Join us for a webinar that will explore the role of SEMI’s Public Policy and Advocacy (PP&A) team in driving policy developments that are relevant to the ESDA community. PP&A staff will present on SEMI’s advocacy efforts, how you can interface with our team in DC, and how we work with member companies to advance key legislative and advocacy priorities in specific policy areas including:
The ESD Alliance, a SEMI Technology Community, is hosting a free webinar, "SEMI's Public Policy & Advocacy Office—A Valuable Resource for The Electronic Design Automation Industry," to share how this team can help you navigate global trade complexities and stay ahead of evolving policy challenges.
ESD Alliance Webinar: SEMI's Public Policy & Advocacy Office—A Valuable Resource for The Electronic Design Automation Industry
10:00 am - 11:00 am
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Improved materials are required for progress in fields including printed electronics, semiconductors, aerospace & defense, energy, and life sciences/medical care. Developing such materials and chemicals involves considerations of performance, cost, manufacturability, safety, and stability. Scaling production of new materials is a very different challenge than making 50 grams in a laboratory. Transitioning/commercializing new materials is a separate effort where intellectual property, regulation, quality control, system documentation, supply chain development, and business relationships become key. This talk will address these aspects of introducing a new material into our enterprise.
ABOUT THE SPEAKER:
Larry Takiff, PhD
Larry Takiff is co-Founder and President of Akita Innovations LLC, a small business in Massachusetts that develops and produces novel chemicals and materials for government and commercial customers. He founded Akita in 2012 with Lawrence Hancock after working at Polaroid Corporation, Aprilis Inc., and Nomadics/ICx/FLIR Systems. He is a chemist by training and a businessman by necessity. At Akita, he has initiated and led projects in materials R&D and pilot production for a variety of government agencies/DoD components and for commercial partners. Currently he is leading an effort to scale production of a decontamination fluid for the Defense Threat Reduction Agency (DTRA), and a FlexTech project to advance the TRL/MRL of a dielectric ink for printed electronics, as well as several Phase II SBIR development projects.
Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success.
Development, Scaling, and Transition of Novel Chemicals & Materials
Flexible Electronics Master Class #28
10:00 am - 11:30 am
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Add to Calendar2025-11-12 10:00:002025-11-12 11:30:00FEMC#28 Development, Scaling, and Transition of Novel Chemicals & MaterialsJoin us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success.United StatesSEMI.org[email protected]America/Los_AngelespublicWatch on-demand
Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing
In the semiconductor industry where we routinely pattern sub-wavelength structures and require atomic-layer precision in our manufacturing processes, it’s easy to assume that we can simply measure everything we’re doing and all the structures we create. In reality, though, metrology and inspection have the challenging task of not just keeping up with device technology but staying far enough ahead that we can actually “see” our results and confirm the progress we’re making.
In this webinar, co-hosted with the Electronics business of Merck KGaA, Darmstadt, Germany; we will explore the metrology and inspection space to learn more about technological advances driving this vital segment of semiconductor manufacturing.
The webinar will feature presentations by Eric Beyne, PhD, Senior Fellow, VP R&D and Director of 3D System Integration Program for imec, and Dario Alliata, PhD, Senior Application Director for Metrology & Inspection at the Electronics business of Merck KGaA, Darmstadt, Germany.
Following the presentations, an interactive Q&A segment will allow attendees a chance to deepen their understanding of how materials innovation and advanced metrology intersect at the leading edge of manufacturing.
Join us to engage with peers and pioneers working at the forefront of materials science and semiconductor innovation!
United States
Dario Alliata, PhD
Senior Director of Applications
The Electronics business of Merck KGaA, Darmstadt, Germany
The Role & the Challenge of Metrology and Inspection in Advanced Packaging of AI Chips
The massive adoption of social networking and artificial intelligence has pushed the semiconductor industry to develop devices capable of supporting the required infrastructures. Increasingly powerful computer process units (CPU) are used to allow data centers to process trillions of information exchanges, while faster graphic process units (GPU) enable virtual and assisted reality.
