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Member Press Release
Picosun part of extensive quantum technology development project
ESPOO, Finland, 18th of January 2022 – Picosun takes part as an industrial partner in QuTI, a recently launched extensive research project aiming to develop new components, manufacturing and testing...
SEMI Press Release
SEMICON Korea 2022 Hybrid To Highlight Talent, Sustainability, Smart Manufacturing and Chip Industry Growth Drivers
SEOUL, South Korea — January 18, 2022 — With the global semiconductor supply chain rapidly evolving to meet the increasing demands of digital transformation, the stage is set for SEMICON Korea 2022...
Member Press Release
Victor Huang Joins Yield Engineering Systems (YES) as VP of Legal Affairs
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Victor...
SEMI Press Release
Electronic System Design Industry Logs 17% Year-Over-Year Revenue Growth in Q3 2021, ESD Alliance Reports
MILPITAS, Calif. — January 17, 2022 — Electronic System Design (ESD) industry revenue increased 17.1% year-over-year from $2,953.9 million to $3,458.1 million in Q3 2021, the ESD Alliance, a SEMI...
Member Press Release
Stepping Towards Smart Manufacturing with ViTrox VR20i Post Seal Inspection Vision Handler Series
PENANG MALAYSIA - JANUARY 2022 - ViTrox aims to be the world's most trusted Machine Vision Inspection Solutions provider of innovative, advanced and cost-effective automated Machine Vision Inspection...
Member Press Release
Reed McKissick Joins Fit-Line Global as New Mechanical Engineer
With previous experience in design for manufacturability, Reed McKissick has joined the team at Fit-Line Global® -- a leading component supplier for high-purity fluid processing applications in the...
Member Press Release
Wooptix introduces a patterned wafer geometry system for 300mm silicon wafers
Wooptix SL, a Spanish company dedicated to developing advanced imaging solutions for the semiconductor industry, will be presenting a new technique for Patterned Wafer Geometry at the upcoming SPIE...
SEMI Press Release
SEMI FlexTech Funds 5 New R&D Projects for Flexible Hybrid Electronics
MILPITAS, Calif. – January 17, 2022 – SEMI FlexTech today announced more than $5 million in funding for five new research and development (R&D) projects aimed at flexible hybrid electronics (FHE)...
Blog
SEMI Foundation Honors Jennifer Braggin of Entegris for Contributions to Microelectronics Industry Workforce Development
Workforce development and diversity, equity and inclusion were front and center at SEMICON West 2021 in San Francisco in December as Jennifer Braggin, director of technical training at Entegris, was...
Blog
40 Years of Chip Manufacturing Innovations – Advanced Energy Helps Fuel Advances with Precision Power Solutions
The year 1981 was notable for a variety of technology breakthroughs. It saw the inaugural mission of the Space Shuttle Columbia and the debut of the DeLorean car. The IBM PC, Commodore 64 and the...
Blog
SEMICON Japan Leaders: Industrywide Ecosystem Synergy Key to Advancing Digital Transformation
The SEMICON Sprint to 2022 continued at the recent SEMICON Japan 2021 Hybrid expo with leaders from the world’s largest chipmakers sounding an urgent and unified call to action: For the semiconductor...
SEMI Press Release
SEMI Issues Recommendations for European Commission to Bolster Europe’s Chip Ecosystem Resilience and Competitiveness
BRUSSELS, Belgium – 12 January, 2022 – SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, has issued recommendations to the European...