Showing 2605-2616 of 2676
Event Presentation
European 3D Summit 2018: Fan Out Transformation from WLCSP to 3D
John Hunt, Senior Director of Engineering and Technical Promotion at ASE Inc. discusses WLP evolution, fan out variations (chip first vs. chip last; low density vs. high density), fan out...
Event Presentation
SEMI Oregon Breakfast Forum: China's Impact on the Semiconductor Industry – 2017 Update
Ed Pausa, Director of the Technology Center at PricewaterhouseCoopers discusses current findings on China’s impact on the Semiconductor Industry, including IC and O-S-D market/revenue growth and fab...
Event Presentation
SEMI Oregon Breakfast Forum 2017: How do I Protect Design and Value in the Global IC Manufacturing World?
Michael Chen, Director at Mentor Graphics, Siemens, suggests that only by continuing to innovate at the cutting edge will the United States be able to mitigate the threat posed by Chinese industrial...
Event Presentation
SEMICON Korea 2018: Shaping the Electronic Mobility Experience
Berthold Hellenthal, Manager of Development Electronics at AUDI AG, discusses Audi’s comprehensive semiconductor strategy, or Audi Progressive SemiConductor Program (PSCP), which features three...
Event Presentation
SEMICON Korea 2017: The Next Memory Cycle – When, Why, and How it Will Happen
Jim Handy, General Director at Objective Analysis, begins by showing a chart on semiconductor forecast accuracy, and digs into the memory cycle, what drives commodity cycles, what will drive today’s...
Event Presentation
SEMICON Korea 2017: The Future of Mobility
Klaus Meder, President of Bosch Corporation Japan, share sales figures from 2016 within mobility, industrial tech, energy/building tech, and consumer goods. Specifically a breakdown of total...
Blog
Fluid Management Subsystems Sales Top $1 Billion for First Time
Sales revenues for fluid management subsystems grew 28 percent in 2017 to $1.28 billion, breaking the $1 billion mark for the first time. Fluid management subsystems have now seen five years of...
Blog
U.S. Federal Government Finalizes R&D Spending for 2018
Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown...
Blog
Silicon Valley FD-SOI 2018 Training Day is April 27th – Don't Miss It!
Following the immense success of last year's FD-SOI training day in Silicon Valley, the SOI Consortium has another one planned for the end of April this year. If you want to start learning how to...
Blog
The Challenge of Tight Silicon Wafer Supply: Impacts and Implications
Co-author: Sungho Yoon, Senior Market Research Analyst at SEMIChip makers continue to struggle to secure more silicon wafers to meet market demand as production capacity has reportedly fallen...
Blog
China Now World’s Largest Consumer of Packaging Equipment and Materials
Fueled by heavy government investment, IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world’s largest consumer of packaging equipment and materials,...
Blog
AI and MEMS Sensors: A Critical Pairing
Artificial intelligence (AI) is making headlines everywhere, offering a range of capabilities, including location and motion awareness — determining whether a user is sitting, walking, running or...