YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat™ monolayer coating system at EVG’s NILPhotonics® Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor, life science and optical coatings (AR/VR) customers. EV Group is a major supplier of capital equipment for these markets.

“At YES, we aim to be the preferred technology solutions provider for material modification and surface enhancement. Achieving that goal means giving our customers, wherever they are located, what they need in order to create leading-edge products. We believe that this collaboration with EVG will help us to showcase our technologies to companies developing breakthrough products in the semiconductor, life science and AR/VR markets, and will also help us to anticipate what those companies will require to support their roadmaps,” said Rezwan Lateef, President of YES.

“Within the framework of the NILPhotonics® Competence Center, EVG partners with customers to develop efficient and differentiating manufacturing solutions for new cutting-edge markets and applications. We welcome YES’s participation in our process flow and look forward to providing a seamless, high performance process flow including YES’s solutions,” said Markus Wimplinger, Corporate Technology Development & IP Director at EVG.

Based at EVG headquarters in St. Florian, Austria, EVG’s NILPhotonics® Competence Center and Heterogeneous Integration Competence Center™ provides world-class process development services and serves as an open access innovation incubator for customers and partners across the microelectronics supply chain. Through its centers of technology excellence, EVG helps customers to accelerate technology development, minimize risk, and develop differentiating technologies and products through the implementation of nanoimprint lithography and heterogeneous integration, respectively, while guaranteeing the highest IP protection standards that are required for working on pre-release products.

About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit http://www.yieldengineering.com.

About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at http://www.EVGroup.com.

• Read more about YES Joins Forces with EVG

Meylan, FRANCE – April 19, 2021 - IC’Alps, fast-growing French expert in the design and supply of application-specific integrated circuits (ASIC), has announced a strategic collaboration with KAL for the commercialization of their ASIC services on the Israeli marketplace. Besides, IC’Alps head office is actively recruiting.

To sustain its growth objective, IC'Alps leverages two assets: the expansion of its sales force and the strengthening of its team.

“With the Covid-19 pandemic, we had to rethink the way we do business, and online meetings have their limits”, said Jean-Luc Triouleyre, IC’Alps’ CEO. “We strongly believe that customer proximity and providing face-to-face (when possible) support and sales is crucial to the success of our international expansion. Having local Sales Representatives sharing the same culture, language and time zone helps ensure that the customers’ requirements are well understood and that the sales process runs efficiently.”

KAL provides Semiconductor services since 2003 in Israel for Fablesses, Chip Makers, Foundries, Design Houses, and EDA vendors. The company joins the growing list of IC’Alps Sales Representatives including:

• Redtree Solutions Ltd
• Running Springs Technology

Each of these companies has the expertise to carry out a premium sales experience with customers in a variety of European, Asian, and North American markets including IoT, Industrial, MedTech, and Automotive which match IC’Alps’ areas of strength.

To sustain the pace of new projects brought in by its sales force, IC’Alps has recently hired experimented engineers in the field of physical implementation and analog design. And IC’Alps is still looking for new talents to continue its fast-growing ambition. The team is very active on design areas such as on demand analog blocks, sensor/MEMS interfacing, hardware accelerators and (multi)processors systems based on ARM or RISC-V cores, always with a low power approach. Talent acquisition and recruiting have always been challenging for a SME. “With an unprecedented period of expansion of the semiconductor industry in the decade ahead, another big focus for IC’Alps this year is to remain competitive in the talent market through strong corporate culture, attractive work environment, and employee benefits package”, added Jean-Luc Triouleyre.

Thanks to these efforts, IC’Alps offers a complete ASIC realization service of taking a custom chip through all the stages of specification, design, test, and manufacturing to the final logistics of delivery to customers. This leaves customers free to focus on the final device and sales where their expertise lies.

For more information, please visit IC’Alps “Sales Representatives” page on https://www.icalps.com/asic-soc-design-supply-custom-chip-services-netw…

To discover why IC’Alps is a great place to work, please visit IC’Alps “Careers” page on https://www.icalps.com/careers-opportunities-alps/ and follow us on LinkedIn

• Read more about IC'Alps Supports its Growth by Reinforcing its Staff and its Sales Rep Network

MILPITAS, Calif., and ANN ARBOR, Mich. – April 19, 2021 – SEMI, the largest global trade association for the design and manufacture of semiconductors, and the Center for Automotive Research (CAR), a 501(c)(3) nonprofit independent automotive/mobility industry think tank, today announced the signing of a Memorandum of Understanding (MOU) for joint exploration to advance increased supply chain collaboration between the semiconductor and automotive industries. Building on the SEMI Smart Mobility initiative, which fosters collaboration across the global automotive electronics supply chain, the MOU lays the foundation to connect microelectronics manufacturing and design stakeholders with the automotive and mobility ecosystems through programs and events that advance both industries.

