9:00 am - 5:30 pm
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Add to Calendar2021-09-28 09:00:002021-09-28 17:30:00BIPV TASK FORCE MEETINGBIPV TASK FORCE MEETING
光伏建筑一体化（BIPV）屋顶抗风揭试验方法标准交流会ChinaSEMI.org[email protected]America/Los_Angelespublic
10:00 am - 11:30 am
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Add to Calendar2021-09-17 10:00:002021-09-17 11:30:004H-SiC Homoepitaxial Wafer Task Force Meeting 会议邀请：4H-SiC同质外延片工作组线上会议
4H-SiC Homoepitaxial Wafer Task Force Meeting
Meeting：Link
Friday, September 17, 2021
10:00-11:30ChinaSEMI.org[email protected]America/Los_Angelespublic
Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design? These continue to emerge in parallel to ever shrinking semiconductor device geometries.
While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes.
It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.
Join us for this session for speakers and discussion on tackling some of these industry challenges.
Virtual United States
7:30 am
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7:35 am
Paul Trio
Senior Manager, Strategic Initiatives
SEMI
Welcome
7:35 am
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7:55 am
Archita Sengupta
Sr. Technologist
Intel
IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools
New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
Join us for this webinar-like session to discuss best-known methods from industry leaders
Challenges in Metrology & Analysis for Next Gen Semiconductor Industry
7:30 am - 10:00 am
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America/Los_Angeles
Electromechanical evaluation of printed interconnects
Additive manufacturing of resistors and capacitors
Highly stretchable conductors
Interconnecting in the z direction - printed vias
Printed RF devices and antennas
Device and component placement and assembly
Thinned semiconductor devices
Approaches to bond devices and components to flexible substrates
Concepts of operation and evaluation of performance and reliability
Applications to medical and industrial sensors will be incorporated throughout
About the Instructor
Mark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton. He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex. He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus.
His research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics. He is the recipient of the SUNY Chancellor’s Award for Excellence in Research.
He received SEMI FLEXI awards for leadership in Technology and Education in 2009 and 2019. He has authored over one hundred fifty technical papers and holds forty-eight US patents. He was the General Chair of the 69th IEEE ECTC and serves as a IEEE Electronics Packaging Society (EPS) Distinguished Lecturer and an elected member of the IEEE EPS Board of Governors.
This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products. Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.
This course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.
Optimizing Design and Fabrication of FHE for Medical and Industrial Applications
ON DEMAND
10:00 am - 12:00 pm
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America/Los_Angeles
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
4:15 pm - 4:35 pm
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Add to Calendar2021-09-23 16:15:002021-09-23 16:35:00Session 1: Ultra Wide Band Gap Wafer and Heat Sink Diamond SubstratesSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
Speaker: Xing Zhang, CEO of Compound Semiconductor Manufacturing（Xiamen) Co., Ltd
Thursday, September 23, 2021
16:30-17:00
Wuhu, Anhui, China
Webinar Link: Click here
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509ChinaSEMI.org[email protected]America/Los_Angelespublic
Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and Lidar
4:35 pm - 5:00 pm
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Add to Calendar2021-09-23 16:35:002021-09-23 17:00:00Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and LidarSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and Lidar
Speaker: Qingwei Mo, Chief scientist of ZJEAGLE.Co., Ltd
Thursday, September 23, 2021
16:35-17:00
Wuhu, Anhui, China
Webinar Link: Click here
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509ChinaSEMI.org[email protected]America/Los_Angelespublic
Mark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton. He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex. He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus. 
