MILPITAS, Calif. — December 12, 2022 — The worldwide semiconductor industry is projected to invest more than $500 billion in 84 volume chipmaking facilities starting construction from 2021 to 2023, with segments including automotive and high-performance computing fueling the spending increases, SEMI announced today in its latest quarterly World Fab Forecast report. The projected growth in global factory count includes a record high 33 new semiconductor manufacturing facilities starting construction this year and 28 more in 2023.

“The latest SEMI World Fab Forecast update reflects the increasing strategic importance of semiconductors to countries and a wide array of industries worldwide,” said Ajit Manocha, SEMI president and CEO. “The report underscores the significant impact of government incentives in expanding production capacity and strengthening supply chains. With the bullish long-term outlook for the industry, rising investments in semiconductor manufacturing are critical to laying the groundwork for secular growth driven by a diverse range of emerging applications.”  
 

New Semiconductor Facilities Starting Construction by Region

The SEMI World Fab Forecast reports data from SEMI’s seven regions:

• In the Americas, the U.S. Chips and Science Act has vaulted the region into the lead worldwide in new capital spending as the government investment spawns new chipmaking facilities and supporting supplier ecosystems. From 2021 through next year, the Americas is forecast to start construction on 18 new facilities.

• China is expected to outnumber all other regions in new chip manufacturing facilities, with 20 supporting mature technologies planned.

• Propelled by the European Chips Act, Europe/Mideast investment in new semiconductor facilities is expected to reach a historic high for the region, with 17 new fabs starting construction between 2021 and 2023. 

• Taiwan is expected to start construction on 14 new facilities, while Japan and Southeast Asia are each projected to begin building six new facilities over the forecast period. Korea is forecast to start construction on three large facilities.  

The latest update of the SEMI World Fab Forecast report, published this month, lists more than 1,470 facilities and lines globally, including 162 volume facilities and lines with various probabilities that are expected to start production in 2022 or later. Download a report sample.  

For more information or to subscribe to the World Fab Forecast and other SEMI market research report, please contact the SEMI Market Intelligence Team (MIT) at [email protected]. More information on the SEMI market data portfolio is also available online.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Chip Industry Projected to Invest More Than $500 Billion in New Factory Construction Starts by 2024, SEMI Reports

HSINCHU, Taiwan – December 13, 2022 – Taking aim at hardening the Taiwan semiconductor ecosystem’s defenses against cyberattacks, SEMI has launched a Semiconductor Cybersecurity Risk Rating Service. Using third-party risk scoring and risk posture assessment, the service is designed to help SEMI Taiwan members assess cybersecurity risks in real time and provide risk remediation guidance. Launched by the SEMI Taiwan Cybersecurity Committee, the service was developed by SEMI Taiwan, Taiwan Semiconductor Manufacturing Company (TSMC) and other semiconductor industry partners.

“The new SEMI Semiconductor Cybersecurity Risk Rating Service will help Taiwan semiconductor companies bolster their cyber defenses as they deploy smart manufacturing practices that rely on greater connectivity both inside and outside of chip fabs,” said Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan. “Crucially, the service will also facilitate cybersecurity decision-making as semiconductor companies work with their supply chain partners.”

“Ever since we helped our suppliers adopt the assessment and security rating mechanism that is the foundation of the SEMI Semiconductor Cybersecurity Risk Rating Service, many security vulnerabilities have been exposed and repaired in a timely manner,” Dr. James Tu, Chairman of the SEMI Taiwan Cybersecurity Committee and Head of Corporate Information Security at TSMC. “This important service not only helps semiconductor companies monitor their suppliers' cybersecurity status, but also makes possible the comparison of supply chain cybersecurity standards and benchmarking.”