For SEMI, the collaboration with CAR supports the mission of its Smart Mobility initiative to foster mutually beneficial interactions and broaden transparent dialogue between its global member companies and the automotive ecosystem. For CAR, as electronic systems are increasingly becoming the critical differentiators in vehicles, having automakers, suppliers, and semiconductor manufacturers work together more closely will add visibility into supply and demand trends. The result is intended to help connect larger cross-sections of the supply chains and minimize the impact and risk of future chip shortages and over-supply.

“This MOU provides vehicle OEMs with access to innovation, the ability to influence technology direction and pace, along with greater visibility into global supply chain developments,” said Dave Anderson, president of SEMI Americas. “Working with CAR will expand the cross-industry collaboration that is part and parcel to our automotive electronics and mobility activities, helping SEMI members in the global electronics design and manufacturing supply chain to better serve their automotive customers.”

“As automotive technology evolves, the industry will become more semiconductor-intensive – advanced safety features, electric vehicles, powertrain controls, automated driving, telematics, and infotainment all drive rapidly increasing auto chip demand,” said Carla Bailo, president and CEO for CAR. “In today’s market context, this MOU serves as a first step toward cultivating strategic partnerships between automotive OEMs, Tier 1 suppliers and semiconductor suppliers, and it can help to strengthen industry-wide efforts to share information and drive alignment.”

About SEMI Smart Mobility

The SEMI Smart Mobility initiative is designed to engage automotive OEMs, Tier 1s, device makers, design houses, equipment and materials companies as well as R&D institutes in SEMI’s Global Automotive Advisory Council (GAAC) to connect, collaborate and innovate across the global automotive electronics supply chain.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About CAR

The Center for Automotive Research is a nonprofit organization; its mission is to conduct independent research and analysis to educate, inform and advise stakeholders, policy makers, and the general public on critical issues facing the automotive industry, and the industry’s impact on the U.S. economy and society.

Media contacts:

SEMI
Samer Bahou
Phone: 1.408.943.7870
Email: [email protected]

CAR
Katie Ramsburgh
Phone: 1.734.476.1706
Email: [email protected]

• Read more about SEMI and Center for Automotive Research Announce Collaboration to Harmonize Semiconductor and Automotive Supply Chains

Kalispell, MT – April 14, 2021 – ClassOne Technology (classone.com), the global provider of advanced semiconductor plating and surface preparation systems, announced that it has received a multi-tool order from one of the largest Gallium Arsenide (GaAs) foundries in Asia. The order was for ClassOne’s Solstice® S8 systems and included proprietary GoldPro™ processing chambers for advanced gold plating. The announcement was made by ClassOne’s CEO, Byron Exarcos, and Senior Technology Director, John Ghekiere.

"This customer is using the Solstice S8 for high-volume HBT processes on 150mm GaAs wafers,” said Ghekiere. “They're producing advanced power semiconductor devices that involve several important gold processes, both frontend applications and backend vias. So, they were interested in our GoldPro chamber for a number of reasons: For one thing, it automatically adjusts to a broad range of substrate thicknesses, from nominal-thickness wafers to those that are mounted on thick substrates. So they don’t have to reconfigure for each substrate type.”

“Also, the GoldPro reactor is able to deliver exceptional gold plating uniformity together with high wafer throughput,” said Ghekiere. “In previous generations of gold plating systems, the user generally had to choose between plating quality and processing speed. However, GoldPro is designed to form highly stable flow structures that achieve extremely uniform feature shape without sacrificing plating rate.”

