agreement
Odyssey Technical Solutions, world leader in RF, DC, and microwave repairs, is pleased to announce a new distribution agreement with EKK Eagle Semicon Components for both the Americas and European...
Member Press Release
Aspinity Expands Executive Team and Board of Directors in Go-to-Market Drive for AnalogML
--Experts in AI/ML, edge computing, analog semiconductors, and IoT bring engineering acumen, operational excellence to analogML pioneer
PITTSBURGH—August 17, 2021—Aspinity, the developer of analog...
SEMI Press Release
SEMICON Southeast Asia 2021 Goes Virtual Next Week with 5G in Focus
SINGAPORE – August 17, 2021 – Opening next week as a virtual conference and exhibition, SEMICON Southeast Asia (SEMICON SEA) 2021, the region’s premier event for the global electronics manufacturing...