Cost leveraging is now reachable with the integration of multiple dies in the same package, each one fabricated to handle specific functionalities with the most cost-effective technology node, which is a form of heterogeneous integration. This session highlights some examples of metrology and inspection solutions aimed at securing the manufacturability of devices for High Computing Power fundamental for AI applications. More in detail, it explores the challenge of the fabrication of chip-to-chip interconnections that are key for the heterogeneous integration of active components with vertical stacking like DRAM for High Bandwidth memories, where process tolerances are increasingly narrow and conditions to measure more and more extremes.
Biography
Dr. Dario Alliata joined Unity-SC, now part of the Electronics business of Merck KGaA, Darmstadt, Germany in the U.S. and Canada. In 2016 as product manager and is now Sr. Director of Applications with focus on Advanced packaging and Specialty substrates & devices.
He worked in the semiconductor industry for more than 25 years, initially in R&D centers and later in equipment makers. He spent his entire career developing process control solutions for securing the manufacturing chain in the semiconductor industry.
He received a MD in Physics from the University of Milan (Italy) and hold a Ph.D. in Physics & Chemistry from the University of Berne (Switzerland).
Eric Beyne, PhD
VP R&D / Program Director 3D System Integration Program / Senior Fellow
imec
Sub-Micron Pitch Scaling of Hybrid Bond Interconnects: Metrology Challenges
Advanced 3D integration technology will increasingly rely on hybrid bonding technology for both wafer-to-wafer and die-to-wafer bonding. This allows for micrometer and sub-micrometer pitch interconnects, resulting in very high 3D interconnect densities, compatible with the back-end-of -line interconnect layers of active logic and memory die. The results are “seamlessly” interconnected die. Off-chip interconnects become equivalent (or better) than on-chip interconnects.
These great system-level benefits however come at some challenges. Small overlay errors or surface imperfections can prevent defects, resulting in yield loss. Critical process, steps, such as CMP, wafer dicing and surface cleaning steps, need to be monitored with higher accuracy to maintain a good process. New parameters, such as wafer shape, distortion, surface profile slopes, and copper pad recess levels need to be measured and continuously monitored. This poses significant challenges to metrology related to hybrid bonding. The presentation will highlight these needs and show some practical solutions.
Biography
Eric Beyne obtained a degree in electrical engineering in 1983 and the Ph.D. in Applied Sciences in 1990, both from the Katholieke Universiteit Leuven, Belgium. Since 1986 he has been with IMEC in Leuven, Belgium where he has worked on advanced packaging and interconnect technologies. Currently, he is imec senior fellow, VP R&D and program director of imec’s 3D System Integration program.
Michael Weigand
Senior Application Manager
Brewer Science
Moderator
Biography
I'm a seasoned Senior Application Manager at Brewer Science with over two decades of experience in Semiconductor industry. I lead application teams at Brewer Science Inc, focusing on advanced materials for the semiconductor industry. With a background in Material Science, I enjoy tackling technical challenges, from optimizing critical processes to finding creative ways to characterize materials.
Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany
Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing
10:00 am - 11:00 am
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Add to Calendar2025-09-17 10:00:002025-09-17 11:00:00Are We There Yet? Metrology and Inspection for Angstrom-Level Manufacturing Sponsored by the Electronics business of Merck KGaA, Darmstadt, Germany United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
WATCH NOW
As world leaders act to secure access to these minerals, companies come under pressure to follow due diligence guidelines to promote ethical sourcing of these materials for their supply chains. Regulations such as the US Dodd-Frank Wall Street Reform and Consumer Protection Act (Section 1502), EU Regulation 2017/821 and the EU Corporate Sustainability Due Diligence Directive require companies to trace materials through their supply chains and report to the public about their use of conflict minerals.
Several industry associations, including the Responsible Business Alliance’s Responsible Minerals Initiative, were created to help companies with their due diligence efforts. Reports such as those issued by the US Government Accountability Office on Conflict Minerals offer insights into the efficacy of these regulations and suggest improved approaches for industry engagement.
The SEMI Responsible Supply Chain (RSC) working group was recently formed to host discussions on these topics. This webinar will provide insights from speakers Jennifer Peyser, Responsible Business Alliance Senior Vice President of Responsible Sourcing, and Kimberly Gianopoulos, Managing Director for the International Affairs and Trade team at the U.S. Government Accountability Office (GAO).
