Discover how other semiconductor companies center climate and social impact during Earth Month. Explore the transformative potential of employee initiatives in enhancing environmental sustainability, employee-driven climate action, equity, and advancing their goals with this webinar recorded April 19, 2024. You will find great ideas for using in your company to build employee morale and bond over taking action to protect, clean and plan for a cleaner, healthier tomorrow.
During the first-ever SEMI Earth Month Lightning Talks, organized by the Climate Equity and Social Impact (CESI) working group. speakers from across our industry presented on the initiatives and achievements of ESG innovation, and employee impact. They discussed new climate equity activities, with some great technology innovation thrown in.
Earth Month Lightning Talks for the Semiconductor Industry
9:00 am - 10:00 am
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The Department of Defense needs non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath. Currently, fieldable instruments for gas analysis are large (>0.5 cubic feet), expensive (>$50,000), and slow. Hand-held devices are limited to identification of specific targets such as nitrogen oxide, oxygen, and carbon dioxide or generalized estimated concentration of total volatile organic compounds (VOCs). Biohybrid sensing involves combining biological sensory elements with electronic components in a SWaP-C solution for fast and accurate detection of VOCs. Unprecedented VOC sensing potential lies within the biological sense of olfaction, which boasts rapid, selective, and sensitive capability to identify hundreds of thousands of compounds in complex environments. However, there are currently no commercially available devices harnessing the capability of olfaction due to the challenges in the bioelectronic interfacing necessary for maintaining long-term stability and environmental conditions necessary to sustain olfactory signaling elements (whether it be at the organ-, cell-, or protein-level). This course will provide an overview of the current state of biohybrid VOC sensing comparing and contrasting examples utilizing olfactory organ/tissue-based, cell-based, and protein-based modalities.
ABOUT THE SPEAKER
Dr. Elisabeth Steele is a biomedical engineer at Blue Halo serving as a Lead Scientist and Team Lead supporting sensor development at the Air Force Research Laboratory (AFRL). Her expertise is in neural tissue engineering and electrophysiology with recent focus in the design and testing of biohybrid gas sensors inspired by insect olfaction. Dr. Steel conducted neuromodulation research as a post-doctoral fellow with Dr. Tim Bruns at the University of Michigan. Additionally, she served as a Technical Sales Engineer with NeuroNexus Technologies, the industry leader in microelectrode array technology for neuroscience electrophysiology applications. She received her PhD (2018) and M.S. (2013) in Biomedical Engineering from Wayne State University in Detroit, Michigan. She completed her B.S. in Bioengineering in 2007 from University of Toledo.
This webinar features Dr. Elisabeth Steele of UES covering the status of non-linear advances in gas-phase sensing to identify chemical threats, toxic industrial compounds, and physiological changes present in human breath.
Biohybrid Sensing Systems for Volatile Organic Compounds
Flexible Electronics Master Class #18
10:00 am - 12:00 pm
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Convention Hall 2, 3F, Suwon Convention Center Suwon-si Gyeonggi-do South Korea
10:00 am
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10:05 am
HD Cho
President
SEMI Korea
Welcome
10:05 am
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10:35 am
Seong Tae Oh
Fellow
TEL
Process Technologies for Continuous Scaling of Logic Devices
The rapid growth of AI, big data, IoT, and 5/6G communication necessitates the sophisticated computing power and efficiency of semiconductor devices, driving demand for various components such as HPC, GPU, ASIC, FPGA, and HBM. Semiconductor device and equipment industries are also challenging various new technologies to accommodate such diversifying applications and proceed with sustainable development in the era of AI and ICT.
According to the roadmap over the next 10 years, semiconductor technologies are expected to develop into the scaling technologies to further extend the existing Moore's Law and hybrid device technologies that integrate legacy nodes and advanced nodes into one. Therefore, in this presentation, we will look at the latest logic technology roadmap and introduce new process technologies to implement it.
Materials innovation within the Semiconductor industry has been a driving force since the planar 2D MOSFET to the current 3D gate-all-around (GAA) transistor architectures and will continue its criticality as we embark on 500-layer flash memory designs and Angstrom level critical interconnect dimensions. To achieve these once incomprehensible levels of lateral and vertical scaling, device design engineers and manufacturers are increasingly relying on disruptive materials innovation to enable the density and performance gains required at each successive technology node. As the performance requirements for the most advanced devices become more challenging, materials have shown to have an increased contribution to device performance over scaling and design. This has led to a greater portion of the periodic table being incorporated into semiconductor processing.
