Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey today became the first posthumous honorees of a new honor acknowledging their significant and noteworthy contributions to the electronic system design industry.

The Kaufman Hall of Fame, co-sponsored by the Electronic System Design (ESD) Alliance and the IEEE Council on Electronic Design Automation (CEDA), posthumously recognizes Jim Hogan and Professor McCluskey, neither of whom can be honored with the Phil Kaufman Award. Deceased members of the community are not eligible to receive the award, a policy set by the IEEE.

“Ed died in 2016 and, more recently, Jim, leaving giant and immutable legacies to the electronic system design industry,” comments Bob Smith, executive director of the ESD Alliance. “Both had outsized personalities and accomplishments to match.”

“While Ed will be remembered for his collection of unusual hats, he was a Computer Engineering pioneer who shaped the design and testing of digital systems for more than 50 years,” states Professor Yao-Weng Chang, president of CEDA. Dr. Chang is also the dean of the College of Electrical Engineering and Computer Science at National Taiwan University.

“Jim was responsible for launching and/or guiding countless EDA and semiconductor startups and well understood the importance of fueling the semiconductor ecosystem with new and disruptive ideas,” adds Smith.

Jim Hogan
Jim Hogan, who died in February, was managing partner of Vista Ventures, LLC., and an experienced senior executive who worked in the semiconductor design and manufacturing industry for more than 40 years. He served on numerous boards of directors for private electronic design automation, intellectual property, semiconductor equipment, material science and IT companies and acted as a strategic advisor for private and public companies.

Several nominations on his behalf attest to his commitment to the electronic system design ecosystem. “As an angel investor and board member, Jim was generous with his time and wisdom, and good at connecting with people,” says Moshe Zalcberg, Veriest Solutions’ CEO. “Right before he died, he told me how important it is to fuel the semiconductor ecosystem with new and disruptive ideas.”

“Jim remained enthusiastic about helping entrepreneurs and new technologies,” remarks Bernard Murphy, content marketing advisor and author. “He was an active promoter of innovation in our industry and an inspiration to many nascent entrepreneurs. I am hard-pressed to imagine anyone more deserving of this award.”

According to Jan Goodsell, Quadric.io’s senior director of business development: “Jim generously provided insightful, kind and warm advice across our industry. No one can surpass the combined technical, business and personal contributions that Jim made to our industry, and to so many of us in it.”

“Jim was one of the pillars of the EDA industry,” asserts Joe Costello, former CEO of Cadence Design Systems and the 2004 Phil Kaufman Award recipient. “He worked with me and Jim Solomon for over a decade building Cadence to be the leader in the EDA market and creating the mixed-signal analog division that dominates the market to this day. After I left Cadence, Jim carried on for me taking over my role in M&A continuing to build the company’s product strengths.

“After leaving Cadence, Jim may have had an even greater impact on EDA,” he continues. “Those were difficult years for small EDA companies and startups. Jim was a board member, advisor and investor in more EDA companies than any other person in the last 15 years. It is no exaggeration to say that EDA and EDA technology would not be where it is today without Jim’s guiding hand. And despite all of his prodigious accomplishments, Jim remained the most humble, easy going, likable person in the industry to the very last day.”

Simon Butler, general manager of Perforce Software, concludes: “Jim was an EDA legend.”

Professor Edward J. McCluskey
According to his nomination form, supported by six Phil Kaufman Award winners, Ed McCluskey sustained a relentless pace of fundamental contributions for efficient and robust design, high-quality testing and reliable operation of digital systems.

His work has withstood the test of time across technology generations. “Ed's technical contribution to the fundamentals of synthesis, test, fault tolerance and digital design automation have been a cornerstone in the foundation of today’s world of ubiquitous computing and internet connectivity,” observes Dr. Thomas W. Williams, retired Synopsys fellow. Dr. Williams received the Phil Kaufman Award in 2018.
Ed was also a leading educator and a pioneer in establishing and fostering computer engineering as a profession. His textbooks on logic design defined the discipline. At Princeton, he established the Computer Engineering curriculum, and founded the university computer center in the early 1960s. At Stanford, he founded the Digital Systems Lab (renamed Computer Systems Lab) that cultivated collaboration between Electrical Engineering and Computer Science, and the Center for Reliable Computing that played a major role advancing the fields of computer reliability and testing. He produced 75 Ph.D. graduates, many of whom are leaders in academia and industry.

Andrzej J. Strojwas, Keithley professor of Electrical and Computer Engineering at Carnegie Mellon University and chief technologist at PDF Solutions, explains: “Ed's seminal contributions in the fault-tolerant computing and digital testing fields are extremely relevant today in all aspects of digital system design. The army of his former students and followers will make sure that his ideas will live forever.” Dr. Strojwas was the 2016 recipient of the Phil Kaufman Award.

Ed received numerous awards and honors, including: the IEEE John von Neumann Medal; IEEE Emanuel R. Piore Award; IEEE Computer Society’s Computer Pioneer Award; and Taylor L. Booth Education Award; ACM SIGDA’s Pioneering Achievement Award; and IEEE Test Technology Technical Council’s Lifetime Contribution Medal. He was elected a Fellow of the AAAS, ACM and the IEEE, and a member of the National Academy of Engineering. The IEEE Computer Society renamed its Technical Achievement Award as the Edward J. McCluskey Technical Achievement Award.

In closing, Dr. Aart de Geus, Synopsys’ chairman and co-CEO and Phil Kaufman Award recipient in 2008, notes: "We see a great oak tree suddenly fall and immediately feel the void left behind. We have all learned from Ed's work, and today appreciate his significant contributions in making the ‘digital revolution’ not a slogan but a world-changing reality. We appreciate the impact of Ed’s technical contributions collectively and personally. Thank you, Ed!"

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA:
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global Electronics industry.

Follow the ESD Alliance:
https://semi.huihuidehui.workers.dev/en/communities/esda/about-esda
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

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FREMONT, Calif. – June 14, 2021 – YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has become a member of the Silicon Saxony industry association. YES, which recently established a German presence in Dresden, expects the high-tech networking group to be a valuable resource in marketing advanced process equipment and solutions to an expanding customer base across Europe, particularly in Germany. In addition, the company plans to strengthen communication and alliances with fellow members of Silicon Saxony.

“Silicon Saxony brings together companies that are leading the electronics industry in Europe,” said Dragan Cekic, YES’s Vice President of Sales for Europe and the Americas. “We are excited to join their ongoing conversation about trends and technologies that will affect us all.”
“Change is a given in the markets we serve. The opportunities facing our industry are complex, and the rapid pace of technological developments is unprecedented. We look forward to participating in Silicon Saxony’s high-tech network with the aim of addressing today’s exciting semiconductor roadmaps,” said Rezwan Lateef, President of YES.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit www.yieldengineering.com.

About Silicon Saxony
With more than 350 members, Silicon Saxony e. V. is the largest high-tech network in Saxony and one of the largest microelectronics and IT clusters in Germany and Europe. Founded in 2000, Silicon Saxony is a self-financed association linking manufacturers, suppliers, service providers, universities, research institutes, public institutions as well as industry-relevant start-ups. Its focus is on the technological trends of the present and future: artificial intelligence, robotics, automation, Internet of Things, sensor technology, energy efficiency, and neuromorphic and edge computing. As a high-profile information, communication and cooperation platform, the association promotes the regional, national and international networking of its members by participating in and organizing industry events.

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IC’Alps Builds a Secure Infrastructure for Ultimate Protection of Customers’ Data

Meylan, FRANCE – June 08, 2021 – In wake of the recently announced partnership with Tiempo Secure for silicon implementation of CC (Common Criteria) EAL5+ grade Secure Element IP, IC’Alps has deployed an infrastructure that complies with the highest security standards.

IC’Alps is a French semiconductor company specializing in the design and supply of exclusive and custom-made ASIC solutions (Application Specific Integrated Circuits). As part of the improvements, the company has set up a secure access management system including premises complementary access control, dedicated and secure design room, and an isolated and secure IT network. This revamp increases the security in IC’Alps’ Head Office as demanded by security-sensitive customers or partners, requiring such a high level of data protection and associated traceability.

IC’Alps successfully passed CC audit of secure room and associated IT infrastructure commissioned by Tiempo Secure, audit performed by a security evaluation labs (ITSEF) licensed by the ANSSI. The audit states that the silicon physical implementation work entrusted by Tiempo Secure to IC’Alps passed the very strict requirements.

“Since the company was founded, IC’Alps has invested significant financial and human resources into IT. We are proud to pass this CC audit for this customer’s project. This is an independent recognition of our commitment to providing the highest level of quality, data security and customer service”, said Jean-Luc Triouleyre, CEO of IC’Alps.

In addition to ISO 13485 (medical) and EN 9100 (aeronautics) certifications, joining an elite group of companies providing a design environment complying with the highest security standards, will strengthen IC’Alps’ business opportunities for silicon implementation of custom chips and hard macros targeted for security-sensitive markets such as, but not limited to, banking, defence, government and implantable medical devices.
 