“All of this is producing a steady increase In Solstice sales, notably in high-volume fabs and in Asia," said Exarcos. “Partly it’s because of Solstice’s performance and flexibility, delivering both high-quality electroplating and surface prep processes on the same tool, which boosts production and ROI. But it’s also because of ClassOne’s high level of customer support in Asia. Many customers are just getting started in advanced electroplating technology, and they depend on us for the deep process experience and technical support they need to get from start-up to full production. For example, many of them count on our ability to provide pre-production sampling through our central Technical Development Center, which can shorten their time frames considerably. It’s this combination of world-class technology and world-class support that’s been driving many of the repeat orders we’ve been receiving across Asia and around the world.”

ClassOne’s Solstice S8 is an eight-chambered, fully-automated single-wafer production tool that delivers high-performance electroplating as well as wafer surface preparation for a range of processes, including cleaning, metal lift-off, resist strip, UBM etch and more. The Solstice series also includes the fully-automated S4 with up to four processing chambers and the semi-automated Solstice LT with up to three chambers for process development or lower-volume production.
# # #

About ClassOne Technology
ClassOne Technology (classone.com) has become the semiconductor industry’s leading provider of advanced wet-chemical wafer processing equipment for ≤200mm wafers. ClassOne’s popular Solstice® plating and surface preparation systems include the S8 with up to eight chambers and the S4 with up to four chambers for high-speed fully-automated single-wafer production. The Solstice LT provides up to three chambers for process development or lower-volume production. Complementing the Solstice platform, ClassOne has developed a series of proprietary chambers, including the GoldPro™ and CopperMax™, to uniquely optimize specific types of processing. In addition, ClassOne offers the Trident™ product lines of advanced batch-processing spin-rinse-dryers and spray solvent tools. Headquartered in Kalispell, MT, the company has successfully brought new high-performance processing technology to compound semiconductor and many emerging markets that have long been underserved by the older equipment manufacturers. Hundreds of ClassOne tools are now at work in leading fabs and research facilities around the globe, producing many of the world’s most advanced devices, from microLEDs and VCSELs to next-generation RF and sensors.

• Read more about Major Asian GaAs Foundry Orders Multiple Solstice Electroplating Systems from ClassOne

ESPOO, Finland, 13th of April 2021 – Picosun Group has proved to significantly increase the production efficiency of its LED and OLED customers with the PICOSUN® P-300BV ALD system. Recent tests show that a reduced ALD process cycle time and an increased number of wafers deposited with the same film thickness resulted in almost 100% better throughput. A throughput of over 20 000 wafers per month can be reached with a wafer batch of 100 wafers*. At the same time, the process quality in terms of film thickness uniformity has remained on an excellent level (20000 WPM, About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Juhana Kostamo¬
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun increases efficiency for LED and OLED production

Industry Reports 15.4% Revenue Growth Overall; Surpasses $3 Billion for Fourth Quarter

MILPITAS, Calif. — April 13, 2021 — Electronic System Design (ESD) industry revenue increased by over $1 billion in 2020, marking a new milestone for the industry, the ESD Alliance, a SEMI Technology Community, announced today in the Q4 2020 Electronic Design Market Data report. Revenue increased 15.4% in Q4 2020 to $3,031.5 million, compared to $2,626.3 million in Q4 2019, representing only the fourth time since 2011 that year-over-year growth exceeded 15%. The four-quarter moving average, which compares the most recent four quarters to the prior four quarters, rose by 11.6%, the highest annual growth since 2011 and the second highest in the last 14 years.

“The industry reported a substantial double-digit year-over-year revenue increase for Q4 2020,” said Walden C. Rhines, Executive Sponsor, SEMI Electronic Design Market Data report. “Overall industry revenue surpassed $3 billion for Q4, with increases in all geographic regions. The Computer Aided Engineering (CAE), IC Physical Design and Verification, Semiconductor IP (SIP), and Services categories also reported fourth-quarter growth.”

The companies tracked in the EDMD report employed 48,478 people in Q4 2020, a 6.7% increase over the Q4 2019 headcount of 45,416 and up 3% compared to Q3 2020.

The quarterly EDMD report containing detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category in Q4 2020

• CAE revenue increased 9.4% to $956.9 million compared to Q4 2019. The four-quarter CAE moving average also increased 9.4%.

• IC Physical Design and Verification revenue increased 36.6% to $637.1 million compared to Q4 2019. The four-quarter moving average for the category rose 12.3%.

• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue decreased 0.8% to $292.9 million compared to Q4 2019. The four-quarter moving average for PCB and MCM increased 4.3%.

