MILPITAS, Calif. – July 5, 2022 – The CHIPS Act, microelectronics industry resilience and the future of mobility will come into focus next week at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as industry leaders deliver keynotes and participate in executive panels on these and other critical topics focused on industry growth. Registration is open.

The event, North America’s premier exhibition and conference for the microelectronics supply chain, will gather more than 200 industry leaders, visionaries and technology experts for insights into the latest trends, innovations and developments across the electronics supply chain.

SEMICON West 2022 Hybrid will also highlight industry challenges and opportunities for overcoming pressing issues such as sustainability, chip scarcity and the semiconductor workforce shortage while addressing key themes including digital transformation, and heterogeneous integration.

SEMICON West 2022 Hybrid Keynotes

	Laurie E. Locascio, Under Secretary of Commerce for Standards and Technology Director of the National Institute of Standards and Technology (NIST)  NIST, Semiconductors, and the CHIPS Act
	Siva Sivaram, President of Technology and Strategy, Western Digital  Flash Forward: How A Global Supply Chain Enables the Data Revolution
	Berthold Hellenthal, Head of Computing and Semiconductors, CAVIAD, a Volkswagen Group Company  Semiconductor Innovation Driving Future Mobility
	Vanessa Ahktar, Director, Kotter The Science of Change: Navigating an Increasingly Chaotic World

SEMICON West 2022 Hybrid Executive Panels

Day 1 will also feature the following executive panels:

How Are You Shaping a More Resilient Supply Chain – Perspectives and Possibilities

Moderator: Bettina Weiss, Chief of Staff and Corporate Strategy, SEMI

Panelists:

• Bruce Tufts, Vice President,  Manufacturing Supply Operations, Director, Fab Materials Organization, Intel Corporation
• Boris Finselberg, Vice President, Global Sector Technology, DHL Customer Solutions & Innovation
• Doug Lefever, President & CEO, Advantest America; Executive Vice President, System Test Business Unit; Director, Managing Executive Officer Leader, Applied Research & Venture Team
• Carolin Seward, VP, Sourcing Operations for Silicon, Google
• Richard Barnett, Chief Marketing Officer, Supplyframe

The Value of a Veteran in the Workforce

Moderator: Larry Smith, Chairman, TEL U.S.

Panelists:

• General Paul E. Funk II, Commanding General, U.S. Army Training and Doctrine Command
• Katie Maloney, Business Line Manager, Edwards Vacuum
• Ann Kelleher, Ph.D., Executive Vice President and General Manager of Technology Development, Intel Corporation
• Shari Liss, Executive Director, SEMI Foundation
• Ajit Manocha, President and CEO, SEMI

SEMI Global Sustainability Summit Keynotes

With decarbonization building momentum worldwide, the Global Sustainability Summit will debut on Day 2 at SEMICON West 2022 Hybrid to help drive the collaboration necessary for the semiconductor industry to reduce its carbon footprint. Co-hosted by SEMI and McKinsey & Company, the summit comes as semiconductor ecosystem companies are increasingly committing to sustainability targets. 

Keynote speakers will include:

• Ryan Panchadsaram, Co-Author Speed and Scale; Partner, Kleiner Perkins; Former U.S. Deputy Chief Technology Officer
• Gary Dickerson, President and CEO, Applied Materials
• Arvind Krishna, CEO, IBM Mukesh V. Khare, Vice President, IBM – Conversation format
• Ann Kelleher, Ph.D., Executive Vice President and General Manager of Technology Development, Intel Corporation
• Mark Liu, Chairman, Taiwan Semiconductor Manufacturing Company (TSMC)
• Christophe Fouquet, EVP EUV Business Line, ASML Board Member, ASML
• Anand Nambiar, EVP, Semiconductor Materials, EMD Electronics
• Shally Venugopal, Principal & Vivid Economics, North America Leader, McKinsey & Company
• Vicki Hollub, President and CEO, Occidental Petroleum Corporation – Fireside chat

The FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, and the Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2022 Hybrid.  

COVID-19 Safety Protocols

To ensure the well-being of all its exhibitors and visitors, SEMI monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for in-person events.

Recorded programming of select speakers at SEMICON West 2022 Hybrid will be available on-demand July 13, 2022, through August 13, 2022. Visitors will have direct access to exclusive online exhibitors during the live event.

Follow SEMICON West on Twitter: #SEMICONWest

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON West 2022 Hybrid Keynotes and Executive Panels to Highlight CHIPS Act, Microelectronics Supply Chain Resilience, Sustainability, Mobility and Talent

GRENOBLE, France – June 7, 2022 – With MEMS and imaging sensor innovations driving an explosion in medical, mobility, communications and other Smart applications, the stage is set for the return of SEMI MEMS & Imaging Sensors Summit, 6-7 September, 2022, to the World Trade Center (WTC) in Grenoble, France. More than 400 industry experts will gather for insights into the latest technology developments and trends across the MEMS and sensors supply chain. Registration is open.  

Hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community, and Themed Intelligent Sensing for Better and Smarter Living, the summit will open with insightful executive keynotes and feature sessions on the following critical semiconductor industry topics.

Program Sessions

Session 1: A Diverse and Sustainable Workforce Enabling Next Generation Innovation
Industry leaders will explore how diversity drives innovation and ways companies and corporate leaders can create an inclusive environment where employees and innovation thrive.

Session 2: Market Brief
Industry trends, market drivers and supply chain dynamics will come into focus.

Session 3: Insights into Emerging Applications
Experts will share their vision for emerging sensor applications and discuss the latest developments in biosensors, MEMS, photonics and spectroscopic technologies.

Session 4: Intelligent Sensing
Discussions will highlight new sensor technologies that enable fast and reliable edge computing to pave the way for smarter applications in industries such as automotive and medical.

Session 5: Technology Showcase
This session will spotlight the latest MEMS and imaging sensor products and applications. Deep and traditional tech companies and startups as well as researchers developing new products will demonstrate cutting-edge solutions. Companies can submit their product demonstration abstracts by June 30.

Session 6.1: MEMS Advancements 
Industry leaders will discuss new MEMS technology applications, devices and manufacturing trends. Application topics will include the integration of several sensors into System in Package (SiP), MEMS for medical sensing, and integrating data generation and data processing into the same system. Manufacturing topics will include advancements enabling 300mm wafer sizes, 3D integration and substrate diversification.

Session 6.2: Imaging Advancements 
Industry leaders will share their visions for sensing processes, design and computing.

Session 7.1: Environmental MEMS Technology Focus
Future MEMS-enabled environmental technologies that drive advances in everything from preventative maintenance and quality control to environmental monitoring will come into sharp focus.

Session 7.2: The Latest on Short-wave Infrared (SWIR)
This session will explore the latest advancements in traditional SWIR imaging technology from Lynred and the promise of new quantum dot SWIR image sensors from STMicroelectronics and Emberion. It will also cover insights from imec on new consumer applications enabled by affordable sensors, and a low-cost solution for SWIR hyperspectral imaging introduced from VTT.

Session 8: Materials and Equipment Advancements
Experts will discuss how materials and equipment advances are enabling higher performance MEMS devices for new manufacturing techniques and equipment.

Session 9: Optics, Co-Packaged Optics (CPO) and Optical Chips Packaging for MEMS and Imaging Sensors
Rapid growth of cloud data presents new speed and bandwidth requirements. Industry leaders will explore the integration of optics and silicon through CPO to meet growing performance demands and reduce power consumption.

More MEMS & Imaging Sensors Summit Highlights

• Networking opportunities at the exhibition and a gala dinner for attendees of both MEMS and imaging sensor tracks to meet in-person.
• Exhibition showcasing leading companies driving the future of MEMS/imaging and sensors design and manufacturing including:
  • ASE Group
  • DELO Industrial Adhesives
  • Eurofins MASER B.V.
  • EV Group (EVG)
  • Evatec
  • Fraunhofer IPMS
  • KLA
  • Okmetic Oy
  • SAES Getters SpA
  • SCHOTT
  • SET
  • Siemens EDA (represented by EDA Solutions Limited)

Premier sponsors

• Platinum Sponsors: ASE Group, Infineon, KLA, SCHOTT
• Gold Sponsors: Evatec, SUSS MicroTec Group
• Silver Sponsor: AEM
• Event sponsors: Caeleste, EV Group (EVG), JSR Micro N.V., Okmetic

For more information, please visit the MEMS & Sensors Imaging Summit website.

Stay in touch on Twitter @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto
SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about Intelligent Sensing for Better and Smarter Living – MEMS & Imaging Sensors Summit Returns to Grenoble

MILPITAS, Calif. – June 23, 2022 – MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, today announced a Request for Proposals (RFP) for funding the development and manufacture of advanced positioning, navigation and timing (PNT) sensor components and systems. SEMI MSIG will award funding to U.S. teams or organizations with a wide range of research and development capabilities. White paper proposals are due July 15, 2022 at 5:00pm PDT. The RFP contains details about the proposal submission process.

Today, when a GPS signal is lost, commercial PNT solutions use inertial measurement units (IMUs) to maintain positioning accuracy. Over time, however, the accuracy becomes less reliable due to accumulated IMU errors. The initiative aims to drive PNT innovations that pinpoint the position of mobile and stationary assets and enable reliable navigation in critical situations.

The RFP marks another partnership between SEMI MSIG and the Army Research Lab (ARL) PNT consortium to address common challenges, innovate, and accelerate business and technical results. ARL has identified the following research and development focus areas under the project:

• Thrust Area 1: Novel Materials, Fabrication, and Packaging Techniques for Low-SWaP (small size, weight and power consumption) Inertial and PNT Sensors
• Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, and PNT Sensors
• Thrust Area 3: Advancements Towards Low-SWaP, GPS-Free PNT Technologies

The SEMI MSIG Technical Council and ARL subject matter experts will evaluate, prioritize and manage the proposals and their resulting projects. Funding granted by SEMI MSIG for the projects must be matched with cash and in-kind contributions from the grant recipient’s organization to cover total project costs. Organizations awarded funding for SEMI projects in the past have contributed 58% of the funding for the development program, with a minimum contribution of 50%.

The new round of R&D funding builds on the Phase 1 SEMI MSIG PNT program launched in 2020 to identify novel approaches to PNT solutions for GPS-denied environments. Emphasis will be placed on system solutions, including machine learning and sensor fusion software, cost-effective process innovation, advanced packaging solutions, component innovations, and disruptive materials development. R&D may include software, hardware, and advanced packaging requirements of optical and MEMS-based positioning and timing systems that improve bias stability and reduce sensor noise while advancing system-level performance to further the state of the art.

SEMI MSIG provided details about the RFP in a webinar last month and encourages candidates  to review the RFP and watch the webinar before submitting a proposal. The proposal due dates noted in the webinar have been extended, and the correct dates are in the RFP.
 

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI MEMS & Sensors Industry Group Invites Proposals for Funding of Positioning, Navigation and Timing Technology Innovations

PENANG, Malaysia – 20 June 2022 – Spotlighting critical issues including sustainability and supply chain resilience, SEMICON Southeast Asia 2022, the region’s premier gathering of the semiconductor and microelectronics industry, opens tomorrow as experts convene for insights into the latest industry trends, developments and innovations. Returning to the Setia SPICE Convention Centre in Penang for the first time in three years due to the pandemic, the 21-23 June event will connect semiconductor manufacturing equipment companies, private and public partners, and other key industry stakeholders to explore new collaboration and growth opportunities.

Themed Forward as One – Building A Resilient and Sustainable Electronics Supply Chain in Southeast Asia, SEMICON Southeast Asia 2022 will commemorate Malaysia’s 50^th year of manufacturing excellence and celebrate Penang’s reputation as the Silicon Valley of the East. The exhibition and conferences are expected to draw more than 10,000 attendees and will feature two themed pavilions, two global pavilions, and technology forums to address key electronics manufacturing supply chain issues and trends.

The CxO Summit at SEMICON Southeast Asia 2022 will bring together industry thought leaders for perspectives on how companies across the supply chain can become more resilient to overcome industry disruptions such as the pandemic and chip shortage. Speakers will include:

• Ajit Manocha, President and CEO of SEMI – Welcome Speech
• Datuk Arham Abdul Rahman, CEO of Malaysian Investment Development Authority Malaysia (MIDA) – Opening Speech
• KC Ang, Chairman of the SEMI SEA Regional Advisory Board and Senior Vice President of Global Fab Operations at GlobalFoundries Singapore – Building Resiliency and Sustainability in the Semiconductor Industry
• Tim Archer, President and CEO of Lam Research – The Future of Innovation and Collaboration: The Semiverse
• Irving Tan, Executive Vice President of Global Operations at Western Digital – Supply Chain Resiliency
• Herbert Blaschitz, Executive Vice President, ATF, at Exyte Singapore – Creating Sustainable and Smart Wafer Fabs for the Future
• Chan Ping Chong, Vice-Chairman of the SEMI Southeast Asia Regional Advisory Board, and Smart Manufacturing Executive Vice President and General Manager of Product and Solutions at Kulicke & Soffa, Singapore – Advocating a Sustainable Supply Chain in the New Age of Digitalization
• Glen Brownlie, Vice President of Malaysian Operations at ams-Osram Malaysia – Optical Solutions in Digitization and Smart Living

The panel discussion Building a Resilient & Sustainable Electronics Supply Chain will culminate the CxO Forum.

Other SEMICON Southeast Asia 2022 Highlights

• Smart and Sustainable Manufacturing Journey will focus on state-of-the-art technologies that can increase manufacturing efficiency and world-class sustainable practices.
• World of IoT Pavilion will highlight start-ups and their latest technologies and solutions enabled by semiconductor innovation.
• Technical Forums will offer insights on industry and technology trends whilst providing networking and other information-sharing opportunities.
• Workforce and Talent Development Pavilion will feature the region’s largest E&E career fair and career talks by industry experts to help the industry build its talent pipeline.
• SEMICON University Program will feature aspiring leaders from the E&E industry and a robust panel to engage in a discussion on Diversity, Equity and Inclusivity (DEI).

Visit the SEMICON Southeast Asia 2022 website for more information.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Media Contacts

Ryan Teo
SEMI Southeast Asia Pte Ltd
[email protected]
+65 9859 0883

Reshvinder Kaur (for SEMI Southeast Asia Pte Ltd)
[email protected]
+6017 275 7985

• Read more about SEMICON Southeast Asia 2022 Opens Tomorrow With Focus on Sustainability and Supply Chain Resilience

Global fab equipment spending for front-end facilities is expected to increase 20% year-over-year (YOY) to an all-time high of US$109 billion in 2022, marking a third consecutive year of growth following a 42% surge in 2021, SEMI announced today in its latest quarterly World Fab Forecast report. Fab equipment investment in 2023 is expected to remain strong.

"The global semiconductor equipment industry remains on track to cross the $100 billion threshold for the first time as shown in our latest update of the World Fab Forecast,”said Ajit Manocha, president and CEO of SEMI. “This historic milestone puts an exclamation point on the current run of unprecedented industry growth.”

Fab Equipment Spending by Region

Taiwan is expected to lead fab equipment spending in 2022, increasing investments 52% YoY to US$34 billion, followed by Korea at US$25.5 billion, a 7% rise, and China at US$17 billion, a 14% drop from its peak last year. Europe/Mideast is forecast to log record high spending of US$9.3 billion this year and, while comparatively smaller than outlays in other regions, its investments would represent a staggering growth of 176% YoY. Taiwan, Korea and Southeast Asia are also expected to register record-high investments in 2023.

In the Americas, the report shows fab equipment spending reaching US$9.3 billion in 2023, a 13% YoY rise following a 19% YoY increase in 2022, with the region retaining its fourth-place ranking both years in worldwide fab equipment spending.

Semiconductor Industry Continues to Boost Capacity

The SEMI World Fab Forecast report shows the global industry increasing capacity 8% this year after a 7% rise in 2021. Capacity growth is expected to continue in 2023, rising 6%. The fab equipment industry last saw a YoY growth rate of 8% in 2010, when it topped 16 million wafers per month (200mm equivalents) – nearly half of the 29 million wafers per month (200mm equivalents) projected for 2023.

Over 85% of equipment spending in 2022 will stem from capacity increases at 158 fabs and production lines, a proportion expected to edge down to 83% next year as 129 known fabs and lines add capacity.  

As expected, the foundry sector, with a share of about 53%, will account for the bulk of equipment spending in 2022 and 2023, followed by memory at 33% in 2022 and 34% in 2023. The two sectors also account for the largest capacity increases.

The latest update of the SEMI World Fab Forecast report, published in June, lists more than 1,400 facilities and lines globally, including 133 future facilities and lines with various probabilities that are expected to start volume production.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.devto learn more, contact one of our worldwide offices, and connect with SEMI onLinkedIn andTwitter

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022, SEMI Reports

MILPITAS, Calif. – June 7, 2022 – Sustainability, smart technologies and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as more than 200 industry leaders, visionaries and technology experts convene to present insights into the latest trends, innovations and developments across the microelectronics supply chain. The event, North America’s premier exhibition and conference for the microelectronics supply chain, will feature on-site keynotes, fireside chats, and executive panels with thought leaders from the semiconductor ecosystem, academia and government. Registration is open.

With decarbonization building momentum worldwide, the Global Sustainability Summit will debut at SEMICON West 2022 Hybrid to help drive the collaboration necessary for the semiconductor industry to reduce its carbon footprint. Co-hosted by SEMI and McKinsey & Company, the summit comes as semiconductor manufacturers are increasingly committing to sustainability targets. In parallel, SEMI member companies are joining forces with startups to enable a greener chip industry as part of the SEMI Sustainability Initiative.  

SEMICON West 2022 Hybrid will also highlight opportunities for overcoming other worldwide challenges such as unmet demand for chips and the semiconductor workforce shortage while addressing key themes including government investment in chip manufacturing, digital transformation, and heterogeneous integration.

“With strong progress on CHIPS Act passage and significant new fab investments in the U.S., we’re thrilled to welcome back key semiconductor industry players to SEMICON West in July to explore new business and collaboration opportunities at the heart of continuing innovation,” said Joe Stockunas, president of SEMI Americas. “Companies from across the entire supply chain will network and showcase the latest technologies and products as we invite them to join the industry’s sustainability push, which is key for it to thrive.”

SEMICON West 2022 Hybrid Smart Pavilions

• Smart Manufacturing Pavilion – The pavilion will feature data-sharing breakthroughs that are leading to smarter manufacturing processes, higher yields, and new semiconductor innovations. Thought leaders will engage attendees at the Meet the Experts Theater on topics including advances in sensors, processors, memory, 5G, and silicon photonics for improving data-sharing across the microelectronics supply chain. Emerging IC technologies for connected intelligence in electronics manufacturing will also be in focus.

• Smart Mobility Pavilion – Leading all new application spaces in chip growth, the transportation and mobility markets promise to fuel the expansion of segments such as flexible hybrid electronics (FHE), MEMS and sensors. The pavilion will also showcase semiconductor industry growth opportunities through advances in areas including autonomous vehicles, Internet of Things (IoT) applications, 5G and artificial intelligence (AI).
• Smart MedTech Pavilion – The pavilion will focus on future MedTech markets and applications and include technology demonstrations. Industry experts will discuss medical wearables and point-of-care instrument innovations driven by development of MEMS-based sensors and actuators.
• Workforce Development Pavilion – Building the microelectronics industry’s talent pipeline to sustain the current pace of innovation and growth is a top priority. Targeting both new strategies for recruiters and tactics for job seekers, the pavilion will highlight entry-level opportunities, searching for a job during uncertain times, and why microelectronics is a smart career choice.

SEMICON West 2022 Hybrid Sessions

• SEMI Market Symposium – Market trends and drivers and a midyear update on forecasts and insights on semiconductor equipment and materials, electronics design, and the manufacturing supply chain.   
• Bulls & Bears – Perspectives on key semiconductor industry trends from Wall Street analysts in a moderated panel discussion.
• TechTALKS – Discussions with experts on advanced manufacturing, materials, silicon photonics, MEMS and sensors, and heterogenous integration.
• Test Vision Symposium – Insights from providers and users of test IP and equipment on coming trends and innovations.

The FLEX Conference, the annual event focused on flexible hybrid and printed electronics innovations, and the Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2022 Hybrid.

COVID-19 Safety Protocols

To ensure the well-being of all its exhibitors and visitors, SEMI monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for in-person events.

Recorded programming of select speakers at SEMICON West 2022 Hybrid will be available on-demand July 13, 2022, through August 13, 2022. Visitors will have direct access to exclusive online exhibitors during the live event.

Follow SEMICON West on Twitter: #SEMICONWest

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON West 2022 Hybrid to Spotlight Sustainability, Smart Technologies, Talent

BRUSSELS, Belgium ─ May 30, 2022 – Key executives from leading semiconductor companies, market analysts, economists and policymakers gather today for insights into the latest electronics industry trends, challenges and opportunities in Brussels, Belgium at the annual Industry Strategy Symposium Europe (ISS Europe) 2022.

Themed Resilient Europe: Semiconductors Enabling a Sustainable Digital Life, ISS Europe 2022 will present economic, technology, market, business, and geopolitical developments influencing the global electronics manufacturing industry as well as their implications for strategic business decisions.

ISS Europe Speakers

	Luc Van den hove, President and CEO, imec  Deep Tech: The Lodestar to Meet the Challenges of the 21st Century
	Lucilla Sioli, Director for Artificial Intelligence and Digital Industry, DG CNECT The EU Chips Act: Ensuring Europe’s Digital Sovereignty
	Sven Smit, Chairman McKinsey Global Institute, McKinsey & Company Lives and Livelihoods, Lost and Disrupted
	Jens-Knut Fabrowsky, Executive Vice President Automotive Electronics, Robert Bosch GmbH Panel Discussion: Strengthening Europe’s Supply Chain Resilience: What Would It Take to Double European Capacity?
	Kate Wilson, President, Semiconductor Division, Edwards Vacuum  Environmental Sustainability Through Collaboration

Session 1: Making Environmental Sustainability Happen

Speakers will explore how semiconductor companies can comprehensively focus on sustainability, embed green practices and target disruptive innovations to reach environmental goals now being established worldwide. 

Session 2: Empowering a Diverse Workforce to Achieve the European Commission Goal by 2030

Experts will discuss internal organizational strategies and initiatives for a healthier and more inclusive work environment, including promoting industry role models.  

Session 3: Strengthening Europe’s Supply Chain Resilience: What Would It Take to Double European Capacity?

Europe is well-positioned to expand its semiconductor manufacturing sector, enable greater semiconductor supply chain resilience and ultimately fuel EU economic growth. Speakers will discuss opportunities for Europe to grow its semiconductor independence and global impact.

Each symposium session will feature a panel discussion.

European SEMI Award

Each year since 1989, SEMI Europe has presented the European SEMI Award to a person or team who has made a significant contribution to the European semiconductor, micro-systems, photovoltaic, or display industries. SEMI Europe will announce the 2021 award winner today.

Premium sponsors: Accenture, ASM, DAS Environmental Experts, DB Schenker, Ebara, Edwards, EV Group, Flexciton, Huawei, imec, LAM Research, Lynceus, NXP, OVIVO, Schneider Electric, TEL, VAT and Watlow.

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#ISSEurope).

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about SEMI ISS Europe Opens With Spotlight on Sustainability, Supply Chain Resilience and Talent

Brussels, Belgium ─ May 30, 2022 ─ Imec President and CEO Luc Van den hove today received the 2021 European SEMI Award and Soitec CEO Paul Boudre the 2021 Special Service Award at the SEMI Industry Strategy Symposium Europe (ISS Europe 2022). Established more than 30 years ago, the European SEMI Award recognizes key players in the global manufacturing supply chain, highlighting their leadership excellence and strategic contributions that led to critical advances in the semiconductor industry.

“We applaud Luc Van den hove and Paul Boudre for their excellent work and outstanding research and development leadership and contributions to the European semiconductor community,” said Laith Altimime, president of SEMI Europe.

“The strong bonds between SEMI and imec go back a long way,” Luc Van den hove said. “We both understand that our industry’s grand challenges can only be addressed successfully if the entire ecosystem joins forces. In light of today’s economic and geopolitical turmoil, I feel – more than ever – committed to step up as a fierce proponent of regional and global collaboration. With this ambition in mind, I accept this year’s European SEMI Award with great pleasure.”

Van den hove received his Ph.D. in electrical engineering from the KU Leuven in Belgium. He joined imec in 1984, starting his research career in the field of silicide and interconnect technologies and became manager of the imec micro-patterning group (lithography and dry etching) in 1988. In 1996, Van den hove was appointed department director of unit process step R&D, and in 1998 vice president of the silicon process and device technology division. In January 2007, he was appointed imec EVP and COO and has served as president and CEO of imec since 2009.

“I am very honored and grateful for this recognition by SEMI and my peers for a career entirely dedicated to semiconductors,” said Paul Boudre, CEO of Soitec. “Over decades, I had the chance to learn every day from interacting with amazing customers, suppliers and partners around the globe. I am also proud of what we achieved together, positioning semiconductors as a strategic industry in Europe. Above all, I feel privileged to have been given the opportunity to lead exceptional women and men who have enabled sustainable innovations that change the daily lives of billions of people.”

