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Deventer, December 15, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and NOVELDA, the world leader in UWB (Ultra-Wideband) sensing solutions, today announce that the companies have reached agreement on the qualification, test and supply of NOVELDA’s new generation of UWB devices. The Ultra-Wideband Sensor can detect the tiniest movements, even breathing and heartbeat. This ability enables NOVELDA to offer the most reliable human presence sensor in the world. It will automatically activate a device like a laptop, an LCD screen or a ceiling lamp, when you need it, and turn the device off when you leave. This is useful in a variety of indoor applications in consumer electronics, building automation and in smart building systems. NOVELDA UWB Sensor enables new levels of user experience, increases safety, and reduces energy consumption.

The cooperation with RoodMicrotec as European partner enables NOVELDA to manage faster qualification and industrialization of new products. Effective collaboration, both on engineering and management level, and combining each partner’s expertise is allowing ‘first time right’ development of test solutions, qualification processes and rapid launch of production testing and supply. Furthermore, being a long-term partner, RoodMicrotec will support NOVELDA in continuously optimizing testing procedures to drive cost down over time.

RoodMicrotec will be partnering with NOVELDA in serving the global UWB market, which is forecasted by TSR (Techno System Research) to reach from 300 million units shipped in 2022 towards more than 1.8 billion units shipped by 2030.
“This collaboration provides us with faster time-to-market of our innovative UWB solutions, continuity of supply and constant focus on improvements both in quality and cost”, says Jan-Bjørnar Lund, NOVELDA’s CEO.
For RoodMicrotec, this partnership matches well within its portfolio of capabilities and services, as European leading test house.

Martin Sallenhag, CEO of RoodMicrotec, says: “This partnership is right within the sweet spot of our business proposition; combining our expertise with our customers' interests. We support our customers with state-of-the art RF test development and equipment in 24/7 highly flexible production test environment, complying with world class quality standards.”
 
About NOVELDA
NOVELDA, the world leader in UWB sensing solutions, provides the world’s most accurate, intelligent and reliable sensor solution for human presence detection. NOVELDA Ultra-Wideband (UWB) short-range impulse radar sensors help save energy and achieve new levels of user experience and interactivity in a variety of indoor applications, including consumer electronic devices and smart building systems. NOVELDA technology complies with worldwide UWB regulations and is protected by several design patents.

Further information
Tove Elisabeth Lutdal – VP Marketing
Phone: +47 90 73 49 49 Email: [email protected] Web: www.novelda.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Phone: +31 570 745623 Email: [email protected] Web: www.roodmcirotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

Breker Verification Systems, the leading provider of advanced test content synthesis solutions, today unveiled the Breker Integrity FASTApps™ Portfolio, a library of automated test generation intellectual property (IP) elements targeting difficult-to-verify processor core and system-on-chip (SoC) scenarios.

The FASTApps provide commercial-grade, high-coverage verification for RISC-V processor cores and the SoC platforms that use them.

“The RISC-V Open ISA concept, while powerful, introduces verification challenges to engineering teams unfamiliar with processor complexities,” observes David Kelf, Breker’s CEO, an active RISC-V Consortium member involved with a public effort to improve RISC-V verification methodologies. “By automating test content generation, Breker’s years of verification experience can be encapsulated and applied across many projects, driving high test coverage with a minimal level of effort.”

Breker’s new Integrity FASTApps, ideal for the verification of processors based on the RISC-V Open Instruction Set Architecture (ISA) provide specific test sets for both processor core integrity and the System-on-Chip (SoC) that encompass these cores.
The Processor Core Integrity FASTApps include commonplace, but hard-to-verify scenarios such as load store integrity, random instruction testing, register-to-register hazards, conditionals and branches, exceptions, async. interrupts, privilege level switching, core security, exception testing (memory protection and machine-code integrity), virtual memory/paging and core coherency.

In addition, the SoC Integrity FASTApps include random memory and register tests, system interrupt testing (external, timing and software interrupts), multi-core execution, memory ordering, atomic operations, system coherency, system paging and memory management unit (MMU) operations, system security and power management.

