The passage of the CHIPs Act and the Inflation Reduction Act have created opportunities and challenges for the semiconductor industry supply chain. Join industry professionals as we discuss the implications of this legislation and how materials companies can make the most of it.
What's In it for Materials Companies?
CHIPs Act, Inflation Reduction Act, and Tax Incentives
10:00 am - 11:00 am
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Substrate and PCB fabrication processes and its key processes and materials such as ABF, BT, FR5, etc.
Build-up micro-via technologies with use of lasers, plasma, photo materials etc.
Registration and tolerances of substrate design in relation to substrate and PCB fabrication processes which includes via to pattern, pattern to resist etc, which can affect microelectronics assembly processes.
Materials, design and surface finishes (Cu, NiAu, ENIG , NiPdAu etc) with respect to assembly processes and parameters.
Substrate defects and package reliability including failure of fatigue, kirkendall voids and intermetallics.
Why should I attend?
Provides necessary technical knowledge for industry professionals
Enhance knowledge in manufacturing and R&D know-how in IC packaging
Case studies discussion
Networking Opportunity with industry peers
Who should attend?
Directors, managers, process engineers, R&D engineers working in the areas of microelectronics
Useful for sale or application engineers who supply packaging materials and tools to the industry
Malaysian International Trade & Exhibition Centre (MITEC) No. 8 Jalan Dutamas 2 50480Kuala Lumpur Kuala Lumpur Malaysia
MEET OUR TRAINER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
- Problem solving exercises on Assembly Challenges
4:00 pm
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5:00 pm
Q&A Discussion
5:00 pm
End of Day 1
9:00 am
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12:00 pm
Assembly Challenges and Defects
- Assembly differences in PCB and substrate
- Surface finishes for assembly
- Substrate surface finishes for packaging, soft Ni/Au for wirebonding, ball attach
- PCB surface finishes for 2nd interconnect, ENIG, NiPdAu and Cu with OSP
- Strip warpage
- Thermal stress and shrinkage affecting warpage
- Slots, Cu patterning and solder resist thickness impacting warpage
Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability
Substrate and PCB technologies are the building blocks for Microelectronics Packaging and surface mount packages.
Course Fee:
Member Rate: SGD 750
Non-member Rate: SGD 935
Register before 6 March 2023 to enjoy Early Bird rate of up to 15% off the rates above.
This workshop is HRDC Claimable, subjecting to terms and conditions.
Certificate of completion will be awarded at the end of the workshop.
Advanced Packaging Training Seminar 2023
Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability
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Add to Calendar2023-03-08 00:00:002023-03-09 00:00:00[IN-PERSON] Advanced Packaging Training Seminar 2023Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability
Substrate and PCB technologies are the building blocks for Microelectronics Packaging and surface mount packages.
Course Fee:
Member Rate: SGD 750
Non-member Rate: SGD 935
Register before 6 March 2023 to enjoy Early Bird rate of up to 15% off the rates above.
This workshop is HRDC Claimable, subjecting to terms and conditions.
Certificate of completion will be awarded at the end of the workshop.
Malaysian International Trade & Exhibition Centre (MITEC) No. 8 Jalan Dutamas 2 50480 Kuala Lumpur Kuala Lumpur MalaysiaSEMI.org[email protected]Asia/Singaporepublic
Asia/Singapore
The discussion will help attendees understand why and how governments implement trade controls, what “exports” are and how they take place in different business contexts, and common due diligence methods – such as customer screening – that United States companies use to incorporate regulatory compliance into their business processes. Finally, the discussion will address recent regulatory updates which address current issues such as US-China trade relations and the anticipated effects of those regulations on the US semiconductor design ecosystem.
Meet the Speakers
Ada Loo
Group Director and Associate General Counsel,
Cadence Design Systems
The ESD Alliance Export Committee will hold a seminar called “The Impact of New Regulations on the Semiconductor Design Ecosystem.” This seminar is presented by the ESD Alliance, a SEMI Technology Community, and will be hosted by Cadence Design Systems at their San Jose Headquarters. The Cadence Government and Trade Team will cover general trade compliance concepts, how export control and sanctions regulations affect the industry, as well as current trends and emerging issues.
Breakfast Hosted by Cadence
ESD Alliance Export Seminar
The Impact of New Regulations on the
Semiconductor Design Ecosystem
Presented by the ESD Alliance, a SEMI Technology Community
HYBRID & LIVESTREAM EVENT
8:30 am - 11:00 am
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Breakfast Hosted by CadenceCadence Design Systems 2655 Seely Avenue San Jose, CA 95134 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
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[Pacific Northwest Forum] Smart Manufacturing—What Does a Smarter World Look Like With Industry 5.0?
The Fourth Industrial Revolution, or Industry 4.0, revolutionized automation monitoring, enhanced production efficiencies, and improved product quality. Industry 5.0 is the next industrial revolution coming to the forefront.