• SIP revenue increased 16.9% to $1,052.9 million compared to Q4 2019. The four-quarter SIP moving average grew 17.1%.

• Services revenue increased 2.2% to $91.6 million compared to Q4 2019. The four-quarter Services moving average decreased 2.4%.

Revenue by Region in Q4 2020

• The Americas, the largest reporting region by revenue, purchased $1,304 million of Electronic System Design products and services in Q4 2020, a 15.8% increase compared to Q4 2019. The four-quarter moving average for the Americas increased 9.9%.

• Europe, the Middle East, and Africa (EMEA) revenue increased 2.7%, to $457.2 million compared to Q4 2019. The four-quarter moving average for EMEA grew 6.3%.

• Japan revenue increased 8% to $228.2 million compared to Q4 2019. The four-quarter moving average for Japan rose 8.2%.

• Asia Pacific (APAC) revenue increased 23.4% to $1,042 million compared to Q4 2019. The four-quarter moving average for APAC increased 17.1%.

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) reports EDA, IP and services industry revenue data quarterly and is available from SEMI. Both public and private companies contribute data to the report. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (the Americas, Europe Middle East and Africa, Japan, and Asia Pacific)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts

Paul Cohen
ESD Alliance
A SEMI Technology Community
978-769-2106

Jack Taylor
Siemens EDA
512-560-7143

• Read more about ESD Alliance Reports Strong Electronic System Design Industry Revenue Growth for Q4 2020

MILPITAS, Calif. – April 13, 2021 – Worldwide sales of semiconductor manufacturing equipment surged 19% from $59.8 billion in 2019 to a new all-time high of $71.2 billion in 2020, SEMI, the industry association representing the global electronics product design and manufacturing supply chain, reported today. The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

For the first time, China claimed the largest market for new semiconductor equipment with sales growth of 39% to $18.72 billion. Sales in Taiwan, the second-largest equipment market, remained flat in 2020 with sales of $17.15 billion after showing strong growth in 2019. Korea registered 61% growth to $16.08 billion to maintain the third position.  Annual spending also increased 21% in Japan and 16% in Europe as both regions are recovering from the contraction in 2019. Receipts in North America decreased 20% in 2020 following three years of consecutive growth.

Global sales of wafer processing equipment rose 19% in 2020, while other front-end segment sales grew 4%. Assembly and packaging showed strong growth across all regions, resulting in a 34% market increase in 2020, while total test equipment sales increased 20%.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. Equipment categories cover wafer processing, assembly and packaging, test, and other front-end equipment including mask/reticle manufacturing, wafer manufacturing, and fab facilities.
 

Annual Billings by Region in Billions of U.S. Dollars with Year-Over-Year Change Rates 

Source: SEMI (semi.huihuidehui.workers.dev) and SEAJ (www.seaj.or.jp), April 2021

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market.

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about 2020 Global Semiconductor Equipment Sales Surge 19% to Industry Record $71.2 Billion, SEMI Reports

MILPITAS, Calif. – April 6, 2021 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today announced that it filed comments with the U.S. Department of Commerce in response to its request for public comments regarding risks in the semiconductor manufacturing and advanced packaging supply chain. The comments SEMI submitted provide a summary of the processes, goods and technologies needed for semiconductor production and a host of policy recommendations to strengthen the U.S. semiconductor supply chain and resiliency of the industry.

“Our comments show that just as countless industries depend on semiconductors, semiconductor fabs depend on a complex, global supply chain providing the essential building blocks for semiconductor device manufacturing, from silicon through final test,” said Ajit Manocha, SEMI president and CEO. “Incentives to strengthen the industry must be available to all links within the semiconductor supply chain to minimize potential bottlenecks upstream of chip fabs that could impede the growth of the industry in the United States.”

SEMI recommendations in the comments include:

• Strong federal manufacturing and research and development incentives for the entire semiconductor supply chain
• Competitive corporate tax policies
• Trade policies that open markets and eliminate barriers to trade
• Harmonized and pragmatic environment, health, and safety regulations
• Strong workforce development and immigration policies for high-skilled workers
• Narrowly tailored and multilateral export control policies

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Provides U.S. Commerce Department with Analysis of Semiconductor Supply Chain Risks and Recommendations on Strengthening Industry Resiliency