United States
8:00 am
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8:05 am
Dr. Kimberly Harrison, Ph.D
Senior MEMS Engineer
AMFitzgerald & Associates
Welcome and Introductions of RSC working group
Dr. Harrison is a MEMS Engineer with AMFitzgerald & Associates, a design firm located in the Bay Area California. She has a doctoral degree in mechanical engineering from Stanford University, and has worked as a designer and process engineer in the semiconductor industry for 10 years. She was nominated as a 2022 MEMS & Sensors Industry Group Emerging Leader. As a founding member and leader of the SEMI Responsible Supply Chain Working Group, she hopes to bring SEMI members together to discuss solutions to human rights issues in the semiconductor supply chain.
Conflict Minerals Supply Chain Overview
8:05 am
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8:35 am
Kimberly Gianopoulos
Managing Director for the International Affairs and Trade
U.S. Government Accountability Office (GAO)
Report Review
Director Gianopoulos oversees a 140-person team that reviews a wide variety of federal government oversight issues, including International Security Assistance, Bilateral and Multilateral Foreign Assistance, International Trade and Finance, and U.S. Diplomatic Presence and Management. She serves as a facilitator in GAO’s Learning Center and participates in recruiting activities. Ms. Gianopoulos has received several awards, including a Distinguished Service Award, a Meritorious Service Award, a Client Service Award, and several Results Through Teamwork awards. Ms. Gianopoulos earned a Bachelor’s degree in Mathematics and a Master’s degree in Public Analysis and Administration from the State University of New York at Binghamton. She is a Certified Government Financial Manager and a member of Pi Alpha Alpha, the Global Honor Society for Public Affairs and Administration.
Jennifer Peyser
Executive Director
Responsible Minerals Initiative
RMI Activity Overview
“The RMI supports over 500 downstream, midstream, and upstream member companies with a suite of due diligence standards and tools, data, guidance, training, and other resources for global responsible sourcing and regulatory compliance. Our facility and supply chain due diligence standards are rooted in longstanding international norms while reflecting emerging corporate and stakeholder priorities for regulatory compliance, managing sustainability risks and impacts, and fostering responsible mineral supply chains.”
Critical Minerals, Due Diligence and the Semiconductor Supply Chain
8:00 am - 9:00 am
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Add to Calendar2025-07-09 08:00:002025-07-09 09:00:00Critical Minerals, Due Diligence and the Semiconductor Supply ChainUnited StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register for On-demand
In this engaging two-hour Masterclass organized by SEMI, we explore the groundbreaking role of magnetic materials, particularly magnetic nanoparticles (MNPs), in biomedical fields. The session commences with an in-depth review of the physics and synthesis of MNPs, including comprehensive discussions on fundamental theories, synthesis methods, and advanced MNP surface functionalization strategies. Attendees will gain insights into the characterization techniques used to analyze the physicochemical properties of MNPs.
The Masterclass transitions to the applications of MNPs in therapeutic and diagnostic contexts. We will review cutting-edge MNP-based therapies, such as magnetic hyperthermia therapy, targeted drug and gene delivery, and magnetic neurostimulation. In addition, we will discuss various MNP-based diagnostic techniques, including magnetoresistive (MR) sensing, nuclear magnetic resonance (NMR), magnetic particle spectroscopy (MPS), magnetic resonance imaging (MRI), and magnetic particle imaging (MPI). A critical focus of this Masterclass will be on safety and biocompatibility issues associated with the use of MNPs in vivo, examining the toxicity of MNPs, immune responses, and their circulation time in the human body.
The latter part of the session will introduce participants to the innovative field of micromagnetic neural stimulation, an infant yet extremely promising field. We will delve into the design and efficacy of micromagnetic devices, such as the Magnetic Pen (MagPen) and Magnetic Patch (MagPatch) Array, which utilize micrometer-sized coils (μcoils) for targeted neural activation. This is particularly for patients with spinal cord injuries (SCI) and for reducing opioid dependency, with insights drawn from current research supported by the NIH Blueprint Medtech Program. By the end of the Masterclass, attendees will have a comprehensive understanding of the potential clinical applications of MNPs and MEMs-based micromagnetic neurostimulators.