Also available are apps for end-to-end multi-IP SoC testing and early firmware testing for RISC-V.

The FASTApps make full use of the Breker Test Suite Synthesis technology. Features include seamless portability across the entire verification flow and execution platforms, coverage-driven and pre-execution randomization for enhanced use models, powerful debug and performance profiling capability, and concurrent test set. They integrate fully with the Breker TrekApps such as the system coherency, security, power domain, networking and other system verification IP tests for fully comprehensive SoC and core-level verification.

Availability and Pricing
The Breker Integrity FASTApps for RISC-V as well as Arm and X86 based systems are available today.
Pricing is available upon request. Special introductory pricing applies to the FASTApps.
For more information, visit the Breker website or email [email protected].

Breker at the RISC-V Summit
Breker executives and technical staff will be part of the RISC-V Summit program held Tuesday, December 13, and Wednesday, December 14, at the San Jose Convention McEnery Center in San Jose, Calif.
John Sotiropoulos, principal engineer at Breker, will present “The New Verification Ecosystem that Supports RISC-V Verification for all Adopters” with Lee Moore, consulting engineer at Imperas Software, December 13 at 4:20 p.m. P.S. T.
Adnan Hamid, Breker’s CTO, will address “RISC-V SoC and Processor Integrity: Dealing with Unique RISC-V Integrity Issues” December 14 at 12:10 p.m. P.S.T.
Send email to [email protected] to arrange a meeting.

About Breker Verification Systems
Breker Verification Systems is a leading provider of Portable Stimulus solutions, a standard means to specify verification intent and behaviors reusable across target platforms. It is the first company to introduce graph-based verification and the synthesis of powerful test sets from intent-based, abstract scenario models based on AI planning algorithms. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

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Thermal Interface Materials (TIMs) come in a wide variety of options and are used in a range of applications. Thermal greases, phase-change materials, and silicon pads are just a few examples of TIMs that are used in today’s devices. Each has its own benefits and downsides, but they are all limited in their effectiveness in performing the one essential function of a TIM, conducting heat in an efficient manner. Zeon’s new technology combines the physical characteristics of an elastomer pad with the thermal benefits of a carbon filler to achieve a thermal conductivity of 38 W/mK, a value that is unmatched in the industry.

Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.

This webinar will focus on the performance and technology of such a material while also discussing how it can best benefit the MEMs and Sensors community by creating solutions to thermal problems plaguing the packaging space.

Speaker Bio 

Nikhil Jani is a Business Development Specialist representing Zeon Specialty Materials, a San Jose based company and subsidiary of the Zeon corporation a company you may be familiar with for its widely used Electron Beam Resist ZEP520A. He studied Material Science and Engineering at Rutgers University with a focus on semiconductors and polymers. He has co-authored a paper on polymer nanocomposites titled “Non-Destructive Investigation of Dispersion, Bonding, and Thermal Properties of Emerging Polymer Nanocomposites Using Close-Up Lens Assisted Infrared Thermography”. Prior to joining Zeon, he had worked at Morgan Advanced Materials. 

Online, Virtual
United States

Nikhil Jani
Nikhil Jani
Business Development Specialist
Zeon Specialty Materials
MSIG

Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.

Join us for the 3rd in our Innovative Sensors Webinar Series to explore how Zeon has solved this perennial issue for electronics.  

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Wafer Fabricated Atomic Reference Cells

Tom Kornack, Chief Scientist, Twinleaf LLC

Abstract: Quantum sensing often uses atomic systems in vapor phase. This talk will briefly review Twinleaf’s wafer-scale atomic vapor cell fabrication capabilities and some of the applications that have been addressed.

Speaker Bio: Dr. Kornack is an expert in the design, fabrication and operation of atomic magnetometers. At Twinleaf, he has commercialized a wide variety of high performance magnetic field sensors. As a graduate student and a postdoctoral research assistant working with the magnetometer research group at Princeton University, he developed the first laser zero-field SERF magnetometer. He has also developed co-magnetometers for use as a sensitive gyroscope and as a probe into fundamental laws of physics.