Industry 5.0 builds and adapts the components of Industry 4.0 (robotization, automation, IoT, connected machines, smart systems, data analytics, AI, ML) with a focus on sustainability, environmental, social, and well-being of the worker, and optimized human-robot interactions.
With the renewed interest in on-shoring manufacturing in the United States, this breakfast forum is a great opportunity to learn about Industry 5.0 and the ecosystem partners developing these future ideas.
Join the conversation on—
Market Trends, Forecast & Outlook
Industry 4.0 + Transition to 5.0—Challenges + Solutions
Digital Journey–AI/ML, Autonomous Solutions, Digital Twin, etc.
Supply Chain / Disruptions: Linear to Circular Economy and Localized Sourcing
Hosted by Analog Devices Presented by the SEMI Pacific Northwest Chapter
Smart Manufacturing—What Does a Smarter World Look Like With Industry 5.0?
SEMI Pacific Northwest Forum IN-PERSON & VIRTUAL EVENT
Pacific Time
8:00 am - 11:30 am
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Hosted by Analog Devices
Presented by the SEMI Pacific Northwest ChapterAnalog Devices—ADI OR United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Health and Safety
We Are Excited to Welcome You Back to the Pacific Northwest Forum
Your health and safety are our top priority. SEMI Americas (“SEMI”) monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events.
SEMI will comply with and follow current facility and local government jurisdiction guidelines of the venue's location. The health and safety guidelines outlined below continue to evolve and will be updated as necessary to help support a safe experience for all attendees onsite.
FACE COVERINGS
Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.
RELEASE AND WAIVER FORM
This was included in your online registration.
ADDITIONAL SAFETY PROTOCOLS
Please practice social distancing.
Wash and sanitize your hands frequently.
Avoid handshakes.
Wear your attendee badge at all times to indicate that you have gone through the health screening process.
SEMI is committed to upholding the health and safety standards outlined on this page. We will continue to monitor the guidance of public health authorities and government agencies going forward and will make appropriate adjustments in the future based on that guidance. Additional details about policies and procedures will be posted here as they are made available.
Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.
Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession
Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers.
Join us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term, including regional and global economies, and the CHIPS Act.
Speakers will discuss strategies for mitigating the impact and how to capture value.
Topics include:
Market Trends & Forecast & Outlook
Accessing Chips Act Funding and Roll out of Incentives
Geopolitical Impact
Advanced Packaging & Chiplets
Emerging and Expanding Markets
This Virtual Forum is 8:30–11:00am Pacific Time, 11:30am–2:00pm Eastern Time
United States
Virtual Forum | Thursday, March 16, 2023 | Pacific Time
8:30 am
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8:35 am
Joe Stockunas
President
SEMI Americas
Welcome Remarks
8:35 am
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8:55 am
John Cooney
Vice President, Global Public Policy & Advocacy
SEMI
An Update on the CHIPS Act and How to Apply for Funding
Meet your branding and marketing objectives with a customized sponsorship package. Become a sponsor and brand your company to an influential audience of executives at ESDA/CEDA Phil Kaufman Awards.
Contact Tim Janes, [email protected], +1.720.939.4992 to learn more.
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers.
Phil Kaufman Award & Banquet
6:30 pm - 9:00 pm
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Registration covers all 3 days of Workshops. No discounts given for partial attendance. Full refunds through December 17, 2022. December 18-January 19 - substitutions only.
SEMI, FlexTech, NBMC & NextFlex Members: $199
Non-Members: $499
If you have any questions, please contact Gity Samadi, [email protected].
Step 2 – Choose Rate Preference, then group rate, type in SJ1
Alternatively, you may email the General Manager at [email protected]
HEALTH AND SAFETY
Your health and safety are our top priority. We monitor developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events. For international attendees arriving from outside of the United States, please review the government travel guidance to confirm eligibility and requirements for travel.
FACE COVERINGS
Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.
Highlighted content
SEMI FlexTech FHE Technical Gap Analysis Workshop - Tues. 1/17 - 8 am-12 noon
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.
SEMI NBMC Technical Gap Analysis Workshop - Tues. 1/17 - 1:00-5:00 pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. A networking reception will follow the workshop.
Many topics and paths were identified at the previous, very successful workshop in July 2022. This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components. This workshop includes a continental breakfast and lunch.
NextFlex - Hybrid Electronics for Advanced Packaging Workshop - Wed 1/18 2:00 - 7:00 pm & Thurs 1/19 - 8:00 am - 5:00 pm
@NextFlex, 2244 Blach Place, Suite 150, San Jose, CA
As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex is hosting a workshop to align the ecosystem’s vision on how additive hybrid electronics manufacturing can shape the future of domestic advanced semiconductor packaging. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.
Breakout topics include:
Direct Write Interconnects
Substrates and Buildup Layers
Interposers, Bridges & Architectures
Circuitization
SEMI & NEXTFLEX Milpitas & San Jose, CA United States
Tuesday, January 17 @ SEMI Milpitas
8:00 am
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8:30 am
Continental Breakfast
SEMI FlexTech FHE Technical Gap Analysis Workshop
8:30 am
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8:45 am
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI
Introduction
8:45 am
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9:00 am
Eric Forsythe, PhD
Program Manager
ARL
RFP Process and Background
9:00 am
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9:15 am
Robert Praino
Chief Innovation Officer & Co-Founder
CHASM Advanced Materials
A Look Back and The Path Ahead & RFP Process
9:15 am
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10:45 am
Breakout Sessions for Technical Gap Analysis
10:45 am
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11:00 am
Break
11:00 am
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11:45 am
Break out Review & Summary
11:45 am
Wrap-Up
12:00 pm
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1:00 pm
Lunch
NBMC Technical Gap Analysis Workshop
1:00 pm
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1:15 pm
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI
Introduction
1:15 pm
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1:30 pm
Gina Tollefson
Program Manager
AFRL
NBMC 2023
1:30 pm
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1:45 pm
Azar Alizadeh
Principal Scientist
GE Research
RFP Process & Insights
1:45 pm
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2:00 pm
Break
2:00 pm
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4:00 pm
NBMC Break Out Sessions
4:00 pm
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4:45 pm
Final Review & Summary
4:45 pm
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5:00 pm
Wrap-Up
5:00 pm
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7:00 pm
Reception & Networking
Wednesday, January 18, 2022
FHE Standards Workshop
8:00 am
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8:30 am
Continental Breakfast
8:30 am
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8:45 am
Gity Samadi
Sr. Director of R&D Programs
SEMI
Paul Trio
Director, SEMI Standards
SEMI
Introduction of Project & Status
8:45 am
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9:15 am
Randall Parker
American Semiconductor
The Need for Standards in Flexible & Printed Electronics
9:15 am
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10:45 am
Breakout Session on Selected Topics
10:45 am
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11:00 am
Break
11:00 am
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11:45 am
Review and Summaries from Breakouts
11:45 am
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12:00 pm
Wrap-Up
12:00 pm
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1:00 pm
Lunch
1:00 pm
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2:00 pm
Travel Time to NextFlex -
For a detailed program agenda for this workshop visit NextFlex.us
Join us for three-days of technology assessments, updates, discovery and planning workshops focused on the development of the electronics ecosystem and flexible, hybrid electronics, medical monitoring sensors, and their application to driving development in new electronics packaging approaches.
Industry experts and leaders will come together to focus on identifying gaps in technology development, including in design, manufacturing, standards and environmental sustainability.
The Evolution of Electronics
2023 Technology Workshops:
- NBMC Gap Analysis
- FHE Gap Analysis
- FHE Standards
- Hybrid Electronics for Advanced Packaging
8:00 am - 5:00 pm
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FEMC#13 FHE Market Forecast and Review
Registration
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that combines the best of conventional and printed circuitry. By enabling flexibility and digital manufacturing without compromising on processing capability, it promises to remove the constraints of rigid PCBs while reducing costs and hence enable new applications.
This webinar from Dr Matthew Dyson of IDTechEx provided the status of FHE, including examples that are already commercialized.
Standards and other attributes required for mass manufacturing was outlined, and the scope for FHE to be used for novel applications (including harsh environments) assessed. Finally, a roadmap covering the near, medium, and long term was presented, including how FHE development fits with the ongoing development of heterogeneous integration.
ABOUT THE SPEAKER
Matthew is a Senior Technology Analyst at IDTechEx, specializing in printed/organic/flexible/hybrid electronics and sensors. He has an MRes and PhD in Physics from Imperial College London, which aimed to better establish processing/structure/property relationships in organic semiconductors. This was followed by two years post-doctoral researcher at Eindhoven Technical University in the Netherlands, focusing primarily on organic photodetectors (OPDs). His academic research, which has been cited over 500 times, also included work on perovskite photovoltaics and aggregation induced emission materials.
At IDTechEx, Matthew analyses technical innovations and applications across the printed/flexible/hybrid landscape, attending multiple conferences and interviewing companies to establish a clear picture of the technical and commercial landscape. This analysis is published in reports on topics such as 3D electronics and printed/flexible sensors, and applied to consulting projects evaluating commercialization opportunities across printed/flexible electronics. He also manages a team of analysts covering wearable technologies, AR/VR, and emerging photovoltaics.
This webinar featured Dr. Matthew Dyson of IDTechEx outlining the status of FHE, including examples that are already commercialized. Standards and other attributes required for mass manufacturing were discussed, and the scope for FHE to be used for novel applications (including harsh environments) assessed. In addition, he presented a roadmap covering the near, medium, and long term will be presented, including how FHE development fits with the ongoing development of heterogeneous integration.
FHE Market Forecast & Review
Flexible Electronics Master Class #13
8:00 am - 9:00 am
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