SEMI Semiconductor Cybersecurity Risk Rating Service – 5 Features

• Quantitative Risk Scores and Peer Comparison: Helps enterprises assess various cybersecurity risks, score risk exposure levels, and compare their cybersecurity defenses with those of peers to better understand their strengths and vulnerabilities both internally and externally.
• Self-Evaluation with General Questionnaire: Aids enterprises in conducting internal risk and vulnerability assessment. The general semiconductor industry questionnaire is tailor-made based on security-related experiences from across the Taiwan semiconductor industry.
• Risk Enhancement Recommendations: The service offers mitigation measures for each identified risk and re-evaluations once the measures are implemented, giving enterprises an immediate view of their cybersecurity optimization results and investment benefits.
• Continuous Risk Ratings: Continuous risk ratings help keep enterprises updated with changes in risk indices while helping them understand both cybersecurity management trends and how they can strengthen their cybersecurity.
• Objective Risk Ratings: Objective risk rating scores for enterprises to share with business partners to help deepen mutual trust.

The introduction of the SEMI Semiconductor Cybersecurity Risk Rating Service follows SEMI Taiwan’s January 2022 release of SEMI E187, the world's first cybersecurity standard for fab equipment.  

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Monica Hung/SEMI Taiwan
Email: [email protected]
Phone: +886.3.560.1777 ext. 207

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Taiwan Launches Rating Service to Strengthen Cybersecurity Across Taiwan Chip Ecosystem

BRUSSELS, Belgium — December 1, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded progress by the European Council on the European Chips Act, expressing strong support for the swift start of negotiations with the European Parliament in 2023.

With the European Council’s adoption today of its negotiating mandate, also known as its general approach, member states and the Czech Presidency of the Council have reached a critical milestone in supporting Europe’s efforts to advance semiconductor manufacturing and supplies of critical components while bolstering R&D for next-generation semiconductor innovations. 

“Europe's future as a region of semiconductor manufacturing excellence is brimming with possibility,” said Laith Altimime, president of SEMI Europe. “The adoption of the European Council’s general approach marks a critical step in the passage of the European Chips Act, a landmark initiative for our industry.”

The European Parliament’s Committee on Industry, Research and Energy (ITRE) is expected to vote on the European Union Chips Act report in January 2023. The Committee will then submit the approved text to plenary for adoption, a vote scheduled for February 2023. The text would constitute the European Parliament’s negotiating position and mark the last step before the start of trialogue negotiations among the European Commission, Parliament, and Council. 

“SEMI looks forward to continued collaboration with the European institutions and our member companies to ensure the timely adoption and implementation of the European Chips Act, putting Europe’s semiconductor industry on a competitive footing with other regions,” said Christopher Frieling, director of Advocacy and Public Policy at SEMI Europe.

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

For more details, contact the SEMI Europe Advocacy team:

• Christopher Frieling, director of Advocacy and Public Policy: [email protected]
• Marek Kysela, senior coordinator of Advocacy: [email protected]

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Commends European Council’s Progress on Chips Act, Urges Swift Start of Trialogue Negotiations

MILPITAS, Calif. – November 30, 2022 – Global semiconductor equipment billings rose 9% from the second to the third quarter of 2022 and 7% year-over-year to US$28.75 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

“Semiconductor equipment revenue growth in the third quarter remained in line with positive forecasts for 2022,” said Ajit Manocha, SEMI president and CEO. “The 9% quarter-over-quarter increase in equipment spending for Q3 reflects the semiconductor industry’s determination to bolster fab capacity to support long-term growth and technology innovation.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry.

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

Sources: SEMI (semi.huihuidehui.workers.dev) and SEAJ (www.seaj.or.jp), November 2022.
Note: Summed subtotals may not equal the total due to rounding.

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Interested parties may download an EMDS report sample.

For more information or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More information is also available online.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Semiconductor Equipment Billings Increase 9% in Q3 2022, SEMI Reports

SEOUL, South Korea ─ November 22, 2022 ─ SEMICON Korea 2023, the region’s premier microelectronics event, will gather industry experts and visionaries February 1-3 at COEX in Seoul for the latest developments and trends in areas critical to industry growth including sustainability, smart manufacturing, advanced chip technologies, and workforce development. Registration is open. 

The exhibition and conference will host Korea-based semiconductor powerhouses such as Samsung Electronics and SK hynix and other companies from across the supply chain as they showcase leading-edge semiconductor manufacturing technologies.

