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Registration

Registration Fee

  • Member: $199
  • Non-Member: $299
  • Non-Member for Government, Military, and Academia: $249
    • Contact Michelle Fabiano at [email protected] for discount code. Must have a valid .gov, .mil or .edu email address.

Group Registrations

  • Register 5: 20% discount
  • Register 10: 25% discount
  • Register 15: 30% discount

For group discounts, contact Michelle Fabiano at [email protected] 

Late registrations may result in delayed conference access.
We recommend registering at least 10 minutes before the event to allow enough time for the system to process your registration, in order to access the first session on time.

Cancellations received on or before September 21, 2020 will be fully refunded (less $30 cancellation fee).

Michelle Fabiano 
[email protected] 

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Sponsorship Contact

Eric Rude
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047 
Email: [email protected]

Virtual MSEC 2020 Event Guide

Virtual MSEC 2020 Event Guide Cover


The Next Wave of Sensorization: Solving Our Shared Challenges

Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key technologies and markets in the areas of medical, sensors for entertainment and augmented reality, virtual reality, environmental, food/agriculture, ultrasonic applications, and wearable devices will be explored. The growth in existing and emerging MEMS and sensors markets, together with the resulting new components, software, and systems needs, will also be discussed. 

Take advantage of MSEC 2020 as a Virtual Event. Although we will not meet in person this year, it may be the only time you'll get this amazing content at a fraction of the cost.

  • SAVE $1,500+ attending the Virtual Event. Registration is only $199 Member / $299 Non-Member.
  • HEAR industry experts and connect virtually with executives in the comfort of your office or home.
  • ACCESS the presentations On-Demand 24/7 until November 15, 2020.
  • MINUS all the travel time and expenses!

Key Session Topics

  • October 6 » Session 1—Sensors for Entertainment & Augmented Reality
  • October 7 » Session 2—Emerging Business Strategies
  • October 8 » Session 3—Business Strategies & Opportunities in 2020
     
  • October 13 » Session 4—Emerging Technologies & Manufacturing Trends
  • October 14 » Session 5—Product Showdown: Ultrasonic Transducers
  • October 15 » Session 6—Market Trends
     

Join [LIVE] at 8-10:30am PDT from October 6-8 and 13-15, 2020 to watch all presentations.
Most are available On-Demand. Some are only available during [LIVE] stream (e.g. Disney Keynote).

 

Who Should Attend?

CEO  ●  Chairmen  ●  Presidents  ●  Senior Executives  ●  Executive Vice Presidents  ●  CTO  ●  Startup Founders  ●  Financial Analysts  ●  Market Researchers  ●  Consulting Firms


2020 MSEC Executive Planning Committee

Speaker Resource Center

United States

Wednesday, October 7, 2020 | MSEC Session 2—Emerging Business Strategies

8:00 am - 8:05 am
Ian Chen, Maxim Integrated
Ian Chen
Executive Director, Medical New Business Development, Maxim Integrated

Welcome/Session Chair

8:05 am - 8:30 am
Andreas Breiter, McKinsey
Andreas Breiter, PhD
Partner, McKinsey & Company

Future Mobility Enabled by Sensorization

Biography

Disruptions from technology trends are shaping the mobility of the future. We will discuss our perspective on the role of sensorization (future) mobility, and the supply chain impact for the semiconductor sector.

8:30 am - 8:55 am
Dimitrios Damianos, Yole Développement
Dimitrios Damianos, PhD
Technology and Market Analyst, Imaging & MEMS, Yole Développement

MEMS Tug-of-War: COVID-19 vs Emerging Trends

Biography

From the smartphones and cars we daily use, to the airplanes we occasionally take, MEMS’ reach is ever-expanding. Wearables are becoming increasingly sensitive, packing more inertial sensors and microphones. The popularity of voice personal assistants (VPA) like Siri, Alexa, etc have pushed audio technologies into new systems that are adopting VPA as a new human-machine interface and MEMS microphones are playing a vital role in this business. And the list keeps getting longer.
Covid-19 is continuously making headlines on its negative effects on markets and the economy, and of course the MEMS market is no different. However, there are some MEMS devices that have gained a lot of attention and experienced a spike in demand, because they help in the combat against the pandemic.