ABOUT IC’ALPS
IC’Alps is your one-stop-shop ASIC partner. The company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. From its technical centre in France (Grenoble area), IC’Alps supports multiple projects in the demanding medical, industrial, transport, IoT, and mil/aero sectors. The highly qualified engineering teams cover every expertise needed and have a long experience of on-demand analog, mixed-signal and digital integrated circuits on technologies from 0.35 µm down to 16 nm. Moreover, IC’Alps has a proven track record of success with sensor/MEMS AFE interfaces, low power consumption designs, high-resolution converters, signal processing, multiprocessors architectures, hardware accelerators, to name a few. Being a partner of major semiconductor foundries, IP providers, as well as packaging and test houses, IC’Alps is well placed to support customers with full life-cycle solutions. We are proud to be Arm® approved Design Partner, a member of X-FAB’s design and supply chain partner network, as well as an Imec IC-link partner. These accreditations assure that we provide expert support and that we have the design expertise to create highly innovative ASIC designs. IC’Alps is ISO 9001, ISO 13485, EN 9100 certified, as well as Common Criteria ready. More information can be found at www.icalps.com

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An opportunity to boost development for Additive Manufacturing & Semicon industry.

Inventec Performance Chemicals, a global provider of Soldering, Cleaning & Coating solutions, acquired PUS (Pure Ultrasonic System) in April 2021. PUS’ main activities are the production of equipment (solder powder atomizers and sieving machines) and the production of solder powders, from its own process.

By acquiring PUS, Inventec saw an opportunity to create a synergy in the additive manufacturing industry. Inventec supplies the 3D market for high-tech application, with its cleaning, particle elimination & finishing products, while PUS provides sieving, recycling and depowdering, to provide a circular economy solution for this fast-developing market.

Furthermore, the addition of PUS will strengthen Inventec’s know-how in metallurgy, for the development of solder pastes, with ultrafine powders and specialty alloys for the semicon industry. Adapting to an evolving industry, this acquisition allows Inventec to innovate and meet worldwide customers’ needs.

ABOUT INVENTEC
INVENTEC PERFORMANCE CHEMICALS is a global provider of soldering, cleaning & coating materials for electronic, semiconductor and industrial applications.

For more than 50 years we have shown leadership in innovation by putting environment & health impact, sustainability and reliability at the core of our product development.

With iso 9001 & 14001 production sites in France, Switzerland, USA, Mexico, Malaysia and China we can guarantee a smooth and cost-effective supply chain. On top of this, all our production facilities are equipped with a cleaning application centre, where customers are invited to test our proposed cleaning solutions.

Inventec supplies to many industries and the excellent performance of our products in applications demanding high reliability, leads us to focus especially on the automotive, aerospace, semiconductor, automation & energy and medical industry.
For more information about Inventec Performance Chemicals, visit https://www.inventec.dehon.com/en/

ABOUT PUS
PURE ULTRASONIC SYSTEMS is a French expert for ultrasonic atomization and ultrasonic sieving. At its creation, PUS first specialized in atomization and sieving equipment, manufacturing devices for ultrasonic atomization of solder powder for electronic assembly. 10 years later, PUS is still innovating to develop new equipment and powders for the Additive Manufacturing Market.
For more information about PUS, visit https://www.pus-net.fr/en/

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ESPOO, Finland, 2nd of June 2021 – Picosun Group has pending patent rights for an ALD enabled corrosion protection solution against plasma etch that will bring benefits in semiconductor fabrication processes in terms of throughput, film uniformity and conformality. With PicoArmour(TM) the corrosion protection can be achieved more efficiently compared with the industry solutions commonly used today.

Wafer fabrication process flows include several steps where plasma etching is necessary. An inevitable consequence of using etching chemicals is that the tool itself will be etched. A common industrial solution for reducing the tool damage is applying a corrosion-resistant coating to the etch tool using for example PVD or spray coating with Y2O3. Compared to only using Y2O3, PicoArmour(TM) enables an up to five times faster and a more cost-effective way of producing the coating. Compared to Al2O3, the coating can be five times more durable.* Also, the maintenance interval of etch tools can be increased which also translates to significant reduction of manufacturing costs.

“Picosun’s approach with PicoArmour(TM) is to combine the highly-etch-resistant Y2O3 ALD process with more robust ALD processes. A high performance ALD corrosion barrier combining the speed and convenience of Al2O3 process with the durability of Y2O3 can be achieved by carefully controlling the film composition. With ALD, the protective effect can be achieved with thinner films, which in turn leads to material savings and a more environmentally friendly process”, states Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

To learn more about PicoArmour(TM) and a study Picosun has done related to protective coatings against plasma damage, join Picosun talk at the virtual ALD 2021 conference on June 29 at 10:25 am EDT.
Register here: https://ald2021.avs.org/register/

*Values dependent on deposition and etch parameters

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

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