SEMICON Korea 2023 Highlights

• Keynotes by executives from industry leaders AMD, imec, and Lam Research on the future of the semiconductor industry
• Nearly 500 exhibitors at 2,000 booths
• 20 conferences and forums featuring presentations by more than 100 industry experts
• The popular Supplier Search Program hosting major chipmakers as they hold more than 100 meetings with equipment, materials and parts companies looking to expand their global footprint
• Insights on overseas business expansion opportunities at the U.S. Investment and Netherlands Tech forums.
• Forums on market trends, sustainability and smart manufacturing

The STS (SEMI Technology Symposium) at SEMICON Korea 2023 will showcase the latest technology advances and roadmaps in sessions on six key semiconductor manufacturing processes:

• Lithography
• Materials
• Device
• Etch
• CMP & Cleaning
• Packaging

Workforce Development

The Meet the Expert! Program returns with semiconductor engineers offering career development advice to STEM university students, while the Women-in-Technology program will feature perspectives from female leaders in high tech on promoting effective workplace practices for female engineers and their colleagues.

SEMICON Korea 2023 pre-registration gives attendees complimentary access to exhibitions and keynotes as well as early-bird conference discounts. Pre-registration is open until January 20, 2023.

See more details on the SEMICON Korea 2023 website.
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Jaegwan Shim/SEMI Korea
Phone: 82+10.3014.9807
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Korea 2023 to Showcase Sustainability, Smart Manufacturing, Advanced Chip Technologies and Talent

MILPITAS, Calif. — November 21, 2022 — SEMI today announced the election of three new members to the SEMI North America Advisory Board (NAAB): Dr. Sri Kommu, Executive Vice President and Chief Operating Officer at Brewer Science; Neeraj Khanna, Vice President at KLA; and Srinivas Subramanian, Executive Vice President at Nordson Corporation.

The Board appointments took effect Oct. 18, 2022. Members serve a three-year term. The SEMI NAAB is the principal advocate for member companies located in North America. The Board provides guidance on SEMI Americas programs designed to advance the business interests of member companies and address significant challenges in the electronics manufacturing and design supply chain.

“On behalf of the NAAB, we welcome Dr. Sri Kommu, Neeraj Khanna and Dr. Srinivas Srini Subramanian,” said Scott Balageur, Vice President of Global Business Development for the Edwards Vacuum North American Semiconductor Division and NAAB Chair. “The new Board members boast more than 75 years of combined industry experience. I’m confident that all three will make valuable contributions to the ongoing success of SEMI member companies in North America as the region sees unprecedented investment and is poised to seize significant opportunities across automotive electronics, electronic communications, data management and manufacturing end markets.”

As Executive Vice President and Chief Operating Officer at Brewer Science, Dr. Srikanth (Sri) Kommu leads the company’s semiconductor lithography materials, packaging solutions, and smart devices businesses. Prior to joining Brewer Science, Kommu served as Chief Technology Officer and Senior Vice President at SunEdison Semiconductor. Kommu has over 25 years of experience in the semiconductor industry. He has doctorate and master's degrees in chemical engineering from Washington University and a bachelor's degree in chemical engineering from the Indian Institute of Technology (BHU). He also completed the General Management Program from Harvard Business school and has served as an advisory board member at Washington University since 2012.

As Vice President of Semiconductor Process Control at KLA, Neeraj Khanna oversees customer engagement and strategic marketing. Khanna is a materials engineer with over 20 years’ experience in engineering, marketing, and product management. He holds an MBA from Duke University, a master’s degree in Material Science from the University of Tennessee and a bachelor’s degree from Indian Institute of Technology, Roorkee.

As Executive Vice President of Advanced Technology Solutions at Nordson Corporation, Dr. Srinivas (Srini) Subramanian is responsible for the company’s global electronics product portfolio including electronic process equipment and test and inspection offerings. He previously led Nordson’s advanced fluid dispensing industrial business. Subramanian has more than 25 years of industry experience in technology development, mergers and acquisitions, and management. He holds a doctorate in chemical engineering from the University of Akron and an MBA from Case Western Reserve University.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI North America Advisory Board Welcomes New Members from Brewer Science, KLA and Nordson Corporation

MUNICH, Germany ─ November 14, 2022 ─ Industry experts from across the electronics design and manufacturing supply chain will gather starting tomorrow at SEMICON Europa 2022 for the latest developments and trends across key semiconductor industry growth segments including advanced packaging, materials, medtech and mobility. Critical semiconductor industry issues such as sustainability, green manufacturing and workforce development will also highlight the event, 15-18 November at Messe München, in Munich, Germany. The SEMICON Europa exhibition and conferences are co-located with electronica.

“We look forward to perspectives from global thought leaders on semiconductor trends that are crucial to industry growth,” said Laith Altimime, president of SEMI Europe. “Companies from across the semiconductor supply chain will meet to explore new business and technology opportunities and ways to accelerate innovation.”

SEMICON Europa 2022 Highlights

• Opening Ceremony keynotes by industry leaders including Airbus, Athinia, Edwards Vacuum, imec, JCET Group, Porsche, Philips and Samsung.
• ITF Beyond 5G - Powered by imec will explore the role of advanced and compound semiconductors in paving the way to next-generation mobile connectivity.
• Advanced Packaging Conference – Companies including Amkor, ASE, Bosch, Henkel, Infineon and Intel will highlight advanced solutions for electronics packaging and testing, manufacturing equipment and materials, design for reliability and test, and Heterogeneous Integration (HI).
• Fab Management Forum will cover key topics such as chip manufacturing, datafication of fabs, and Artificial Intelligence (AI) in microelectronics manufacturing as the industry intensifies its focus on long-term resilience strategies in light of COVID-19 and recent supply chain disruptions. Presenting companies include Bosch, Maxwell Biosystems, Roland Berger, STMicroelectronics, TechInsights, Volkswagen and X-FAB Group.
• Executive Forum Program will delve into semiconductor industry topics such as materials innovation, Smart mobility, electrification and power semiconductors, Smart and green manufacturing and workforce development.
• TechARENA Program will address themes including integrated photonics, Smart medtech, sustainability, and global government incentives for semiconductor manufacturing.

Programs on the show floor in Hall B1 and C1 are complimentary for all SEMICON Europa and electronica visitors. For more details, please visit the SEMICON Europa 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Serena Brischetto at [email protected].  
 

SEMICON Europa 2022 Sponsors

• Platinum: Samsung and Tokyo Electron Europe (TEL)
• Gold: Edwards Vacuum and JCET Group
• Silver: Agilent, Cadence, centrotherm clean solutions, Evatec, Exyte, Flexciton, KLA, SÜSS MicroTec, and Welsh Government
• Event sponsors: ASE Global, Athinia, Atotech an MKS Brand, Comet Yxlon, Cryoin, DB Schenker, EBARA, EV Group (EVG), Government of Catalonia, INFICON, Koh Young Europe, Lab14, Lam Research, Merck KGaA, Darmstadt, Germany, Oakland County Michigan, Ovivo, SCREEN, time:matters, and ZEISS

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Europa 2022 Opens Tomorrow with Focus on Accelerating Semiconductor Industry Innovation

MILPITAS, Calif. – November 14, 2022 – SEMI announced today that Industry Strategy Symposium (ISS) 2023 will be held January 8-11 at the Ritz-Carlton in Half Moon Bay, Calif. with the theme  Reaching $1T the Right Way: A Sustainable Path. ISS is the year’s first executive check-in, offering perspectives from leading analysts, researchers, economists, and technologists on forces impacting the semiconductor industry. The annual symposium provides insights into growth opportunities and industry intelligence to help inform company business plans and forecasts based on current market conditions. Registration is open.  

ISS speakers will highlight regional and global investments that promise to drive the industry’s path to $1 trillion by 2023, with a focus on innovation and business opportunities in growth markets. Central themes at ISS 2023 will include semiconductor market drivers, private and public partnerships, technologies critical to extreme ultraviolet (EUV) innovation, supply chain resilience, environmental sustainability, and global cooperation across the supply chain.

“With unprecedented opportunities ahead for the semiconductor industry, top visionaries and experts will gather at ISS to deliver insights into the latest geopolitical and electronics industry developments and trends,” said Joe Stockunas, president of SEMI Americas and host of ISS. “C-suite executives will find the presentations compelling as they get a front-row seat at what to expect in the year ahead.” 

