Showing 2641-2652 of 2676
Blog
2018 Greetings from the SOI Consortium (and a peek at what’s ahead)
ASN asked Carlos Mazure and Giorgio Cesana, the Executive Directors of the SOI Consortium, to take a moment to share their outlook for 2018. Here’s what they had to say.
First of all, we’d like to...
Blog
Sensors in fashion could change the $3 trillion industry and unlock the powered clothing revolution
Long promised by science fiction stories, we're now at the threshold of a real revolution where sensors, flexible electronics and printed batteries could finally be playing a key role in the...
Event Presentation
SEMICON Europa 2017: Advanced Packaging – A Very Dynamic Ecosystem
Andrej Ivankovic, Ph.D., Technology and Market Analyst of Yole Développement discusses Market Drivers and Dynamics, Technology, Market Forecasts, and Supply Chain regarding Semiconductor Advanced...
Event Presentation
SEMICON Europa 2017: Sensors and Electronics for Electric Vehicles – Recent Trends and Upcoming Developments
Andreas Middendorf, Ph.D., Business Developer of Fraunhofer Institute for Reliability and Microintegration IZM discusses application trends of electric vehicles based upon Functionality, Reliability,...
Event Presentation
SEMICON Europa 2017: 3DIC Assembly at Room Temperature Employing Binary Alloying
Eric Schulte, CTO of SETNA Corporation discusses current bonding methods of 3D assembly and proposes a solution via Indium Silver Binary, going over the methodology, characterization, and evaluation...
Event Presentation
SEMICON Europa 2017: Meeting the Increased Demand for 200 mm Capacity by Enhancing Capital Efficiency and Fab Productivity for IoT Applications
David Haynes, Ph.D., Senior Business Development Director of Lam Research Corporation addresses IoT challenges from a capital equipment perspective and offers strategies for reducing defectivity,...
Event Presentation
SEMICON Europa 2017: Providing Key Process Enabling Vacuum Capability Through Integrated Sub-Fab Data Management
Erik Collart, Global Product Manager at EdCentra of EDWARDS, discusses the importance of vacuum and ambient quality in the chip manufacturing process, and the enablement of manufacturing through...
Event Presentation
SEMICON Europa 2017: Flexible Displays – Dramatic New Capabilities Enabling New Applications by Expanding Form, Fit and Function
Michael McCreary, Ph.D, CTO of E Ink Corporation, discusses Electrophoretic Display Technology and its role in creating flexible, foldable, and curved displays for use in an increasing number of...
Event Presentation
SEMICON Europa 2017: Transparent and Flexible Moisture Barriers
Luca Gautero, Senior Process Development Engineer at Meyer Burger discusses moisture barrier applications/challenges, stacked encapsultation layers with PECVD and inkjet printing, and barrier foil...
Event Presentation
SEMICON Europa 2017: Henkel – Enabling Materials for Semiconductor and Sensor Assembly
HENKEL presents Innovative Semiconductor and Sensor Assembly Solutions via package level EMI shielding solutions, advanced semiconductor packaging materials, high conductivity semi sintering die...
Event Presentation
SEMICON Europa 2017: How Sensor Frameworks Enable Efficient Development
Shubhadip Paul, Software Engineer at NXP Semiconductors, discusses remote sensors in an IoT ecosystem, from smart sensor nodes to sensor frameworks. Two demonstrations of NXP’s technology are...
Event Presentation
SEMICON Europa 2017: Measurement of Airborne Nanoscale Particles Using Condensation Particle Counters
Richard Remiarz, Business Director of Controlled Environments at TSI Incorporated, discusses market needs, limits in light-scattering instruments, CPC technology and its history, water-based CPCs,...