ABOUT THE SPEAKER
Dr. Renata Saha, Senior Scientist, Dupont
Dr. Renata Saha is a Senior Scientist at DuPont located in Wilmington, DE. She holds a PhD in Electrical and Computer Engineering from the University of Minnesota, Twin Cities, which she earned in August 2023. Her undergraduate degree in Electronics & Communication Engineering was obtained from the National Institute of Technology in Durgapur, India. During the summer of 2017, she was an undergraduate research intern at Conseil européen pour la Recherche Nucléaire (CERN), located in Geneva, Switzerland working on the ALICE experiment upgrade.
Dr. Saha is the recipient of 3-year College of Science & Engineering Fellowship, Women in Technology Scholarship 2021-2022 from Cadence Design Systems, and the Graduate Neuromodulation Research Fellowship 2022-2023 from MnDRIVE. She was also elected an iREDEFINE Fellow in 2022 by ECEDHA and was named a Rising Star in EECS. She has published over 30 journal articles, 3 US patents, and 2 book chapters.
Her expertise and research interests involve designing and developing microelectromechanical systems (MEMs) devices for neuromodulation and cardiovascular monitoring, characterizing magnetic nanoparticles (MNPs) for potential biomarkers. Outside of her research and work, Dr. Saha is trained in Indian classical dance form, Odissi, and enjoys performing and choreographing the art form.
In this two-hour Masterclass, Dupont Senior Scientist Renata Saha delves into the biomedical applications of magnetic nanoparticles (MNPs), covering their manufacturing, functionalization as well as therapeutic and diagnostic uses including safety considerations such as biocompatability and toxicology.
Innovations in Magnetic Materials: Application in Biomedical Engineering
Flexible Electronics Master Class #26
10:00 am - 12:00 pm
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Add to Calendar2025-10-29 10:00:002025-10-29 12:00:00FEMC #26 Innovations in Magnetic Materials: Applications in Biomedical EngineeringIn this two-hour Masterclass, Dupont Senior Scientist Renata Saha delves into the biomedical applications of magnetic nanoparticles (MNPs), covering their manufacturing, functionalization as well as therapeutic and diagnostic uses including safety considerations such as biocompatability and toxicology. United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Watch Now!
Early-Bird Registration Deadline: Wed, July 9, 5PM (KST)
Group Registration Deadline: Fri, July 4, 5PM (KST)
Registration fee includes a boxed lunch provided at the venue.
[Group]
SEMI Member : KRW 275,000
Non Member: KRW 330,000 * Group registration fee applies to groups of five or more from the same company. * For group registration inquiries, please contact SEMI Korea Program Team([email protected]).
Convention Hall 2, 3F, Suwon Convention Center South Korea
9:00 am
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9:30 am
Choon Lee
Intel
System Level Advanced Packaging
Rapidly evolving progress of AI and HPC has significantly increased computational and memory needs such as higher performance, lower power consumption, and wider memory bandwidth with reduced latency. An end application of AI/HPC comes down to Datacenter construction. Meeting the challenge of delivering this processing power in the datacenter requires systematic innovation from the device to the datacenter level. It starts with integrating highly optimized, domain-specific accelerators which should be integrated into advanced 2.5D and 3.5D packaging that minimize losses and power for high-speed communication while taking advantage of workload power management. AI computing introduces significant challenges for energy consumption and thermal management. Power delivery network is crucial for CPU, GPU and NPU power and performance of which solution can be DTC, IVR, mtal-insulator-metal (MIM) capacitor and thin film inductor, backside power rail, etc.. While Moore’s law has continued to yield transistor scaling necessary for these applications, the ever growing demand from models for AI training and inference pushes Si scaling in conjunction with the advent of advanced interconnects via disaggregation and reaggregation of chips in advanced packaging.
We will discuss with examples and the challenges of utilizing packaging elements to their full potential and discuss how co-optimization is crucial to achieving the best results for any given set of system requirements and constraints.
Advanced Packaging and Reliability: Technologies Shaping the Next Generation
Advanced semiconductor packaging is now central to enabling continued performance scaling as conventional transistor scaling slows. This seminar introduces cutting-edge trends in advanced packaging, including 2.5D and 3D integration, fan-out wafer-level packaging, chiplet-based architectures, and glass interposers for optical I/O in AI and HPC systems. These technologies offer enhanced performance, form factor reduction, and system-level integration capabilities critical for future computing platforms.
Leveraging prior industry experience, this talk highlights real-world applications and challenges in designing and qualifying advanced SoC packages. Examples include CoWoS-based AI chip packaging, hybrid bonding techniques, and thermal design optimization for high-power systems.
As packaging structures become increasingly complex, reliability emerges as a critical bottleneck. The seminar explores major failure mechanisms such as thermal-mechanical fatigue, electromigration, interfacial delamination, and Through Glass Via (TGV) degradation. Reliability analysis methods including FEA-based stress modeling, time-to-failure prediction, and advanced failure diagnostics will be introduced.
By combining packaging innovation with reliability engineering, the talk aims to provide a comprehensive perspective on the technological and practical issues that must be addressed to enable robust, high-performance semiconductor systems in the AI and data-driven era.
Pushing the Boundaries: Challenges and Opportunities in Panel-Level Packaging Technology
As the AI era progresses, semiconductor devices are increasingly adopting 3D architectures to boost performance and power efficiency. At the same time, system technology co-optimization (STCO) is advancing through the use of chiplets and advanced wafer-level packaging. As the industry integrates more chips into chiplets, the size of interposers continues to grow. However, wafer-level packaging faces limitations in accommodating large interposers due to the constraints of 300mm wafer shapes and temporary carriers.
This trend is driving a shift toward panel-level packaging (PLP) to support higher packaging unit counts. Despite its potential, PLP still faces significant challenges—particularly in terms of process development and process control.
This paper explores the technical trends in panel-level packaging, focusing on the current challenges and potential solutions related to process control.
Presentation New Innovations Enabling Fine Pitch D2W Hybrid Bonding
Heterogenous integration and advanced packaging is behind the technology that is enabling today’s AI and high-performance computing. This is done through complex architecture that utilizes platforms including microbumps, through silicon vias (TSV), high density fanout and hybrid bonding (HB). The integration of chiplets using any combination of these technologies is allowing the industry to extend the Moore’s law and overcome limitations of the Von Neumann architecture. Hybrid bonding is an especially appealing technology that helps improve power and performance (higher I/O density), as well as thermal management. Sub-10 ㎛pitch die-to-wafer (D2W) HB is already in production1) for 3DIC and the industry working on HB technology for High Bandwidth Memory as well2). However, there are continuous challenges for D2W that require new innovation in both processing and metrology & inspection (M&I), and also unique challenges for both logic and memory applications specific to its integration. The presentation will discuss how logic and memory HB technologies are different and what process and M&I technologies are needed to facilitate HVM of the HB technology across different applications. Process challenges including low temperature bonding, die warpage management and dicing will be discussed, while M&I challenges include the transition to e-beam technology for HB enablement.
1) R. Agarwal et al., “3D Packaging for Heterogeneous Integration”, IEEE ECTC, July 2022
2) Lee et al., “A Study on D2W Cu Bonding Technology for HBM Multi-die Stacking”, IEEE ECTC, May 2024
Design and Development of High Thermal Conductive Molding Compounds for Advanced Packaging Applications
The ongoing miniaturization and increased integration density in electronic circuit systems, particularly in advanced technologies such as DRAMs for Through-Silicon Via (TSV) and High Bandwidth Memory (HBM), have elevated thermal management to a critical challenge in microelectronic packaging. The functional performance, operational lifespan, and reliability of electronic devices fundamentally depend on efficient thermal dissipation. As power densities escalate, enhancing the thermal conductivity of EMCs has become imperative for effective heat removal from increasingly complex electronic components. Consequently, research efforts focused on developing epoxy resins with superior thermal conductivity and identifying appropriate high-conductivity fillers represent the most viable approaches to addressing thermal management challenges in contemporary microelectronic systems.
