Showing 1105-1116 of 2675
Blog
SEMI Invites Industry Stakeholders to Join New Semiconductor Climate Consortium as Founding Members
In a drive to bring together the semiconductor value chain to address climate challenges, SEMI welcomes members and other industry stakeholders to join the Semiconductor Climate Consortium...
Blog
FLEX 2022 Highlights Additive Techniques for Flexible Hybrid Electronics Packaging and Integration with Human Body
Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component...
Blog
Celebrating National Hispanic Heritage Month – Diverse Voices in the Microelectronics Industry
Recruit outside the box. This is the simple advice Arianna Avellán Jaramillo would give to industry leaders and recruiters on how to increase diversity in the microelectronics industry. Avellán...
SEMI Press Release
Mark Templeton Inducted into Phil Kaufman Hall of Fame by the ESD Alliance and IEEE CEDA
Templeton Recognized Posthumously for Technical and Business Innovation
MILPITAS, CALIF. –– October 3, 2022 –– Mark Templeton, the former managing director of investment firm Scientific...
SEMI Press Release
Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA
EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions
MILPITAS, Calif. –– September 28, 2022 ––...
Member Press Release
PEER Group to showcase expertise at APCSM 2022
Kitchener, Ontario, September 27, 2022 – PEER Group®, the largest supplier of innovative factory automation software products, is a proud sponsor and participant at this year’s Advanced Process...
Blog
Adding More Data Isn't the Only Way to Improve AI
Artificial Intelligence (AI) has the potential to transform society and business in the 21st century. AI has already been deployed to in smart homes, online shopping, natural language processing...
SEMI Press Release
SEMICON Europa 2022 to Highlight Smart Mobility, Smart MedTech, Advanced Packaging, Fab Management, Materials, Sustainability and Talent
MUNICH, Germany ─ September 27, 2022 ─ Innovations in advanced technologies such as Smart Mobility, Smart MedTech, advanced packaging, fab management, materials, and other semiconductor industry...
SEMI Press Release
SEMI and AVCC Team to Promote Autonomous Vehicle Innovation and Mass Market Adoption
SAN JOSE and MILPITAS, Calif. — September 27, 2022 — The Autonomous Vehicle Computing Consortium (AVCC), a global group of automotive and technology industry leaders cooperating on expediting the...
Blog
Welcome to Newest SEMI Americas Members!
The more than 2,500 SEMI member companies worldwide advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design,...
Blog
SEMI Smart Manufacturing Initiative Works to Help Chip Industry Achieve Industry 4.0 Ambitions
The global semiconductor industry is poised to become a $1 trillion industry by 2030. Semiconductor sales and capital spending are expected to grow substantially in the coming decade with many new...
Member Press Release
Chipletz Selects Xpeedic’s Metis Tool for its Smart Substrate Products
Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic (EM) simulation tool for Chipletz’s soon-to-be released...