In this presentation, we will address these key elements. Furthermore, we will show the latest market data and MEMS ecosystem, and we will explore emerging market and technology trends, focusing on how the sensor manufacturers can squeeze out more value, overcoming current challenges.

8:55 am - 9:25 am

Networking with Sponsors

9:25 am - 9:50 am
Manuel Tagliavini, Omdia
Manuel Tagliavini
Principal Analyst, MEMS & Sensors, Omdia

MEMS & Sensors Market: The Effects of the 2020 Pandemic

Biography
Sensors are found today in a wide range of end applications, spreading from Consumer Electronics & Mobile to Industrial and Automotive, resulting in a sensor market in a good health overall. Even if sensor adoption in Consumer and Mobile applications can quickly skyrocket and then fade, the market is still growing and often reshaping and renewing itself. While Smartphones still represent a huge market, commoditization has left it saturated in value terms and growth is still relevant with the proliferation of multiple image sensors and at the same time it has recently moved to other accessories like smart watches or wireless earbuds from leading suppliers like Apple. Other mainstays like Automotive and Industry on the other hand are subject to longer term trends like Electrification and Robotization of the Car, as well as Smart Manufacturing, Big Data and Condition Monitoring. The presentation looks at the impacts of the major market changes on MEMS and other silicon sensors, focusing on the effects of the Covid-19 pandemic on the sensor shipments and end products forecasts. Which are the sensor families most affected by the lockdowns implemented in several countries worldwide? Are the major effects caused by disruptions in the supply chains or by unexpected changes in the end product demand? Insights and examples of resilience and required market changes will be provided, with predictions of the opportunities for the years ahead.

9:50 am - 10:30 am

Networking with Sponsors

MSIG

Virtual MSEC—Conference Overview

The MEMS and Sensors Executive Conference is designed for senior executives across the MEMS and sensors supply chain and adjacent industries. 

Join us online for Session 2—Emerging Business Strategies

8:00 am - 10:30 am Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration

webinar

Open to all — FREE.

Not able to attend? Register anyway. We'll send you a link to the webinar archive so you can view it at your own convenience.

 

webinar
United States Save Your Seat SEMI CSP Back to Work Session 2 Business Executive

The U.S. Department of Commerce issued a new rule for shipments destined for China, Russia or Venezuela, which enables it to more closely monitor exports, re-exports and in-country transfers of certain items. The rule broadens the scope of export-controlled items to include electronic and telecommunications equipment (i.e. PC’s, mobile devices and similar items), even if there is no military end use. In this webinar, DHL will explain how companies can comply with the new rule and answer questions about international shipping.

United States

10:00 am - 10:05 am
Darryl Buck
MODERATOR
Darryl Buck
Head of SEMI’s Cost Saving Program, Group Purchasing Solutions (GPS)

Opening Remarks

10:05 am - 10:20 am
Caroline Cunningham
Caroline Cunningham
Director of Strategic Sales, DHL

Biography: Caroline Cunningham has 23 years of International Shipping Experience with DHL Express, she originally started her career in the UK supporting a diverse customer base but since then has moved internationally with DHL two times. Her first move was to Belgium and she covered 23 countries as the European Sales Training Manager, she moved to the US 14 years ago to head up International Training in US but is now based in UT where she supports Strategic Partners like England Logistics in selling DHL Express to their end customers. Caroline has a passion for making customers more successful and is looking forward to speaking to our industry to provide us with a better understanding of Export Compliance to help expedite your shipments with speed.

DHL
10:20 am - 10:25 am
Sharon McWilliams
Sharon McWilliams
Agent / Sales Manager, England Logistics

Biography: Sharon McWilliams is an agent and sales manager with England Logistics. She has been in the transportation industry for 13 years helping businesses minimize transportation related costs to increase their market competitiveness. Sharon’s committed personalized service helps companies manage their transportation programs. Her alliances with the transportation industry's most elite carriers, including DHL and FedEx ensure that her customers receive the best service available.

England Logistics
10:25 am - 10:30 am

Q&A

FOA
semi logo
10:00 am - 10:30 am Off Add to Calendar 2020-09-15 10:00:00 2020-09-15 10:30:00 Navigating New International Shipping Rules – SEMI CSP Back to Work Session 2 United States SEMI.org [email protected] America/Los_Angeles public
Event format

Registration

Registration

Pre-registration period: Sep 1 (Tue) - Oct 15 (Tue), 2020

Registration fee

  • SEMI members / Student: KRW 250,000
  • Non-members: KRW 300,000

 

Registration
South Korea Square-banner(1000-1000).jpg Business Technical

 

SPONSORS

Merck.png
Wonik Materials.png
Dupont.png
Dongwoo Fine-chem.png
Air Liquide.png
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Entegris.png
SK Materials.png
Mecaro.png
 

  Sponsorship Opportunities: JoAnn Lee([email protected])

 


 

NOTICE

  • Presentation files agreed by speakers will be provided to attendees. It will be informed how to download the files after the event.
  • The agenda will be subject to change without notice.
  • Live session will start Oct 19, 2:00pm.
  • On-demand Session is accessible during Oct 19 - 20.

 


 

CONTACT

  Sera Jung(+82-2-531-7831 / [email protected])

SMC Korea 2019 Photos

Room 401, COEX, Seoul
Gangnam-gu
Seoul
South Korea

Live Session (10/19)

2:00 pm - 2:05 pm

Welcome

2:05 pm - 2:35 pm
Cheol Seong Hwang.jpg
Cheol Seong Hwang
Seoul National University

[Keynote] New Materials for Futuristic Semiconductor Memory Devices

2:35 pm - 3:05 pm
Dae Hyun Kim
PricewaterhouseCoopers Consulting

[Keynote] Digitalized R&D

3:05 pm - 3:35 pm
Ryoung-han Kim.jpg
Ryoung-han Kim
imec

[Keynote] On the Horizon of Semiconductor Scaling Paradigm Change and its Impact on Patterning and Materials

3:35 pm - 4:00 pm

Break

4:00 pm - 4:30 pm
Hyungsoon Park
SK hynix

[Collaboration] Technology Trends of Materials for Semiconductor Manufacturing

4:30 pm - 5:00 pm
Samjong Choi.jpg
Sam Jong Choi
Samsung Electronics

[Collaboration] Continuous Quality Improvement Strategy for Semiconductor Material SCM

On-demand Session(10/19-20)

Jeff Gambino.jpg
Jeff Gambino
On Semiconductor

[SMART Applications] CMOS Image Sensors: Challenges and Opportunities

Seong-yong Moon.jpg
Seong-yong Moon
FST

[Advanced Patterning] EUV Pellicle Development Status

Adnrew Grenville.jpg
Andrew Grenville
Inpria

[Advanced Patterning] Delivering Metal Oxide Photoresists for EUV: Overcoming Challenges to Scaling

Heejun Yang.png
Heejun Yang
Entegris

[Advanced Patterning] Lithography Filtration Innovation for Increased Yield

Mark Thirsk.jpg
Mark Thirsk
Linx Consulting

[More than Moore] Needs and Opportunities for Electronics Materials in the Coming Super Cycle

Jan Vardaman.jpg
E. Jan Vardaman
TechSearch International

[More than Moore] Advanced Packaging for Heterogeneous Integration: What’s Next

Chanho Kim.png
Chanho Kim
Air Liquide Advanced Materials

[More than Moore] Economic Considerations for ALD Precursor Selection

[NOTICE] Due to the Social Distancing for preventing COVID-19, SEMI decided to hold SMC Korea 2020 as a Virtual Event.

 

Materials Driving Transformation of Industry

With advanced materials now a critical enabler of semiconductor growth applications, industry leaders have emphasized significance of innovation in materials. SMC Korea 2020, the premier conference on electronic materials, will gather top executives from every segment of semiconductor manufacturing to provide the most up-to-date developments in areas of advanced materials.
Join us at SMC Korea 2020 to advance your knowledges and network with the global leaders and professionals.

9:00 am - 5:40 pm Off Add to Calendar 2020-10-19 09:00:00 2020-10-19 17:40:00 SMC KOREA 2020 [NOTICE] Due to the Social Distancing for preventing COVID-19, SEMI decided to hold SMC Korea 2020 as a Virtual Event.   Materials Driving Transformation of Industry With advanced materials now a critical enabler of semiconductor growth applications, industry leaders have emphasized significance of innovation in materials. SMC Korea 2020, the premier conference on electronic materials, will gather top executives from every segment of semiconductor manufacturing to provide the most up-to-date developments in areas of advanced materials. Join us at SMC Korea 2020 to advance your knowledges and network with the global leaders and professionals. Room 401, COEX, Seoul Gangnam-gu Seoul South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul

REGISTRATION

smart manufacturing webinar

This webinar is free of charge. 

smart manufacturing webinar
Belgium France Germany Ireland Italy Russia United States REGISTER About Smart Manufacturing Business Technical

For sponsorship opportunities, please contact:

Cassandra Melvin, Director of Operations at [email protected]
Adi Hodorov, Manager, Sales and Key Accounts at [email protected] 

PRESS AND MEDIA

If you are interested in partnering with us or have any questions about press and media, please contact us.

Serena Brischetto, Senior Manager, Marketing and Communications at [email protected]

The SEMI SMART Manufacturing Initiative is a global effort to promote awareness and interest about smart manufacturing and industry 4.0. Through their collaborative efforts, the members of the SEMI SMART Manufacturing Regional Chapters meet regularly, both virtually and in person, to facilitate discussions for solving challenges and issues that impact manufacturing.  

The webinar will provide an update on pressing critical topics derived from key players across the supply chain and is recommended to semiconductor professionals interested in the European smart manufacturing trends and market.

Topics include:

  • a summary of stakeholder-identified activities aligned to Industry 4.0
  • key initiatives and emerging roadmaps
  • standards
  • best practices for improved process quality
  • market updates
  • overview of current Smart Manufacturing activities

Online, Central European Time
Germany

4:00 pm - 4:10 pm
Tom Salmon
Tom Salmon
Vice President, Collaborative Technology Platforms Executive Director, Fab Owners Alliance (FOA), SEMI

Welcome Remarks and Moderation

4:10 pm - 4:30 pm
Claude Morant
Claude Morant
Group Vice President Quality & Manufacturing Excellence / Manufacturing Data & Analytics Lead
STMicroelectronics

Manufacturing Data & Analytics

4:30 pm - 4:45 pm
Ilan Englard
Ilan Englard
European Cooperative Projects Manager
Applied Materials Israel (AMIL)

MADEin4 - Metrology Advances for Digitized ECS (Semiconductor and Automotive) Industry 4.0

4:45 pm - 5:00 pm
Michael Arnold
Michael Arnold
Managing Director
PEER Group GmbH

SEMI Smart Manufacturing Technology Community – Europe Chapter

5:00 pm - 5:15 pm
MICHAEL ALEXANDER
Michael Alexander
Partner Electronics, Co-Lead Advanced Technology Center, CC Industrial Products & Services
Roland Berger GmbH

Sizing the Digital Gap - Visualizing the Gap and Discussing Levers to Close it

5:15 pm - 5:30 pm

Q&A

FOA

Free Webinar

European Collaborations Driving Smart Manufacturing Excellence
 

SMART Manufacturing

 

4:00 pm - 5:30 pm Off Add to Calendar 2020-12-09 16:00:00 2020-12-09 17:30:00 Webinar - European Collaborations Driving Smart Manufacturing Excellence Free Webinar European Collaborations Driving Smart Manufacturing Excellence     Online, Central European Time Germany SEMI.org [email protected] Europe/Berlin public Europe/Berlin
United States Go FLEX Website Get Connected for Latest Updates https://flex.semi.org/ Business Executive Expositions Technical

FLEX CALL FOR ABSTRACTS—IS NOW CLOSED 

For late submissions please contact:
Michelle Fabiano
[email protected]

 

20 Years of Driving Innovation to Make the World Safer

You'll hear experts highlight the latest technical breakthroughs, unique electronics applications, and business strategies giving insight into the future of next-generation Integration beyond Moore's law era. Key technologies and markets in the areas of Smart Medical, Smart Mobility, Smart Manufacturing, Data, AI, and Displays will be explored throughout each technical track presented each day of FLEX week. 

Flexible hybrid electronics (FHE) present unique heterogeneous integration capabilities with unprecedented continuity with us and our world. This softer side of electronics represents high performance integrated devices that are curved and variable in form factor. Electronics that augment our daily activities and interact with our surroundings like no personal computing device ever has are emerging in new and varied application spaces. 

KEY TOPICS 

  • February 22 » Session 1—FHE Systems 

  • February 23 » Session 2—Materials Processing 

  • February 24 » Session 3—Sensors & MEMS   

  • February 25 » Session 4—Sustainability & Power 

  • February 26 » Industry Virtual Tours 

ON-DEMAND AVAILABILITY

  • February 15–21 
    Prepare and preview the On-Demand presentations in order to join each day ready for the interactive panel discussions and luminary keynote discussions.  

  • February 26–March 26
    All content will be available for 30 days On-Demand in case you missed anything during FLEX week. 

WHO ATTENDS? 

Celebrating its 20th year, the online event will gather executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media for the latest developments, trends, and innovations in flexible hybrid electronics (FHE). More than 400 companies, universities, R&D labs, and government agencies from around the world have participated in FLEX conferences each year. 

Please fill out the FLEX Interest Form to stay updated on FLEX 2021 Conference & Expo.
 

FLEX 20 Years

Online, PST
United States

- FlexTech

FLEX IS GOING VIRTUAL!
This is the 20th Anniversary of the FLEX Conference & Expo.
Thank you to the entire FLEX community, committee members, sponsors, attendees, and exhibitors, for your support. We are proud to have you with us on the journey into the next 20 years and beyond.

Organizers 

FLEX Tech Logo

 

 

Off Add to Calendar Disabled

Call for abstracts

America/Los_Angeles

Registration Includes: 

  • Access to the recorded session for use by the same person, multiple times
  • Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

The course explores how reliability testing plays a critical role for Flexible Hybrid Electronics throughout the development process. The presentation highlights how it is essential to create a reliability test plan that covers the requirements for EV, DV and finally though PV, in order to insure product reliability and performance.

The instructors discuss how the Molex design process is used to identify risks and challenges for custom FHE applications and how the various reliability test are used evaluate and eliminate the potential risk and challenges.

AGENDA

  • Overview of Molex Printed Circuits Solutions
  • FHE challenges & requirements
  • Overview of reliability testing development process
  • Reliability test standards
  • Reliability lab set up
  • Q&A

The various industry standards related to HMI, FHE, PE, Printed Sensors and other applications are also reviewed in conjunction with usage in reliability testing related to FHE.

Instructors Tom Seputis, Lab Manager, and Dave Rasmussen. Director, PCS Engineering, as they provide an overview of Molex Printed Circuit Solutions and the reliability testing and challenges related to Flexible Hybrid Electronics.

This Master Class is 4th in a series of 4 classes. Classes 1-3, and the series are also available On Demand at the following links:  

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#3 Integration Techniques for Flexible Electronics

Read more about the full Master Class Series

United States

Dave Rasmussen, Molex
Dave Rasmussen
Director of PCS Engineering
Molex
Tom Seputis
Tom Seputis
Lab Manager
Molex
-

Flexible Electronics Master Class #4 explores best practices for ensuring reliability of FHE devices throughout the production process. The course is taught by experts from Molex's Printed Circuit Solutions Division which has been successfully building complex and reliable flexible circuits for many advanced applications.

12:00 am - 12:00 am Off Add to Calendar Disabled America/Vancouver
Event format

Registration Includes: 

  • Access to the recorded session for use by the same person, multiple times
  • Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will be announced shortly.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Reliability Measurement and Test for Flexible Electronics

United States

Bob Street PARC
Robert Street
Fellow, Palo Alto Research Center

The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

 

10:00 am - 12:00 pm Off Add to Calendar 2020-09-24 10:00:00 2020-09-24 12:00:00 Flexible Electronics Master Class#3: Integration The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.   United States SEMI.org [email protected] America/Vancouver public America/Vancouver
Event format

Registration Includes: 

  • Access to the recorded session for use by the same person, multiple times
  • Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will be announced shortly.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Reliability Measurement and Test for Flexible Electronics

United States

Bob Street PARC
Robert Street
Fellow, Palo Alto Research Center

The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

 

10:00 am - 12:00 pm Off Add to Calendar 2020-09-24 10:00:00 2020-09-24 12:00:00 Flexible Electronics Master Class#3: Integration The presentation will describe techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics will include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques will be illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.   United States SEMI.org [email protected] America/Vancouver public America/Vancouver
Event format

Registration Includes: 

  • Access to the recorded session for use by the same person, multiple times
  • Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

United States Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics at FLEX|MSTC 2020 Business Technical Featured Speakers

Specific topics covered in this course include:

  • printing interconnects
  • printing fine lines, pads and pad pitches with < 100um
  • logic circuits and resistors
  • bonding integrated circuits
  • integrating sensors of different types on flexible substrates without significant performance degradation
  • pick and place with micron-level accuracy

MASTER CLASS SERIES

This Master Class is 3rd in a series of 4 classes.  Classes 1 and 2 are available On Demand.  Class 4 will cover Building in Reliability Testing and is now available for registration.

#1 Flexible Power Sources:  Challenges, Progress and Integration

#2 Artificial Intelligence in Thin Film Manufacturing 

#4 Overview of FHE Reliability Testing and Challenges 

Read more about the full Master Class Series

United States

Bob Street PARC
Robert Street
Fellow, Palo Alto Research Center
-

The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

12:00 am - 12:00 am Off Add to Calendar Disabled America/Vancouver
Event format

Registration Includes: 

  • Access to the recorded session for use by the same person, multiple times
  • Additional attendees must register separately to view

Member Price:  $25

Non-Member Price:  $49

Non-Member Price for Government, Military, and Academia Non-Members:  $35

To receive this price, contact Michelle Fabiano at [email protected] for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at [email protected] for discount code.  Must have a valid student ID card.

United States SEMI Standards PV and PV Materials China Joint TC Chapter Spring Meeting 2020 Business Technical Featured Speakers

This course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano ElectroMechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. This presentation highlights that, as well as a decision tree based AI model for predicting lithography outcomes.

The AI work used as the basis for the course has been applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience have been developed.

The course provides a useful basis upon which to formulate AI strategies for all thin film manufacturing sites.

United States

Amit Lal
Amit Lal
Cornell University
Chris Ober
Chris Ober
Cornell University
Peter Doerschuk
Peter Doerschuk
Cornell University
Benyamin Davaji
Benyamin Davaji
Cornell University
Barry Bordonaro
Garry Bordonaro
Cornell NanoScale Facility
Jeremy Clark
Jeremy Clark
Cornell NanoScale Facility
FlexTech

This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

10:00 am - 12:00 pm Off Add to Calendar 2020-08-18 10:00:00 2020-08-18 12:00:00 Flexible Electronics Master Class#2: AI in Mfg This on-demand course, originally recorded on August 18, 2020, describes how machine learning and AI-based approaches to research, development, and production brings advantages to cleanroom processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability. United States SEMI.org [email protected] America/Vancouver public America/Vancouver
Event format