Laser Based Magnetic Field Sensor Formation for GMR / TMR Sensor Arrays

Dr. Dirk Lewke, Team Leader Technology Innovation Management

 

Abstract:  This presentation provides a deep inside into a laser-based annealing technology for GMR/TMR sensors, which enables the programming of advanced sensor structures at wafer level. The key feature is the combination of reaching the Curie-Temperature by applying a selective laser spot and an in-situ rotatable magnetic field while wafer travelling at high speed. Unique single sensor field programming enables high quality sensor read-out repeatability.

Speaker Bio:  Dr. Dirk Lewke studied mechatronic engineering at the University of Erlangen-Nuremberg. He received his doctorate in 2017. From 2011 to 2017 he worked at Fraunhofer IISB in the field of semiconductor manufacturing equipment as a scientist. Since 2017, Dr. Lewke has been working working at 3D-Micromac as a team leader for process development and technology manager for laser production equipment for semiconductor and photovoltaic industry.

Online, Virtual
United States

Tom Kornack
Dr. Thomas Kornack
Chief Scientist
Twinleaf LLC
Dirk Lewke
Dr. Dirk Lewke
Team Leader Technology Innovation Management
3D-Micromac
MSIG

We continue our Advanced Sensor webinar series with dual webinar presentations from technical leads at Twinleaf and 3D-Micromac, covering advanced magnetic sensor design and fabrication.  

These amazing devices play a critical role in measuring what we cannot see by their ultra-sensitivity to magnetic currents. Thinking about adding a magnetic sensor to extend the functionality of your device?  Then this is the webinar series for you.  

Join these technology experts to see how magnetic sensors work, are built and how to utilize them in your products or research.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles

Registration

Member Price: $49

Non-Member Price: $99

Registration is final. No refunds provided. No substitutions.

Lin Tso
Email: [email protected]
Phone: +1.408.943.7920

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Contact Lin Tso, [email protected] or Paul Cohen, [email protected] to learn about available sponsorship opportunities.

Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession

Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers.      

Join us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term, including regional and global economies, and the CHIPS Act.     

Speakers will discuss strategies for mitigating the impact and how to capture value.   

Topics include:

  • Market Trends & Forecast & Outlook    

  • Accessing Chips Act Funding and Roll out of Incentives  

  • Geopolitical Impact    

  • Advanced Packaging & Chiplets     

  • Emerging and Expanding Markets    

 

This Virtual Forum is 8:30–11:00am Pacific Time, 11:30am–2:00pm Eastern Time

United States

Virtual Forum | Thursday, March 16, 2023 | Pacific Time

8:30 am - 8:35 am
Joe Stockunas, President, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:35 am - 8:55 am
John Cooney
John Cooney
Vice President, Global Public Policy & Advocacy
SEMI

An Update on the CHIPS Act and How to Apply for Funding

8:55 am - 9:20 am
Jay Vleeschhouwer, Griffin Securities
Jay Vleeschhouwer
Software Research
Griffin Securities

The State of EDA: A View from Wall Street

9:20 am - 9:45 am
Dan_Hutcheson_VLSIresearch
Dan Hutcheson
Vice Chair
TechInsights

New Perspectives in Semiconductors: Cycles & Outlooks

9:45 am - 10:10 am
Jean-Christophe Eloy, Yole Développement
Jean-Christophe Eloy
President and CEO
Yole Développement

Status of the Advanced Packaging Industry: How the Chiplet Revolution is Impacting the Industry?

10:10 am - 10:35 am
Lita Shon-Roy
Lita Shon-Roy
President/CEO
TECHCET

The Impact on Supply Chains - Materials & Equipment Consumables

10:35 am - 11:00 am
Joe Stockunas, President, SEMI Americas
Joe Stockunas
President
SEMI Americas

Q&A and Closing Remarks

The SEMI Silicon Valley and Northeast Chapters Present:

Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession

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This year’s theme for the International Trade Partners Conference—ITPC—will guide an exploration of geopolitics, contentious trade and national security concerns, and our deep-rooted ambitions to maintain the global footprints we have created. Our manufacturing infrastructures, trade connections, and supply chains are now part of the geopolitical state – something few could have anticipated. We are finally witnessing governments, the media, and the general public taking notice of semiconductors and their critical importance.