Boudre holds a graduate degree in chemistry from France’s Ecole Nationale Supérieure de Chimie de Toulouse. He joined Soitec in 2007 as Director of Sales, Marketing and Business Development. He has been the CEO since 2015 and a member of the Board of Directors. During his 10 years at KLA-Tencor, he led the group’s European operations, then served as VP for Europe and the U.S. He held management duties in the industrial units of IBM Semiconductor (now part of GlobalFoundries), STMicroelectronics, Motorola Semiconductor (now part of NXP Semiconductors), and Atmel. Boudre has been active in the semiconductor industry for 30 years.

Nominations for the 2022 SEMI European Award are open. Please see award guidelines. Prior European SEMI Award recipients hailed from companies including CEA-Leti, Technical University of Dresden, Catholic University of Leuven, STMicroelectronics, EV Group, Infineon, and the Fraunhofer Institute. See the list of past SEMI European Award recipients.

For more details, please visit the European SEMI Award website and connect with SEMI Europe on Twitter or LinkedIn – @SEMIEurope, #EuropeanSEMIAward.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about SEMI Europe Honors Luc Van den hove of imec and Paul Boudre of Soitec for Outstanding Leadership in Microelectronics

MILPITAS, Calif. – June 1, 2022 – Global semiconductor equipment billings grew 5% year-over-year to US$24.7 billion in the first quarter of 2022, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report. Quarter-over-quarter billings in the seasonally soft first quarter declined 10%.  

“Year-over-year first quarter equipment revenue growth is in sync with positive forecasts for 2022 as the semiconductor industry continues its robust increase of fab capacity,” said Ajit Manocha, SEMI president and CEO. “North America and Europe logged healthy quarter-over-quarter rises in equipment spending as they intensify efforts to bolster domestic chipmaking.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the Worldwide SEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Semiconductor Equipment Billings Grow 5% Year-Over-Year in Q1 2022, SEMI Reports

BRUSSELS, Belgium ─ May 30, 2022 ─ SEMI Europe, the industry association that unites the entire electronics manufacturing and design supply chain in Europe, today urged swift adoption of the European Chips Act and invited discussions on the legislation with the European Parliament, Member States and the European Commission. The Act aims to strengthen Europe’s competitiveness and resilience in semiconductor technologies and applications while enabling the region’s digital and green transition.

“Speedy adoption of the European Chips Act will significantly accelerate Europe’s work to attract investments to build up chip manufacturing capacity and R&D,” said Laith Altimime, president of SEMI Europe. “The Act is also a key step forward for Europe to substantially decarbonize semiconductor manufacturing and drive digital transformation.”

The European Council and Parliament continue to refine the European Chips Act with inputs from semiconductor industry stakeholders. A newly published SEMI Europe position paper offers the following recommendations for consideration of the European Commission, the Parliament, and the Council:

Chips for Europe Initiative

• Strengthen R&D capabilities and ensure adequate funding.
• Align new and existing pilot lines with anticipated future needs and trends and support open access to all parties within the EU semiconductor value chain.
• The Chips Joint Undertaking needs to target Europe’s semiconductor industry needs.
• Establish a dedicated skills and workforce development funding stream under the Chips Joint Undertaking.

Security of Supply

• Provide a first-of-a-kind classification to target all relevant technology projects.
• Foster fast track procedures.

Preparedness and Monitoring

• Minimize risks to the semiconductor value chain and overall EU economic system.
• Eliminate redundant data reporting requirements that cause administrative inefficiencies for semiconductor companies.
• Establish requirements for safeguarding the confidentiality of industry data.
• Encourage European initiatives with global partners, such as the EU-U.S. Trade and Technology Council.

Governance

• Include stakeholders in Europe’s semiconductor ecosystem.

SEMI Europe also co-authored and signed a Joint Industry Statement with other industry stakeholder organizations representing the worldwide and European semiconductor ecosystem. The statement urges the European Commission, the Parliament, and the European Council to do the following:

• Focus on investment conditions and opportunities to enhance European competitiveness.
• Create a crisis response framework to help alleviate semiconductor industry disruptions.
• Involve the semiconductor industry in Europe Chips Act governance.
• Coordinate actions with global partners.

For more details, contact SEMI Europe:

• Christopher Frieling, Director of Advocacy and Public Policy: [email protected]
• Marek Kysela, Senior Coordinator of Advocacy: [email protected]

Visit SEMI Global Advocacy and SEMI Europe Advocacy to learn more about SEMI public policy efforts.

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit semi.huihuidehui.workers.dev to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about SEMI Europe Urges Swift Adoption of European Chips Act