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Blog
Global Expansion at More Subdued Pace
Global Manufacturing Growth has Slowed, but is Still Positive (Chart 1)Most key countries/regions saw a slowdown in growth in March based on their respective Purchasing Managers Indices. And in one...
Event Presentation
Chemical and Gas Manufactures Group Webinar: Semiconductor Market Trends Effect on the Materials Industry
Kevin McLaughlin, Co-Chair, CGMG Webinar & Highlights Subcommittee and Global Electronics Marketing Manager of SACHEM Inc. leads a presentation featuring three key guest speakers, including Len...
Blog
Getting Better by Design
SEMI’s mantra is: Connect, Collaborate, Innovate. This mantra has delivered industry-enabling value to our members since SEMI’s beginnings in 1970. It has been essential for SEMI members to grow...
Blog
All Ears: 5 Must-Listen Podcast Episodes for MEMS & Sensors Enthusiasts
With technology moving at breakneck speed, MEMS and sensors professionals whose job is to stay on top of industry developments must be able to find useful information—fast. Podcasts are one rich...
Blog
AdaSky's Far Infrared for ADAS on ST's FD-SOI
Automakers are currently evaluating prototypes of Viper from AdaSky, a Far Infrared (FIR) thermal camera that embeds custom silicon co-designed with and manufactured by ST in 28nm FD-SOI. The...
Blog
SEMI, 106 Other Associations Urge Caution by Congress, Trump Administration in Trade Tariffs Against China
SEMI and 106 other associations today joined forces to express deep concern to congressional leaders about the Trump Administration’s decision to use tariffs to address China’s unfair trade...
Blog
GF Simplifies RF-SOI and FD-SOI Design for 5G with New Partnership Program
GlobalFoundries' new ecosystem partner program, called RFwave™, aims to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks (read the full press...
Blog
No Sweat! New Sensor Patch Helps Prevent Dehydration
Worried that you’re underhydrated after a heart-pounding run or bike ride? SEMI’s Nano-Bio Manufacturing Consortium (NBMC) has you covered – with a patch. A few years after the group undertook the...
Event Presentation
European 3D Summit 2018: Heterogeneous Integration – Driving Force and Enabling Technology for 3D-SiP
Bill Bottoms, Ph.D., Chairman at 3MTS discusses 3D integration, heterogeneous integration, CMOS scaling, growth in data generation and global network traffic, OSATs, and plasmonics. Six issues are...
Event Presentation
European 3D Summit 2018: Opportunities and Challenges in 3D Stacked Components
Bob Sankman, Fellow of Assembly Test Technology Development at Intel Corporation, gives a background on 3D packaging, TSV’s advantages, key technology elements required for 3D packaging (in...
Event Presentation
European 3D Summit 2018: Photonic Interconnects for High-Performance Computing and Data Center Applications
Ashkan Seyedi, Photonics Research Scientist at Hewlett Packard Labs, discusses memory-driven compute architecture, network topology, VCSEL photonics, silicon photonics interconnects, LSIP technical...
Event Presentation
European 3D Summit 2018: 3D SoCEnablement Through Hybrid Wafer Bonding – A Foundry Perspective
Luke England, 3D Package Development Manager and Tanya Atanasova, Technology Development Engineer at GlobalFoundries discuss 3D Wafer Bonding Applications, Hybrid Bond Process Flow Scenarios, and...