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Meet your branding and marketing objectives with a customized sponsorship package. Become a sponsor and brand your company to an influential audience of executives at ESDA/CEDA Phil Kaufman Awards.

Contact Tim Janes, [email protected],   +1.720.939.4992 to learn more.

Sponsorship opportunities are available! (View the brochure.)
For information, contact Tim Janes, [email protected].

View Past Phil Kaufman Award Recipients

 

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The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers.

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MILPITAS, CALIF. –– November 15, 2022 –– The 2022 Phil Kaufman Award ceremony and banquet honoring Dr. Giovanni De Micheli will be held Thursday, February 23, 2023, from 6:30 p.m. until 9:30 p.m. at The GlassHouse, 2 South Market Street in San Jose, Calif.

The evening will be hosted by the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA). Early bird ticket pricing is available through Friday, January 13, 2023, at $175 per individual from member companies and $225 each for non-members. After January 13, member tickets are $225 each and $275 per non-member. Member pricing is offered for individuals or companies that are active SEMI or IEEE members.

Corporate sponsorship opportunities are available. Contact Bob Smith, executive director of the ESD Alliance, at [email protected] for more information.

Dr. De Micheli is Professor and Director of the Institute of Electrical Engineering (IEL) and of the Integrated Systems Centre at the École Polytechnique Fédérale de Lausanne (EPFL) in Lausanne, Switzerland. He is being recognized for his contributions to electronic design automation (EDA). His research on EDA tools and methodologies has helped drive significant advances in the academic field of design automation and made a lasting impact on the industry through their incorporation into commercial EDA solutions.

About the Phil Kaufman Award
The Phil Kaufman Award, co-sponsored by the ESD Alliance and CEDA, honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The annual award was established in 1994 as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2021 recipient was Dr. Anirudh Devgan, President and CEO of Cadence Design Systems. Visit the Phil Kaufman Award webpage for more details and a list of previous recipients.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA:
Website: www.ieee-ceda.org
LinkedIn: https://www.linkedin.com/groups/8343531
Facebook: https://www.facebook.com/ieeeceda/
Twitter: https://twitter.com/IEEECEDA

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
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United States Register Now MSIG Webinar Tile TMR Technical Featured Speakers
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Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.

Crocus has cracked the code to fabricating and integrating TMR sensors with its XtremeSense(tm) range of magnetic sensors. XtremeSense TMR technology is integrated in the back-end of a standard CMOS process on 8” and 12” wafers enabling single-die sensor products. In fact, Crocus has successfully shipped >100 Million ICs based on the XtremeSense process.

This webinar will focus on the principles of TMR sensor and the technology gains made by Crocus to enable Mass Production of TMR sensors.

Speaker Biography

Dr. Mohan is currently serving as VP of Engineering at Crocus Technology, a Silicon-Valley based Magnetic Sensor Company. He is responsible for Worldwide Applications Engineering and New Product Introduction. He has developed next generation of Integrated Magnetic Devices since 2007 and has 15+ granted patents in the field. Prior to joining Crocus Technology, he has worked at Texas Instruments, Maxim Integrated and Bosch Sensortec.

Virtual, Online
United States

Anuraag Mohan
Anuraag Mohan, Ph.D.
VP Applications Engineering
Crocus Technology
Paul Carey
Paul Carey
Director, R&D Programs
SEMI MSIG
MSIG

Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.

During this webinar, hear how Crocus Technology has cracked the code on fabricating and integrating TMR sensors.

8:00 am - 9:00 am Off Add to Calendar 2022-12-14 08:00:00 2022-12-14 09:00:00 Tunnel Magnetoresistance Sensors Webinar Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications. During this webinar, hear how Crocus Technology has cracked the code on fabricating and integrating TMR sensors. Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles