Kitchener, Ontario, September 27, 2022 – PEER Group®, the largest supplier of innovative factory automation software products, is a proud sponsor and participant at this year’s Advanced Process Control Smart Manufacturing Conference (APCSM).

The three-day conference, which is taking place in Austin, Texas, from October 10-13, brings together members of the microelectronics and related industries, including semiconductor OEMs and factories. The APCSM features tutorials, technical presentations, and exhibits covering various topics and trends related to APC, AI, and smart manufacturing.

Doug Suerich, PEER Group’s Product Evangelist and Director of Marketing, is co-chairing the conference alongside APCSM perennial Co-chair, Bradley Van Eck, James Moyne, an Associate Research Scientist at the University of Michigan and CTO of the Integrated Measurement Association (IMA), and John Pace, President of the IMA.

“We look forward to welcoming all attendees, presenters, and exhibitors to Austin for this year’s APCSM,” says Van Eck. “After two years as a virtual conference, being back in person is going to be great. We have an amazing lineup of tutorials and presentations that are sure to shed light on some of the current challenges our industry is facing and how innovations in advanced process control will help us overcome them.”

A key component of the APCSM is the Monday tutorials, which provide attendees with in-depth information on the latest trends and advancements in microelectronics manufacturing. Albert Fuchigami, Senior Software Developer at PEER Group, and the 2022 recipient of the Leadership Award for his contributions to the SEMI® Standards Program, is co-presenting the first of two tutorials. The tutorial, titled Understanding SEMI Information and Control Standards, will provide an overview of, and the philosophies behind, the SEMI Standards and how they fit together to help factories get data from equipment so it can be utilized to improve production capabilities. It will also provide technical details of these highlighted features.

For complete details, including agenda, presentation topics and how to register, visit the APCSM website.

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

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Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic (EM) simulation tool for Chipletz’s soon-to-be released Smart Substrate™ products that will enable multiple ICs in a single package.

“The slowing of Moore’s Law and demand for compute performance is ushering in the era of advanced packaging and the increasing need for products like Xpeedic’s,” remarks Bryan Black, CEO of Chipletz. “Xpeedic and its Metis EM simulation tool are helping us meet our unique signal and power integrity analysis challenges by delivering unprecedented performance advantages for runtime and memory usage.”

“The Chipletz Smart Substrate products will be a welcome addition to toolkits of designers working on advanced 2.5D and 3D IC packaging,” says Feng Ling, CEO of Xpeedic. “Smart Substrate will facilitate multiple ICs from different vendors in a single package, especially important for the AI workloads, immersive consumer experiences and high-performance computing markets. We’re pleased to have a role in the delivery of this advanced packaging technology.”

Xpeedic’s Metis is a fast EM simulation tool for advanced package simulation integrated with IC and package design tools to address capacity, accuracy and throughput requirements. Its three-dimensional EM solver technology delivers unprecedented performance without compromising accuracy. The single solver covers simulation from DC to high frequencies. It also supports multi-scale problems that enables unified EM simulations of die, interposer, and package for advanced packaging designs.
About Xpeedic

Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both US and China. For more information, please www.xpeedic.com.

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About Chipletz
Incorporated in 2021, Chipletz is a fabless substrate vendor developing advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance. The company's Smart Substrate™ products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. Chipletz is targeting delivery of its initial products to its customers and partners in early 2024. www.chipletz.com

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Heterogenous integration in microelectronics requires advanced materials

Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON Taiwan, an international event connecting supply chain partners across the semiconductor industry.

Dr. Alvin Lee, Regional Director, at Brewer Science, garners over a decade of diverse experience in the semiconductor industry developing global partnerships to improve next-generation advanced packaging materials.

Dr. Lee is a featured speaker at the SEMICON Taiwan Heterogeneous Integration Global Summit, which focuses on comprehensive high density and automotive heterogeneous integration. His presentation, New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging, will address cost-effective solutions and innovative material technologies that enable advanced wafer-level packaging applications. Materials will be discussed that address the growing challenges in applications requiring thin wafer handling, die attach, high-temperature processing, permanent adhesives, dielectrics, and wafer cleaning.

The presentation will address advanced materials that enable

• Collective die-to-wafer hybrid bonding,
• Cu/polymer hybrid bonding,
• Advancement of temporary bonding/debonding technologies

Brewer Science will be exhibiting at SEMICON Taiwan and you can visit our booth J2242 to connect with a member of our team and explore our advanced packaging solutions. If you are unable to attend, but wish to learn more about Brewer Science’s advanced packaging materials, you can visit our website to view datasheets and schedule a call with an expert.

Brewer Science is also a proud sponsor of SEMICON Taiwan, providing a Platinum Sponsorship to the Heterogeneous Integration Global Summit. Additionally, Brewer Science is sponsoring the IC Forum and the Gala Dinner.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

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HATFIELD, Pa. (USA) September 13, 2022 — Brooks Instrument, a world leader in precision fluid measurement and control technology, has launched a Korean-language website to provide its Asia-Pacific customers with better access to resources, including in-depth product info, technical documentation, white papers, service assistance and technical support.

The new www.BrooksInstrument.com/Ko-Kr website launch follows the recent opening of a new Brooks Instrument manufacturing and engineering center in Yongin, Gyeonggi Province, which significantly increased the company’s operational footprint in Korea. Building on more than two decades of operations in Korea, the local-language website further illustrates the company’s long-term commitment to the region, especially for the fast-growing semiconductor manufacturing sector.

“With our Yongin facility, we increased our ability to provide rapid repair, maintenance and calibration support to customers in the region and added another resource to help mitigate supply chain disruptions. With this new website, we’re further strengthening our commitment to support our partners in the Asia-Pacific region,” said Hans Sundstrom, Global Semiconductor Business Unit Manager for Brooks Instrument.

The website leverages best practices in design and navigation to help customers more easily access information they need and minimize project delays or disruptions. Key features of the new website include:

• Sitewide Korean language support to make it easier for customers to explore the Brooks Instrument catalog of products and documentation
• A “quick find” feature to easily locate products and documentation by name or model number
• Fully optimized site layout with simplified access to key products, technical information, guides and support services
• Specific industry sections with helpful application information for areas such as semiconductor manufacturing, life sciences and more

"We developed the new website as a platform to better serve our local customers,” said Jason Lee, Korea Country Manager at Brooks Instrument. “By adding native-language functionality, we’re further removing barriers to access as we continue to show customers how valuable their partnerships are to our business.”

To visit the new Brooks Instrument Korean-language website, go to www.BrooksInstrument.com/Ko-Kr.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech industrial manufacturing and process industries.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes brands such as Celerity, UNIT Instruments and Tylan.
For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

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