SHANGHAI — August 23, 2022 — With sustainability, smart manufacturing and advanced packaging key to semiconductor industry growth and prosperity, SEMICON China 2022 will gather industry leaders and visionaries Oct. 5-7 at the Shanghai New International Expo Centre for the latest insights on these and other critical topics in the electronics industry. The world’s largest semiconductor conference and exhibition, SEMICON China is a key enabler of collaboration and innovation across the entire electronics supply chain including chip design, manufacturing, assembly and test, equipment and materials. Registration for the event, co-located with FPD China, is open.

SEMICON China 2022 Highlights

• Grand Opening Keynotes – Industry leaders will discuss global business and technology developments and market trends. A live broadcast of the keynotes will be accessible on the Grand Opening Keynotes webpage.

• Power & Compound Semiconductor International Forum – The two-day program will highlight topics including wide band gap power electronics, optoelectronics, compound semiconductors in communications, and emerging power device technologies.

• Supply Chain Theme: SEMI Innovation and Investment Forum (SIIP China) – The forum will focus on topics including economic environment, industry dynamics, trade disputes, STAR Market opportunities, international cooperation, equipment and materials procurement, semiconductor supply chain challenges and opportunities, and Internet of Things (IoT).

• Design Innovation Forum: Electronic System Design Alliance Session – ARM China, CIP United and China Flash will showcase their latest semiconductor design innovations.

• Semiconductor Manufacturing and Advanced Packaging Forum – Global industry leaders and experts will share insights into advanced manufacturing and heterogeneous integration with a focus on key technologies, equipment and materials, and supply chain development.

• Smart Manufacturing Forum – Major semiconductor manufacturers such as Amkor Technology, Intel, Lam Research and Huawei and their suppliers will discuss the latest smart manufacturing capabilities and best practices.

• Sustainable Development (Green High-Tech Facility) Forum – With the implementation of sustainability practices across the semiconductor supply chain growing in urgency, this forum will address ways the industry can balance its growth with decarbonization goals.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts
Cherry Sun
SEMI China
Email: [email protected] 
Phone: +86.21.6027.8548

Michael Hall
SEMI Headquarters
Email: [email protected]
Phone: 1.408.943.7988SEMICON China 2017 Presents Six Forums in China’s Explosive Growth Market

• Read more about SEMICON China 2022 to Highlight Sustainability, Smart Manufacturing and Advanced Packaging

MILPITAS, Calif. — August 16, 2022 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, today announced the appointment of semiconductor industry veteran John Cooney as Vice President of Global Advocacy and Public Policy. Based in the Washington, D.C. office and reporting to SEMI President and CEO Ajit Manocha, Cooney brings more than 20 years of public policy experience to the role.  

Cooney will oversee global government relations at SEMI, including directing strategies to manage and strengthen the association’s global public policy agenda and advocacy efforts. His work will include teaming with SEMI regional presidents to grow their government relations outreach and manage relationships with policymakers, association members and SEMI public policy committees.

“John Cooney’s deep global government relations and semiconductor industry expertise will be a tremendous asset to SEMI as we continue our work to help shape public policy in advancing the interests of our members and the industry,” Manocha said. “We are confident that he will quickly have an impact in this crucial time when governments around the world are enacting legislation and offering incentives to bolster their domestic semiconductor ecosystems and ensure the resilience of their supply chains.”

“I am honored to join SEMI at this exciting time for the semiconductor industry as countries worldwide intensify their focus on the semiconductor industry’s vital importance to the broader electronics supply chain and global economy,” Cooney said. “I look forward to working with representatives at SEMI member companies to build on the association’s work to shape government policies on trade, tax, talent, technology and other key issues to help ensure the industry’s continuing growth.”

Cooney replaces former SEMI Vice President of Global Advocacy and Public Policy, Joe Pasetti.

“We thank Joe Pasetti for his contributions to the SEMI Global Advocacy program, especially his leadership in seeking the inclusion of a tax credit for U.S. facilities that produce semiconductors or chipmaking equipment in the U.S. CHIPS and Science Act and advocating for SEMI member companies in the semiconductor manufacturing and equipment segments to be eligible for incentives,” Manocha said.

Cooney joins SEMI from SkyWater Technology, a Minnesota-based SEMI member company, where he served as Director of Government Relations. Prior to his role at SkyWater, he held several senior-level leadership roles in the U. S. Department of Commerce, including as Chief of Staff and Senior Advisor for the International Trade Administration and Deputy Assistant Secretary for Global Operations of the U.S. and Foreign Commercial Service

Cooney received his B.A. in Political Science from the University of Minnesota.  

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact   
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Appoints Industry Veteran John Cooney to Lead Global Advocacy and Public Policy

WASHINGTON D.C. — August 9, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the signing of the CHIPS and Science Act of 2022 by U.S. President Joe Biden. The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to chip manufacturers as well as semiconductor equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“The CHIPS and Science Act secures landmark investments to bolster semiconductor manufacturing and R&D infrastructure as well as a wide range of ancillary industries in the United States,” said Ajit Manocha, SEMI president and CEO, who attended the signing ceremony. “We thank President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction for their support in enacting the investment tax credit and funding for CHIPS Act programs.”

“SEMI looks forward to continuing collaboration with the U.S. government and our member companies to ensure timely implementation of these programs to strengthen the U.S. semiconductor supply chain,” said Manocha. “The CHIPS and Science Act funding will also be instrumental in buttressing the National Semiconductor Technology Center (NSTC), National Advanced Packaging Manufacturing Program and related programs in order to drive chip industry innovations that will better the lives of people around the world.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds President Biden’s Signing of CHIPS and Science Act of 2022

MILPITAS, Calif. — July 28, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the passage of the CHIPS and Science Act of 2022 by the United States House of Representatives. The bill provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for grants available to semiconductor manufacturers as well as equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“Enactment of the investment tax credit and funding for CHIPS Act programs was made possible by the steadfast support of President Biden, Secretary Raimondo, the original CHIPS Act sponsors, leadership in Congress and the committees of jurisdiction,” said Ajit Manocha, SEMI president and CEO. “We thank them for their leadership and support and look forward to working to ensure these policies and programs are implemented quickly and consistently with the objective of strengthening the semiconductor supply chain in the United States.”

“The investment tax credit and funding for CHIPS Act programs will be instrumental in bolstering semiconductor manufacturing and R&D along with a wide range of technology-reliant U.S. supply chains, create thousands of high-skill jobs, and keep pace with incentive programs around the world,” said Manocha. “With semiconductor manufacturing fabs heavily reliant on a complex mix of equipment and materials providers, the inclusion of these critical contributors in the incentives will help to ensure the competitiveness and resiliency of the U.S. semiconductor ecosystem.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds Final Passage of CHIPS and Science Act of 2022

MILPITAS, Calif. — July 27, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the passage of the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act of 2022 by the United States Senate and urged the House of Representatives to swiftly pass the legislation.

The bill provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs. The funding includes $39 billion for a grant program available to semiconductor manufacturers as well as equipment and materials suppliers and $11 billion for federal semiconductor research programs.

“It is crucial for the House to join the Senate in passing the investment tax credit and funding for CHIPS Act programs in order to bolster the semiconductor supply chain based in the United States and keep pace with industry incentives offered by other regions,” said Ajit Manocha, SEMI president and CEO. “These policies will strengthen semiconductor manufacturing and R&D in the U.S. while creating thousands of high-skill jobs. Ensuring the competitiveness and resiliency of the U.S. semiconductor ecosystem requires that semiconductor manufacturing equipment and materials providers – vital contributors to fabs – are included as eligible recipients of the incentives.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Commends Senate Passage of CHIPS Act of 2022, Urges House Approval

MILPITAS, Calif. – August 1, 2022 – With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2022) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 3-5, 2022 at the DoubleTree by Hilton in San Jose, Calif. SMC 2022 registration is open.

SMC is the premier event focused on drivers of advanced materials, highlighting opportunities for key materials across the electronics supply chain. Themed Materials Innovation – Powering a Trillion $ Semiconductor Industry, SMC 2022 will address the following key industry topics.

• Economic and Geopolitical Trends
• Technology Roadmaps
• Strategic Capital Driving Materials Innovation 
• Materials Driving Innovation for Emerging Logic and Memory Devices  
• Heterogeneous Integration  
• What Fabs Want from Materials Ecosystem: Executive Panel

According to McKinsey & Company, the global semiconductor industry is projected to reach $1 trillion by 2030, growth driven by markets including computing and data storage, wireless communication, and automotive, consumer and industrial electronics. Advanced semiconductor materials are key enablers of innovation in these and other segments.