The integration of new materials, such as novel photoresists, interconnect metals & alloys, ultra-pure polymers, chemically modified polymer membranes, and formulated chemicals, into the chip fabrication increases process complexity and makes yield ramps more challenging. With more process steps in the overall device build, speed to yield and process integrity are more critical than ever to achieve technology qualification schedules. This presentation will focus on Entegris’ approach to materials innovation, the integration of these novel materials coupled with co-optimized solutions enabling industry technology roadmaps and yield requirements while preserving integrity of delivery and process control.
Advanced Packaging Materials and Evaluation Platform at Resonac
Resonac has started Packaging Solution Center as new R&D center to propose one-stop solution for customers in 2018 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package in October, 2021.
2.xD and 3D packages require to connect chips and components in high density, therefore, both wiring pitch and vertical interconnect dimension must be finer and finer. At the same time, in order to achieve better performance, more and more chips are integrated together and thus the package size is increasing. To meet these requirement, we are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large 2.5D advanced package.
The presentation will cover the significance and strengths of JOINT2, and updates on research and development.
EUV lithography infrastructure has become the critical element of semiconductor industry to enable the device scaling down. It consists of not only light source, optical system but also masks, photoresist. The EUV stochastic effects present challenges to optimizing EUV resist resolution, line edge roughness, and sensitivity simultaneously. To overcome these challenges, Lam introduced the new dry resist combined with the new dry development technology.
Lam’s EUV dry resist, coupled with ASML’s EUV scanners and Lam’s holistic patterning solutions, will extend the patterning roadmap (Moore’s Law) for the next 10 years and beyond by offering a high-resolution, high-fidelity, defectivity-free, and greener solution for ≤32nm pitch L/S, and ≤40nm pitch pillar and contact hole EUV patterning in the fab. EUV dry resist technology also has been validated demonstrating superior dose-to-defectivity for <32nm pitch L/S, well suited for logic applications. Lam’s EUV dry resist is uniquely suited for future HiNA EUV patterning thanks to robust resist thickness scaling while maintaining high etch selectivity and high contrast.
Sustainability Challenges of the Semiconductor Industry
As demand for chips surge, the semiconductor industry is struggling to reduce its environmental footprint. While the environmental impacts of semiconductor (and electronic products that depend on them) have mostly been liked to ‘manufacturing’ and ‘use’ phases of products which consume a significant amount of water and energy, the attention is shifting to the 'material extraction’ and ‘end-of-use’ phases of products following concerns over the e-waste issue. In this presentation, I will focus on the latest findings of the global e-waste challenge, what this means from the materials perspective, and its implications to product design and manufacturing. I will also introduce SK hynix's strategy and targets towards improving the circularity of products, and our partnership with customers/vendors to achieve a common goal.
2:55 pm
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3:20 pm
Eunho Sohn
Head of Interface Materials and Chemical Engineering Research Center
KRICT
Trends in Regulation of PFASs (per- and polyfluoroalkyl substances) and Technological Development Strategies
Fluorine compounds exhibit exceptional physical properties that set them apart from other organic materials. Consequently, they have been utilized as core materials to enhance the functionality, performance, and value of products across various key industries including electrical and electronics, semiconductors, displays, and automobiles.
However, on March 22nd of last year, the European Chemicals Agency (ECHA) issued a report imposing restrictions on the usage of over 10,000 types of per- and polyfluoroalkyl substances (PFASs) across all industries, sparking significant upheaval within the sector.
In this presentation, we will learn in detail about the definition of PFAS, and the content, progress, and schedule of PFAS regulations in Europe and the United States, and contemplate the direction of future technology development.