ISS 2023 Highlights

Keynotes

• Day 1: Keyvan Esfarjani, Executive Vice President, Chief Global Operations Officer,

Intel Corporation

• Day 2: Dave Keller, President and CEO, TSMC North America
• Day 3: Scott Gatzemeier, Corporate Vice President, Micron Technology
• Technology: Martin van den Brink, President and Chief Technology Officer, ASML

Economic trends and market forces shaping the electronics industry

• Executives and economists from Gartner, International Data Corporation (IDC), Linx Consulting, Macquarie Capital Markets, TechInsights and US-China Business Council

Insights into market and application drivers

• Top executives from Amazon Web Services, Google, McKinsey & Company and Microsoft

Technology trends

• Experts from Ayar Labs and Inpria

Global and local perspectives

• Thought leaders from Exyte, NXP Semiconductors, Samsung Electronics, and the U.S. Department of Commerce

Sustainability impacts on the semiconductor supply chain

• Experts from Applied Materials, Edwards Vacuum and JSR

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Industry Strategy Symposium 2023 to Highlight ‘Reaching $1T the Right Way: A Sustainable Path’

MUNICH, Germany ─ November 7, 2022 ─ SEMICON Europa 2022, the region’s premier event for the semiconductor manufacturing and design supply chain, will gather microelectronics experts and visionaries 15-18 November in Munich, Germany for insights into advanced technologies that are driving industry growth and critical issues such as sustainability, mobility, healthcare, workforce development and supply chain management. Registration for the event, co-located with electronica, is now open.

“We look forward to hosting industry leaders as they provide insights into microelectronics trends that are crucial to industry innovation and growth in Europe and around the world,” said Laith Altimime, President of SEMI Europe. “Key topics will take center stage as thought leaders address some of the world’s most pressing challenges.”

Opening Ceremony

SEMICON Europa 2022 will feature opening ceremony presentations by executive leaders on topics such as accelerating innovation, a sustainable and connected future, and European manufacturing excellence.

	Luc Van den hove, President and CEO, imec Deep Tech: The Lodestar to Meet the Challenges of the 21st Century
	Barbara Frenkel, Member of the Executive Board, Procurement, Porsche AG Enabling Collaboration in the Automotive Value Chain: Faster, More Transparent and Secure
	Kate Wilson, President, Semiconductor Division, Edwards Vacuum  Sustainability of the Semiconductor Industry
	Axel Fischer, VP, Foundry Business EMEA, Samsung Semiconductor Europe  Keynote Presentation
	Lee Choon Heung, Chief Technology Officer, JCET Group            Complex, Small, Cheap: How Packaging is Going to Power the Digital Age
	Laura Matz, Chief Science and Technology Officer, Merck KGaA, Darmstadt, Germany; and CEO, Athinia  How the Semiconductor Industry Can Leverage Data Expertise from Healthcare
	Grzegorz Ombach, Head of Disruptive R&T, Senior VP, Airbus  The Future of Air Travel Will Be Carbon Neutral and More Autonomous
	Frans van Houten, Former CEO, Royal Philips Keynote Presentation

More SEMICON Europa 2022 Highlights

Advanced Packaging Conference

Key to innovation, advanced packaging solutions require manufacturing equipment with enhanced capabilities, processing of new functional materials, and manufacturing process IP developed in-house or provided by third parties. Thought leaders will highlight advanced solutions for electronics packaging and testing, manufacturing equipment and materials, design for reliability and test, and Heterogeneous Integration (HI). Presenting companies include Amkor, ASE, Bosch, Henkel, Infineon and Intel.

Fab Management Forum

Experts will discuss topics such as chip manufacturing, datafication of fabs, and AI in microelectronics manufacturing as the industry intensifies its focus on long-term resilience strategies in light of COVID-19 and recent supply chain disruptions. Presenting companies include Bosch, Maxwell Biosystems, Roland Berger, STMicroelectronics, TechInsights, Volkswagen and X-FAB Group.

SEMICON Europa will also feature ITF Beyond 5G - Powered by imec. The event will explore the role of advanced and compound semiconductors in paving the way to next-generation mobile connectivity. Industry and imec experts will provide perspectives on various aspects of the RF challenge, from materials and devices to ICs and modules.