Recently, we have successfully developed a high-performance epoxy molding compound (EMC) that solves critical thermal management challenges in advanced microelectronic packaging applications. Not only do these compounds provide extremely safe protection of integrated circuits from moisture, mobile ion contaminants and adverse environmental conditions, including temperature fluctuations, humidity and mechanical stress, but the enhanced thermal and mechanical properties of EMC formulations address the heat dissipation requirements of advanced technologies such as small electronic circuit systems, especially TSV and HBM applications.
3:00 pm
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3:30 pm
Prof. Yunhyeok Im
Georgia Institute of Technology
Next-Generation Thermal Strategies: The Liquid Cooling Revolution for AI Chips
Next-generation semiconductor packaging technologies are advancing rapidly in response to the explosive growth of high-performance semiconductor markets, including AI chips and HBM. At the Advanced Packaging Summit 2025, industry leaders from top global companies will share the latest developments and insights in advanced packaging technologies. The morning session will spotlight core technologies such as SLP and PLP, while the afternoon session will feature in-depth presentations on essential next-generation packaging technologies including hybrid bonding, glass substrates, materials for heat control, and liquid cooling solutions. Each session will also include panel discussions to encourage broad and practical exchanges of technical experiences, offering valuable opportunities for networking. We invite you to explore the future direction of next-generation semiconductor packaging with global industry experts and expand both your insights and business horizons at this premier event.
ADVANCED PACKAGING SUMMIT 2025
9:00 am - 5:30 pm
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Add to Calendar2025-07-16 09:00:002025-07-16 17:30:00Advanced Packaging Summit 2025Next-generation semiconductor packaging technologies are advancing rapidly in response to the explosive growth of high-performance semiconductor markets, including AI chips and HBM. At the Advanced Packaging Summit 2025, industry leaders from top global companies will share the latest developments and insights in advanced packaging technologies. The morning session will spotlight core technologies such as SLP and PLP, while the afternoon session will feature in-depth presentations on essential next-generation packaging technologies including hybrid bonding, glass substrates, materials for heat control, and liquid cooling solutions. Each session will also include panel discussions to encourage broad and practical exchanges of technical experiences, offering valuable opportunities for networking. We invite you to explore the future direction of next-generation semiconductor packaging with global industry experts and expand both your insights and business horizons at this premier event.Convention Hall 2, 3F, Suwon Convention Center South KoreaSEMI.org[email protected]Asia/Seoulpublic
Asia/Seoul
Leverage SEMI U learning offerings to wrap up your 2025 professional development journey! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.
Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "SEMI University - 2025 and beyond." This webinar promises to be an informative session where you'll gain insights into the latest updates, exciting live trainings at SEMICON West and virtually the remainder of this year and beyond.
During this webinar, you can expect to:
Discover the latest updates and enhancements to SEMI U's course catalog.
Learn about the exciting live, in-person training courses scheduled for SEMICON West.
Review upcoming virtual instructor-led trainings.
Gain access to a special 10% discount on ALL on-demand courses.
Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value).
8:00 am - 8:30 am
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Add to Calendar2025-09-25 08:00:002025-09-25 08:30:00SEMI University - 2025 & BeyondJoin us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value). Choose your session:US/EU: 8:00 AM – 8:30 AM PT [Register Now]Asia/US: 5:00 PM – 5:30 PM PT [Register Now]United StatesSEMI.org[email protected]America/Los_AngelespublicRegister Now
Graphene, a two-dimensional material with extraordinary electrical, mechanical, and biocompatible properties, is emerging as a key enabler for the next generation of medical devices. In this presentation, we will explore how Graphenea, through its advanced Graphene Foundry services, is driving the integration of graphene into scalable device manufacturing for biomedical applications. Attendees will gain insight into our end-to-end fabrication capabilities, from graphene synthesis, wafer-scale CVD graphene growth to cleanroom device prototyping and packaging. We will showcase examples of graphene-based biosensors, flexible electronics, and neural interfaces developed through our foundry platform, emphasizing their potential impact in diagnostics, monitoring, and therapeutic applications. The session will also address the challenges of material integration, process scalability, and regulatory pathways for graphene in medical technologies, providing a practical roadmap for researchers and companies looking to bring graphene-enabled devices from lab to market.