Sustainability Opportunities for A Diverse and Secure Fluorinated Material Supply Chain
As semiconductors become more advanced and the fabrication processing conditions more extreme, the essentiality of a sustainable and secure fluorinated material supply chain plays a vital role in the future of semiconductor manufacturing. The principles of developing this supply chain are directly aligned to support the sustainability and emission roadmaps of the semiconductor industry. Syensqo will introduce the following content:
1) Priorities when Specifying Materials for a Sustainable Supply Chain
2) The Key to Sustainability - Application Segmentation
3) Case Studies
Innovating Safe and Sustainable by Design: Strategies and Steps toward Reduction of Substances of Concern in Photolithography Materials
Growing scientific evidences suggest that certain per- and polyfluoroalkyl substances (PFAS) pose global environmental and health risks. In response, global governments are contemplating measures to limit the use of these chemicals in various industries. However, specific types of PFAS are indispensable and no substitutes are currently available for most chip manufacturing applications in the semiconductor industry. Aligned with the objective of Safer and Sustainable by Design, DuPont has launched a comprehensive program to reduce PFAS usage in photoresist and associated lithography materials. In this presentation, we will provide an overview of DuPont's innovative initiatives and technical challenges encountered in this endeavor.
CORBION: PURASOLV® ELECT for a more Sustainable Semiconductor Manufacturing
Solvents are used extensively in the semiconductor manufacturing process. Solvents are estimated to be responsible for around 7% of the Scope 3 emissions of the semiconductor industry. The typical solvents that are used are produced from fossil resources and with that not in line with net zero ambitions. For more than 20 years Corbion has been supplying biobased ethyl lactate to the semiconductor industry under it’s brand name PURASOLV® ELECT, meeting the stringent requirements of the industry. Typical applications are photoresist for i/g-line / KrF / ArF / EUV, RRC, Edge bead removal and as thinner. Biobased ethyl lactate is sustainable and safe by design: it is produced from renewable resources, non-toxic and safe to workers, biodegradable and offers a significant carbon footprint reduction compared to incumbent solvents. Switching to biobased ethyl lactate thus enables more sustainable semiconductor manufacturing.
Technology and Future of Semiconductor Packaging Materials
The technological advancement of semiconductor materials is a key factor along with the technological advancement of the process. And recently, the importance of Advanced PKG is increasing, and SK Hynix has achieved the result of improving product performance by developing MR-MUF materials. This proves the importance of materials. In the future, there are more packaging challenges for high-speed memory products such as HBM, and I plan to announce Need for material development to satisfy them.
Executive Vice President and Head of Material Development Team
Samsung Electronics
Big Challenges for Small Worlds
The number of transistors in semiconductor chip has been increased twice every two years for more than 50 years, following the famous Moore’s Law and somehow, it was taken to be granted. In reality, it was a big accomplishment with an unimaginable amount of efforts and collaborations, including the development of new materials.
New material has been developed and introduced to improve the performance and capacity of electronic devices through smaller design rules. New Photo Resists (PR) for higher resolution with smaller defects and higher uniformity were developed. And Precursors were also developed to meet the process challenges for the smaller design rules, such as higher aspect ratios. High etch selective Etchant and CMP Slurry with low scratch were requested. And the requirements in new materials are getting tougher and stronger with the evolution of AI, which needs more computing power than ever. Even materials that has never been expected in industry and has been studied only in academia are being actively considered.
Even the worse, the surrounding situation for material development and manufacturing is getting tougher. Environmental regulations are getting tighter. Gases with high global warming potential were begun to be replaced. Recently, EU announced banning PFAS materials in near future and US raised bars for PFAS materials. And carbon zero policy is coming to us slowly but firmly.
In this talk, we will discuss the current status and future direction of material research. We will discuss the development directions to improve the performance of devices and to consider environmental regulations. And we will discuss the virtue of working together as a big one-team to overcome all the obstacles mentioned above in the world of extreme technology.
Currently, sustainablility and efficiency of global supply chains are becoming more critical to the semiconductor industry. Global political tensions are affecting the semiconductor market, which is further revealing the vulnerabilities of the supply chain. In addition, ongoing environmental regulations are also having an increasing impact on the industry. The growing demand for eco-friendly products and manufacturing processes puts companies under pressure to introduce innovative technologies and solutions along with this regulatory compliance. These trends present new challenges and opportunities for the semiconductor industry. SMC Korea reflects these issues and discusses current market conditions and future prospects. Through this conference, we expect major companies and experts will be able to share their experiences and knowledge, find innovative solutions together, and explore the future of the industry together. Don't miss these up-to-date discussions presented by global experts.