Industry leaders presenting at SMC 2022 include:

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Strategic Materials Conference 2022 to Spotlight Innovations Paving the Way to $1 Trillion Semiconductor Industry

MILPITAS, Calif. — July 28, 2022 — Worldwide silicon wafer area shipments in the second quarter of 2022 surpassed the previous record high set in the first quarter of the year, edging up 1% quarter-over-quarter to 3,704 million square inches, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly report of the silicon wafer industry. Second-quarter silicon wafer shipments saw 5% growth from the 3,534 million square inches reported during the same quarter last year.

“Silicon shipments and demand remain robust driven by a strong semiconductor market,” said Anna-Riikka Vuorikari-Antikainen, Chairman of SEMI SMG and Chief Commercial Officer at Okmetic. “Inflation, as in the case of other wafer fabrication materials, continues to place upward pricing pressures on silicon. Wafer supply, in the face of continuing semiconductor fab expansions, remains constrained.”

Silicon Area Shipment Trends – Semiconductor Applications Only 

Source: SEMI (semi.huihuidehui.workers.dev), July 2022

Data cited in this release include polished silicon wafers such as virgin test and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductors are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Worldwide Silicon Wafer Shipments Set New Record in Q2 2022, SEMI Reports

TAIPEI — July 26, 2022 — With Taiwan forecast to rank as a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2022 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, September 14-16, 2022 at TaiNEX 1 in Taipei.

SEMICON Taiwan, the region’s largest semiconductor event with an expected 50,000 attendees, 2450 booths and 700 exhibitors, will spotlight seven key industry themes.

• Advanced Manufacturing
• Heterogeneous Integration
• Compound Semiconductors
• Auto Chips
• Smart Manufacturing
• ESG and Sustainability
• Semiconductor Cybersecurity

Taiwan is projected to maintain a top position in purchases of chipmaking equipment in 2022 and 2023 as global sales of total semiconductor manufacturing equipment reach a record $117.5 billion in 2022, according to the recent Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective announced by SEMI.

“Long a semiconductor manufacturing powerhouse, Taiwan is a key enabler of trends including digital transformation, supply chain resilience and sustainability and remains central to the semiconductor industry’s continuing growth,” said Terry Tsao, Global Chief Marketing Officer at SEMI and the President of SEMI Taiwan. “We look forward to hosting industry leaders at SEMICON Taiwan 2022 as they gather to collaborate and drive innovations that address some of the world’s most pressing challenges.”

SEMICON Taiwan 2022 Highlights

• TSMC, Intel, ASE, AMD, AUO and other industry leaders will discuss the latest advances in 2.5D/3D IC packaging solutions and advanced testing technologies at the Heterogeneous Integration Global Summit 2022, IC Forum, and Advanced Testing Forum.

• Audi, Denso, Bosch, PixArt, Foxconn, Win Semiconductor and Qorvo will share innovative automotive technologies and help strengthen the network of design and manufacturing partners at the Global Auto Chips Executive Summit, MEMS & Sensors Forum, and Power and Opto Semiconductor Forum.

• Rockwell Automation, Lam Research, and Siemens will focus on data management, intelligent testing and analysis, and smart factories through case studies that highlight smart manufacturing opportunities and challenges at the Smart Manufacturing Forum. 

• Microsoft and TXOne Networks will explore zero-trust architectures and supply chain cybersecurity governance and standards in an effort to reduce cybersecurity risks and strengthen supply chain resilience at the Semiconductor Cybersecurity Global Summit.

• The Workforce Development Program series will feature industry, government, and academia representatives discussing key topics including the Talent Development Seminar - Empowering Youth Employability, Women in Semiconductor (WiS) Seminar, and Diversity and Inclusion Seminar as the semiconductor industry works to expand awareness of career opportunities and recruit skilled workers vital to innovation and industry growth.  

• To support the Pathway to Net-Zero Emissions in 2050 initiative announced by the Taiwan government in March 2022, the ESG & Sustainable Manufacturing Summit and Strategic Materials Conference Taiwan will bring together leading companies to share their progress in achieving zero waste, reducing carbon emissions, and developing green innovations.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Monica Hung/SEMI Taiwan
Email: [email protected]
Phone: +886.3.560.1777 ext. 207

• Read more about SEMICON Taiwan 2022 to Highlight Auto Chips, Advanced Manufacturing, Heterogeneous Integration and Sustainability

MILPITAS, Calif. – July 19, 2022 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded progress in the United States Senate on a robust package of federal incentives for the semiconductor supply chain and urged its timely passage in Congress. The bill includes $52 billion in funding for new semiconductor programs, including $39 billion for a grant program available to semiconductor manufacturers as well as equipment and materials suppliers. Additionally, a 25% tax credit is included for facilities that produce semiconductors or semiconductor manufacturing equipment.

“To strengthen the semiconductor supply chain in the United States and keep pace with other regions offering incentives, it is crucial for Congress to pass CHIPS funding and the investment tax credit,” said Ajit Manocha, SEMI president and CEO. “With semiconductor manufacturing facilities heavily reliant on a complex supply chain of equipment and materials providers, it is particularly important that these vital fab suppliers are eligible for incentives to ensure the resiliency, competitiveness and growth of the complete U.S. semiconductor ecosystem. SEMI also supports the addition of an advanced semiconductor research tax credit, extending the investment tax credit to materials suppliers, and other proposed reforms.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.
 

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds Senate Progress on CHIPS Act of 2022, Urges Timely Congressional Approval

SAN FRANCISCO — July 14, 2022 — Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), SEMI FlexTech, a SEMI Technology Community, yesterday presented the 2022 FLEXI Awards at the FLEX Conference and Exhibition, co-located with SEMICON West 2022 Hybrid in San Francisco. The FLEXI Awards spotlight FHE contributions in four categories: R&D Achievement, Product Innovation and Commercialization, Environmental Sustainability Champion, and Industry Leadership.

R&D Achievement – Dr. Sheng Xu of the University of California, San Diego, was recognized for developing a fully integrated wireless ultrasound patch that conforms to the human skin and continuously records central blood pressure waveforms and heart rate variability when wearers are in motion. Entries were evaluated for their world-class research, originality, and commercial potential for expanding the scope of flexible or printed electronics or their manufacturing processes.

Product Innovation and Commercialization – E Ink won a FLEXI for its color-changing car, the BMW iX Flow. The car is wrapped in E Ink Prism™, the company’s ultra-low power, bistable technology, to enable dynamic color change between black and white. With the color changes, the BMW iX Flow can better reflect ultraviolet (UV) light to keep the car cooler or absorb UV to keep it warmer while helping extend the battery life and range of electric vehicles. Entries were evaluated for design and ingenuity, potential or proven market adoption, and revenue generation.

Environmental Sustainability Champion – Dr. Robert Praino, co-founder of CHASM Advanced Materials, received a FLEXI for his leadership in promoting discussions on environmental sustainability at FLEX Conference executive planning meetings. Praino led the push to add a session focused on sustainability and power consumption at FLEX Conference 2021 and 2022. A key focus of the session is the recycling of rare materials required to power many leading-edge flexible electronics devices. The recognition honors a champion of advancing environmental sustainability in the FHE industry.   

Flexible Electronics Industry Leadership – Michael Ciesinski was recognized for his contributions to building awareness of FHE and their impact on the larger electronics industry.  Ciesinski dedicated nearly 30 years to promoting flexible electronics collaboration, technology development and advancement as CEO of the U.S. Display Consortium, later renamed SEMI FlexTech Alliance, and as vice president of SEMI Technology Communities. Ciesinski was instrumental in building a strong and vibrant flexible, printed, and hybrid electronics community by promoting the FHE industry. He also helped secure federal and industry research funding to grow the FHE ecosystem. Ciesinski contributed to the establishment of the Flexible Display Center, the Center for Microelectronics Manufacturing, NextFlex, and the Manufacturing Innovation Institute for FHE manufacturing.

The 2022 FLEXI Award Committee consisted of representatives from Applied Materials, Eli Lilly, STMicroelectronics, and UES.

About the FLEXI Awards
FLEXI has been the flexible hybrid electronics industry’s premier award since 2009. The awards are sponsored by SEMI FlexTech, a SEMI Technology Community dedicated to the growth of the FHE industry.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI FlexTech Announces 2022 FLEXI Award Winners for Outstanding Achievements in Flexible Electronics