INBRAIN: Pioneering Precision Neuroelectronics: From Materials to Scalable Therapies
The convergence of materials science, artificial intelligence, and neuromodulation is transforming the future of neuroscience. This talk explores how high-density graphene-based brain-computer interfaces are enabling real-time decoding and precision modulation of neural circuits. Carolina Aguilar, CEO and Co-Founder of INBRAIN Neuroelectronics, will present the technological and clinical journey behind the world’s first graphene neural interface in humans, and how this platform is designed to deliver adaptive, patient-specific therapies for neurological disorders such as Parkinson’s disease. The session will highlight the translational path from research to regulated medical devices, and the role of Europe in leading responsible innovation in neurotechnology
ABOUT THE SPEAKERS:
Jesús de la Fuente
Jesús de la Fuente is the founder and CEO of Graphenea, a leading graphene production company established in 2010. Before founding Graphenea, he served as a Manager at Arthur Andersen, Director at PricewaterhouseCoopers in advisory professional services, and Managing Director at an industrial materials distribution company. He holds a Bachelor of Science in Engineering from Deusto University and an Executive MBA from IESE Business School. Under his leadership, Graphenea has become a world-leading graphene producer, contributing to the development of graphene applications across various sectors in over 60 countries.
Carolina Aguilar
Carolina Aguilar is the CEO and Co-Founder of INBRAIN Neuroelectronics, a neurotechnology company pioneering the use of graphene-based brain-computer interfaces for precision neuromodulation. With over 20 years of experience in healthcare, including 13 years at Medtronic where she led global businesses in brain modulation and diabetes, she has built a career at the intersection of innovation, neuroscience, and impact. Under her leadership, INBRAIN achieved the first-in-human implantation of a graphene neural interface and received FDA Breakthrough Device Designation. Carolina is also a 2025 World Economic Forum Technology Pioneer and a strong advocate for responsible, human-centric deep tech in Europe for the world.
Join us for this exciting Master Class with Jesús de la Fuente, Founder and CEO of Graphenea, and Carolina Aguilar, CEO and Co-Founder of INBRAIN, as they showcase their pioneering efforts of integrating graphene into scalable medical devices highlighting advancements in various medtech applications including biosensors and neural interfaces.
Enabling Next-Generation Medical Devices: Graphene Device Manufacturing
Flexible Electronics Master Class #25
9:00 am - 11:00 am
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Add to Calendar2025-09-10 09:00:002025-09-10 11:00:00FEMC#25 Enabling Next-Generation Medical Devices: Graphene Device ManufacturingJoin us for this exciting Master Class with Jesús de la Fuente, Founder and CEO of Graphenea, and Carolina Aguilar, CEO and Co-Founder of INBRAIN, as they showcase their pioneering efforts of integrating graphene into scalable medical devices highlighting advancements in various medtech applications including biosensors and neural interfaces.United StatesSEMI.org[email protected]America/Los_AngelespublicWatch Now!
Join the Leaders of the Semiconductor Climate Consortium Scope 3 Working Group, plus other industry experts, to review the recently released Scope 3 Category 11 GHG Assessment and Guidance for the Semiconductor Value Chain. Compiled with the expert assistance of ERM, with input from all levels of the ecosystem, this document has been designed to align on reporting Scope 3, Category 11, an important step in measuring the impact of reduction efforts across the industry.
Review of the NEW SCC Scope 3.11 Emissions Calculation Guidance
A Webinar for the Semiconductor Ecosystem
8:00 am - 9:00 am
Off
Add to Calendar2025-06-12 08:00:002025-06-12 09:00:00Webinar - Category 3.11 ReviewJoin the Leaders of the Semiconductor Climate Consortium Scope 3 Working Group, plus other industry experts, to review the recently released Scope 3 Category 11 GHG Assessment and Guidance for the Semiconductor Value Chain. Compiled with the expert assistance of ERM, with input from all levels of the ecosystem, this document has been designed to align on reporting Scope 3, Category 11, an important step in measuring the impact of reduction efforts across the industry.Download the Guidance DocumentUnited StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