SMC (Strategic Materials Conference) Korea 2024
May 29(Wed), 2024 | Convention Hall 2, 3F, Suwon Convention Center
10:00 am - 6:30 pm
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Add to Calendar2024-05-29 10:00:002024-05-29 18:30:00SMC Korea 2024Materials Resilience: Navigating Challenges, Embracing OpportunitiesCurrently, sustainablility and efficiency of global supply chains are becoming more critical to the semiconductor industry. Global political tensions are affecting the semiconductor market, which is further revealing the vulnerabilities of the supply chain. In addition, ongoing environmental regulations are also having an increasing impact on the industry. The growing demand for eco-friendly products and manufacturing processes puts companies under pressure to introduce innovative technologies and solutions along with this regulatory compliance.These trends present new challenges and opportunities for the semiconductor industry. SMC Korea reflects these issues and discusses current market conditions and future prospects. Through this conference, we expect major companies and experts will be able to share their experiences and knowledge, find innovative solutions together, and explore the future of the industry together. Don't miss these up-to-date discussions presented by global experts.Convention Hall 2, 3F, Suwon Convention Center Suwon-si Gyeonggi-do South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
Enabling PiezoMEMS applications for today and tomorrow
Arjen Janssens, Senior Director PLD, Lam Research Corporation
Arjen Janssens initially worked on Pulsed Laser Deposition (PLD) during his Master’s Degree in Applied Physics at the University of Twente in 2001, and then during his internship at Stanford University on superconducting thin films.
Arjen started his career as a strategic consultant at Arthur D. Little, and after a year become a shareholder and consultant of Quintel Management Consultancy (spin-out of Arthur D. Little). In 2004 he started studying for his PhD. at the University of Twente, focusing on depositing Piezo materials with PLD. During his PhD, he completed the Executive MBA at TSM Business School of Technology, and co-founded Solmates. Currently Arjen is Senior Director PLD at Lam Research and is very proud of how the PLD technology has matured into a high-volume production system at Lam.
MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.
Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.
In this webinar, discover Lam Research’s solution– a pioneering approach to thin film deposition.
8:00 am - 9:00 am
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Add to Calendar2024-03-27 08:00:002024-03-27 09:00:00Enabling PiezoMEMS applications for today and tomorrowAnd yes, we’ve got a solution for that.MEMS devices have become well established as critical components in a wide range of everyday applications. Accelerometers and gyroscopes improve safety in automotive applications, RF filters enable wireless connectivity in mobile phones, and MEMS microphones are at the heart of voice control technologies that connect us to an ever-increasing range of smart, consumer products.Developers are now looking to the next generation of MEMS devices that will enable new applications and improve the performance of existing solutions. Capacitive based MEMS devices have proven to be highly successful, but after significant improvements of both design and manufacturing it is becoming increasingly difficult to improve their performance. To overcome this challenge, designers are looking to Piezoelectric based MEMS devices that can offer a paradigm shift in capability.In this webinar, discover Lam Research’s solution– a pioneering approach to thin film deposition.United StatesSEMI.org[email protected]America/Los_Angelespublic
SiC—Silicon Carbide Webinar #3: Bidirectional SiC and GaN Switch Technology
There are numerous mass volume power applications where it is necessary to control the flow of bidirectional power, including electric vehicles (vehicle to grid, vehicle to home, and vehicle to vehicle), distributed and grid-tie power systems using regenerated energy and/or energy storage components, and solid-state circuit breaker protection. Silicon carbide (SiC) and gallium nitride (GaN) based bidirectional power switches can enable these applications with their compelling advantages of high efficiency, high blocking voltage capability, and low system weight and volume. In particular, monolithic switches that allow for bidirectional symmetric conduction and voltage blocking with a chip area close to that of a similarly rated unidirectional switch are ideally suited to fuel a revolution in power electronics technology. Today, monolithic bidirectional (MBD) power semiconductor switches are not commercially available. Instead, back-to-back (anti-series) connection schemes of unidirectional power MOSFETs or IGBTs are typically used, resulting in a 4X penalty in chip area and high cost. However, various types of SiC and GaN bidirectional concepts are being investigated including bonded-wafer bidirectional IGBTs, monolithic dual-gate bidirectional GaN switches, and monolithic back-to-back connected SiC MOSFETs and JFETs.
