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Blog
3D-IC: Great Opportunities, Great Challenges
The growing adoption of 2.5D and 3D integrated circuits (3D-ICs) marks a major inflection point in the world of semiconductor design. Electronic designers demand greater integration densities and...
Member Press Release
Beneq unveils two new ALD products for 300mm and compound semiconductor device fabrication respectively
BENEQ, PRESS RELEASE, December 6, 2021
Beneq revolutionized ALD cluster tools for More-than-Moore device makers with the highly successful Beneq Transform® family of products. Today, Beneq broadens...
Member Press Release
YES Establishes Engineering, Design and Sales Presence in India; Ankineedu Velaga to Lead YES India as Country Head and Managing Director
FREMONT, Calif. - YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today...
SEMI Press Release
SEMI Applauds the Release of the European Chips Act
BRUSSELS, Belgium ─ February 08, 2022 – SEMI, the global industry association representing the electronics manufacturing and design supply chain, today applauded the publication of the European Chips...
Blog
Equitable Hiring In a Talent Shortage
With investments in the hundreds of billions of dollars announced in the United States, the semiconductor industry is entering an unprecedented growth phase. We are only beginning to understand the...
Member Press Release
MPO 100 - Multi-User Tool for 3D Lithography and 3D Microprinting
Heidelberg/Würzburg – "1 - 10 - 100 - 1000" – Achievable component heights of over 1 cm, surfaces with roughness in the order of 10 nm, structure sizes of less than 100 nm, and writing speeds over...
SEMI Press Release
Worldwide Silicon Wafer Shipments and Revenue Set New Records in 2021, SEMI Reports
MILPITAS, Calif. — February 8, 2022 — Worldwide silicon wafer area shipments in 2021 increased 14% while wafer revenue rose 13% compared to 2020, topping $12 billion, to reach new all-time highs, the...
SEMI Press Release
SEMI Applauds House Passage of America Competes Act of 2022 with Funding for CHIPS Act
MILPITAS, Calif. – February 4, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today commended the passage of the America...
SEMI Press Release
SEMICON Korea 2022 Hybrid Opens Tomorrow With Semiconductor Industry Growth in Focus
SEOUL, South Korea — February 8, 2022 — Showcasing key drivers of semiconductor industry growth, SEMICON Korea 2022 Hybrid opens tomorrow with a focus on artificial intelligence (AI), smart...
Member Press Release
Picosun and Shincron join forces for ALD optical coating development
ESPOO, Finland, 3rd of February 2022 – Picosun Group and Shincron Co., Ltd. have joined forces for development and commercialization of Atomic Layer Deposition (ALD) for optical coatings. ALD...
Member Press Release
Technic joins MATQu – European based project for quantum computing hardware eco-system
Cranston, RI USA - Technic is proud to announce its commitment to the MATQu project, which aims to drive materials and technology options for quantum computing by bringing together leading European...
SEMI Press Release
American Semiconductor Academy (ASA) Initiative and SEMI Partner to Bolster Microelectronics Industry Talent Pool
MILPITAS, Calif. – February 2, 2022 – SEMI, the industry association representing the global electronics design and manufacturing supply chain, and the American Semiconductor Academy (ASA)...