Executive Forum Program

• The Future of Work – Overcoming Industry Challenges Through Inclusive Leadership
• Materials Innovation – Surpassing Physical Limits in Microelectronics Technology
• Smart Mobility Forum – Smarter, Greener, Safer Mobility through Semiconductor Innovation
• Electrification and Power Semiconductors – Advances in the Field of Power Semiconductors for Next-Generation Applications
• Smart and Green Manufacturing Summit – Smart Solutions Paving the Way to Net-Zero Fabs

TechARENA Program

• Integrated Photonics – From the Electron Century to the Photon Century – Innovations and Challenges
• Smart MedTech Forum – Microelectronics Opening and Equalizing Healthcare
• Future of Computing – Semiconductor Based Solutions to Sustain Social Transformation: From Digitalization to Smart Devices
• Chips Hub Europe and Collaboration in Action – Breaking the Wall to Advanced Innovation in Semiconductor Industry and Beyond
• SCREEN – Innovation Inspired by Sustainability
• Meet the SEMIs – Meet the SEMI European Communities and Committee Members
• Greenfield vs. Brownfield – How Global Government Incentives Could Tip the Fab Balance
• Innovation Showcase – Innovations in the Space of Microelectronics and Semiconductors

For more details, please visit the SEMICON Europa 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Serena Brischetto at [email protected].  

SEMICON Europa Sponsors

• Platinum: Samsung and Tokyo Electron Europe (TEL)
• Gold: Edwards Vacuum and JCET Group
• Silver: Agilent, Cadence, centrotherm clean solutions, Evatec, Exyte, Flexciton, KLA, SÜSS MicroTec, and Welsh Government
• Event sponsors: ASE Global, Athinia, Atotech an MKS Brand, Comet Yxlon, Cryoin, DB Schenker, EBARA, EV Group (EVG), Government of Catalonia, INFICON, Koh Young Europe, Lab14, Lam Research, Merck KGaA, Darmstadt, Germany, Oakland County Michigan, Ovivo, SCREEN, time:matters, and ZEISS

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about SEMICON Europa 2022 Keynotes to Highlight Chip Industry Growth Opportunities and Advanced Technologies

MILPITAS, Calif. — November 7, 2022 — Industry 4.0 experts and visionaries will present at the SEMI Global Smart Manufacturing Conference (GSMC) starting tomorrow for two days to share state-of-the-art technologies and strategies designed to drive higher product quality, enhance production efficiencies and improve electronics manufacturing sustainability. Registration for the virtual conference is open.

Restricted travel and constraints on on-site access to experts across global semiconductor supply chains have accelerated the implementation of Smart Manufacturing strategies, big data analytics, autonomous systems and AI/ML technologies. Presentations at GSMC 2022, organized by the SEMI Smart Manufacturing Initiative, will focus on critical topics identified within the SEMI Smart Manufacturing Roadmap.

GSMC 2022 will feature six sessions (i=Intelligent):

• Session 1 – i-Acquire: Data Sources, Variety and Acquisition
• Session 2 – i-Insights: Current Point Systems
• Session 3 – i-Digital Twin: Multi-Level Digital Twin
• Session 4 – i-Predict: AI/ML Solution Integration
• Session 5 – i-Autonomy: Smart Autonomous Control
• Session 6 – Foundational Topics Including Sustainability and Cybersecurity

Smart Manufacturing leaders presenting at GSMC include:

GSMC 2022 Sponsors

• Advantest
• Inficon
• minds.ai

At GSMC 2022, SEMI will launch the Smart Manufacturing Initiative’s Industry 4.0 Readiness Assessment Model (IRAM) to help organizations assess their Industry 4.0 technology deployment progress. Developed through a collaboration of SEMI and industry experts, the model is intended to help companies across the semiconductor supply chain identify technology enhancements critical to scaling and sustaining their smart manufacturing transformation.

The SEMI Smart Manufacturing Initiative is global with chapters in the Americas, China, Europe, Japan, Korea, Southeast Asia and Taiwan. Group members collaborate on Smart Manufacturing challenges and opportunities in their regions.
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

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