In this presentation, the semiconductor technology of SiC and GaN bidirectional switches will be reviewed including their operating principles, and their lateral and vertical geometry configurations. The performance advantages of MBD switches will be highlighted. Promising MBD devices reported to date will be analyzed, and the key bidirectional switch applications of solid-state circuit breakers and current-source-inverters will be discussed. As SiC and GaN devices approach mass commercialization propelled by insertion in electric vehicles and consumer electronics, respectively, fabrication of SiC/GaN MBD switches is becoming economically viable enabling their wide adoption in key volume applications.
View other webinars in the SiC Series
Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
Webinar #3—Bidirectional SiC and GaN Switch Technology
Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
Join us online for the third webinar in the Silicon Carbide Series as we review the semiconductor technology of SiC and GaN bidrectional switches, analyze promising MBD devices, and discuss the key bidrectional switch applications of solid-state circuit breakers and current-source-inverters.
SiC—Silicon Carbide Webinar Series
Webinar #3: Bidirectional SiC and GaN Switch Technology
February 21, 2023
9:00-10:00 AM Pacific Time
9:00 am - 10:00 am
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Day 1: 8:30 am - 5:30 pm PT Day 2: 8:30 am - 12:30 pm PT
Registration will be closed at 12:00am on May 7.
Learning Objectives:
Gain a comprehensive understanding of the semiconductor industry and the manufacturing process, design and eco-system of the semiconductor industry and understand the jargon, tools, and materials used in the design and fabrication of an IC
Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals
Who Should Attend:
New personnel entering the field
Any one wanting an understanding of semiconductor manufacturing
Course Topics:
Basic electronics and microelectronics terms and definitions
Microelectronics and the role of integrated circuits
Define process nodes : explanation of process nodes and how they relate to device performance and cost
Device physics and transistor operation: understanding of the physical principles behind device operation and the functioning of transistors
Crystal growth and wafer prep: overview of crystal growth techniques used in semiconductor manufacturing
Explanation of wafer preparation techniques and materials used
FDSOI, fin fets, gate all around (GAA) transistors
Circuit design and layout
Mask making techniques and materials used in lithography
Clean rooms
Lithographic techniques
Plasma etch, wet etch and cleaning processes
Ion implantation
Diffusion techniques
RTP, CVD, ALD, ALE techniques and their impact on device performance
The purpose of this course will provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit (IC). The course is designed for new personnel entering the field or individuals who are looking for a well-rounded understanding of all the jargon, tools, and materials used in the IC manufacturing process.
Limited time offer!
Members: $1295 $1195
Non-members: $1495 $1395
Students/Veterans: $1195 $1095
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] * Coffee, refreshments, and lunch will be provided for all attendees, ensuring a satisfying and energizing experience throughout the day.
Overview of Semiconductor Manufacturing
In-person training
Location: Milpitas, CA
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Add to Calendar2024-05-08 00:00:002024-05-09 00:00:00Overview of Semiconductor ManufacturingThe purpose of this course will provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit (IC). The course is designed for new personnel entering the field or individuals who are looking for a well-rounded understanding of all the jargon, tools, and materials used in the IC manufacturing process.Limited time offer!Members: $1295 $1195Non-members: $1495 $1395Students/Veterans: $1195 $1095* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]* Coffee, refreshments, and lunch will be provided for all attendees, ensuring a satisfying and energizing experience throughout the day.SEMI Headquarters 673 S Milpitas Blvd Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_AngelespublicRegister Today
SEMI University celebrates its first anniversary! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.
Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "SEMI University - Introduction and 2024 Roadmap." This webinar promises to be an informative session where you'll gain insights into the latest updates, exciting live trainings, new certifications, and courses offered by SEMI U in 2024.
During this webinar, you can expect to:
Discover the latest updates and enhancements to SEMI U's course catalog.
Learn about the exciting live, in-person training courses scheduled for spring of 2024.
Get insights into new certifications and courses designed to keep you ahead in the industry.
Gain access to a special 10% discount on ALL courses.
Join us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses.
SEMI University - Introduction and 2024 Roadmap
Discover upcoming certifications, in-person trainings and new courses from SEMI University!
Webinar
March 19, 2024
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Add to Calendar2024-03-19 00:00:002024-03-19 00:00:00SEMI University - Introduction and 2024 RoadmapJoin us to discover our current course offerings, upcoming additions, new certifications, and more! Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all our courses.United StatesSEMI.org[email protected]America/Los_Angelespublic
The healthcare industry has transformed over the last twenty-five years due to the co-development of diagnostics along with state-of-the-art therapeutics and treatments; notably, this has led to the field of companion diagnostics. The best example of this is the prescribed use of insulin based on glucose levels monitored via test strips or the continuous glucose monitor. The future goal of medicine is to have truly personalized treatment protocols based on an individual’s biometrics, physiology, and exposure.
However, this goal requires further identification and quantitation of biomarkers and health exposures, both biological and chemical, both at the point-of-care as well as in real-time. Therefore, technologies are needed that can miniaturize current diagnostics to make them inexpensive, simple-to-use, and ideally wearable.
However, where and what to sense remains a critical question to solve, as each biofluid, including blood, sweat, saliva, tears, breath, and exhaled breath condensate contains a different profile of biomarkers. Additionally, biomarkers have vastly different physiochemical properties and abundances, which present different challenges as well as require a range of sensing modalities. Therefore, this course will be an overview of the “What, Where, and How of Sensing to Meet Current and Future MedTech Needs”. At the end of the course, a perspective of where these technologies can impact the future of health outcomes will be presented as well as key considerations for future technologies to gain commercial acceptance
ABOUT THE SPEAKER
Dr. Michael Brothers, PMP currently is a Principal Scientist and Technical Program Manager at UES, a Blue Halo Company. In these roles, Dr. Brothers supervises contractors executing research to identify biomarkers indicative of human performance, develop novel sensors, as well as field research. Dr. Brothers also serves as a subject matter expert on biochemical sensors, both in the liquid phase and gas phase, for the 711th Human Performance Wing at Wright Patterson Air Force Base.
Notably, Dr. Brothers has co-authored multiple publications and patents on using novel sensing modalities to sense in complex fluids and environments, including jet fuel, sweat, saliva, and breath. Dr. Brothers has also served as the Principal Investigator on sensor development efforts for both optical based gas sensors and flexible, ink-printed gas sensors for wearable applications.
Dr. Brothers has his Ph.D. from the University of Illinois Urbana-Champaign in Chemical Biology and his B.S. in Chemistry and Biology from the University of Cincinnati.
This webinar featured Dr. Michael Brothers of UES, a Blue Halo Company, outlining the status of personalized medical treatment protocols based on an individual’s biometrics, physiology, and exposure. This course will be an overview of the “What, Where, and How of Sensing to Meet Current and Future MedTech Needs"
Perspectives on Biosensor Applications
Flexible Electronics Master Class #17
10:00 am - 12:00 pm
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- Low-SWaP-C, GPS-free PNT technology
- Novel materials, fabrication & packaging techniques and approaches
- Advancements in atomic clock and quantum sensor photonics
3:00 pm
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4:30 pm
Break Out Sessions
Thrust Area 1: Novel Materials, Fabrication, and Packaging Techniques for Low-SWaP Inertial and PNT Sensors
Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, & PNT Sensors
Thrust Area 3: Advancements Towards Low-SWaP, GPS-Free PNT Technologies
SEMI MSIG has another $5M in R&D funding for sensor positioning, navigation, and timing (PNT) technology development! Register now to attend our half-day Gap Analysis workshop, taking place April 30, the afternoon before our premier sensor technology-event, the MEMS & Sensors Technical Congress (MSTC). Meet US Gov’t subject matter experts (SME’s) to discuss PNT pain points and get insights into this year’s request for proposals (RFP).
The workshop will feature presentations from the new 2024 PNT projects and identify areas for this year’s RFP.
Have your voice heard, as SEMI MSIG and the Army Research Lab work to fund PNT R&D technology improvements in a 5-year (2022-2027) $25M program. This gap analysis workshop is a critical component of the program’s 2nd year activities.
SEMI MSIG PNT Gap Analysis Workshop
Learn About Phase 2 of the Positioning, Navigation and Timing (PNT) Funding Program
1:00 pm - 5:00 pm
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Hotel
Cambridge hotels are expensive in late May, so we have made a deal for you, click here!
We have a room block reserved at DoubleTree Suites by Hilton Hotel Boston, Cambridge for May 21, 2023 through May 25, 2023. Booking your room is simple, just select "Book a Room" to receive your group's preferred rate. Must book rooms before May 12th to obtain discounted rate.
Please book your hotel reservations online for MSTC 2023 Conference or guests can call our 24-7 reservations desk to book your room or please ask for the Front Desk and then provide the Group Code: MSTC
