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Executive

Registration

This meeting is open for FOA Members Only. 

If you are interested in becoming a member, please contact Karim Somani - [email protected].

 

United States Austin Marriott South Business Executive Expositions Technical

Hotel Information and Airport Information

Austin Marriott South

4415 South IH-35

Austin, Texas, 78744

Austin Marriott South for 219.00 USD per night - Last Day to Book: Monday, February 02, 2026

Booking link: Book your group rate for FOA Q1 Collaborative Forum

Austin-Bergstrom International Airport
3600 Presidential Blvd
Austin, TX 78719

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Austin Marriott South
4415 South IH-35
Austin, TX 78744
United States

10:30 am - 5:00 pm

FOA Golf Event (Tee Time Start) - Onion Creek Club

Onion Creek Club

2510 Onion Creek Parkway

Austin, TX 78747

5:00 pm - 9:00 pm

Women of FOA - Evening Dinner & Social Activity

Meeting room: Sycamore A&B

Day 1 -February 25, 2026 (times are subject to change)

8:00 am - 12:00 pm

Device Maker Morning Meeting - IDM's Only

Meeting room: Lone Star Ballroom

8:00 am - 8:30 am

Registration check-in & Gathering

8:30 am - 8:40 am
Karim Somani
SEMI

Meeting Start - Introductions, Agenda Review, Sponsor Recognition, Next Meetings

8:40 am - 9:40 am
Mark da Silva
SEMI

Open Forum Topics #1

9:40 am - 9:50 am
Rick Glasmann
MAX

Welcome Reception sponsor presentation - MAX

9:50 am - 10:30 am

Coffee Break

10:30 am - 10:40 am

Social Event sponsor presentation - INFICON

10:40 am
Mark da Silva
SEMI

Open Forum Topics #2

11:40 am - 11:50 am
Sean Tropsa
SEEQ

DM Lunch sponsor presentation - SEEQ

11:50 am - 1:00 pm

DM Lunch - IDM's Only

Lunch will be in rooms: Sycamore A&B and Bluebonnet

SEEQ

Continuation Day 1 - February 25, 2026 (times are subject to change)

12:00 pm - 6:00 pm

Exhibit Opens

Exhibits will be displayed in the foyer

1:00 pm - 6:00 pm

Session 1 - General Meeting for all FOA Members

Meeting Room: Lone Star Ballroom

1:00 pm - 1:10 pm
Mark da Silva

Welcome remarks & Updates

Removing Manufacturing Bottlenecks (Case Studies)

1:10 pm - 1:35 pm
GlobalFoundries & Semilab

Next-Generation In-Line AFM Metrology for Silicon and GaN Applications

1:35 pm - 2:00 pm
Northrop Grumman & Applied Materials

Reduction of Through-Silicon Via (TSV) Sidewall Roughness through Process Optimization in Bosch Dry Etch Process: A Collaborative Study

2:00 pm - 2:30 pm
Tosca Derrick
Baker Tilly

Industry – Tariff Updates

2:30 pm - 2:55 pm
Broadcom & Fabworx Solutions

Particles vs. Productivity: Root-Cause Solutions that Unlocked Tool Performance

2:55 pm - 3:25 pm

Coffee Break #1 – Sponsored by JST

JST

Improving Fab Efficiency (Case Study)

3:25 pm - 3:50 pm
ST Microelectronics & INFICON

From Insight to Action: Elevating Employee Efficiency with Smart Detection and Targeted Data Delivery

3:50 pm - 4:20 pm
Inna Skvortsova
Market Research Manager, SEMI’s Market Intelligence
SEMI

SEMI Market Outlook - Fab Investments, Equipment and Materials Forecast

4:20 pm - 4:50 pm
Michelle Williams-Vaden
Executive Director, SEMI Foundation
SEMI

SEMI Foundation

4:50 pm - 4:55 pm

Wrap-up & directions to Welcome Networking Reception (within the hotel)

7:00 pm - 10:00 pm

Welcome Networking Reception

Room: Sycamore A&B and Bluebonnet - Sponsored by MAX Group

MAX IEG

Day 2 - February 26 2026

8:00 am - 12:00 pm

Session 2 - General Meeting

Meeting Room: Lone Star Ballroom

8:00 am - 6:00 pm

Exhibits Open

8:00 am - 8:40 am
Karim Somani

Gathering & Welcome Remarks

Improve Long-Term Plant Viability (Case Studies)

8:40 am - 9:02 am
Qorvo & camLine

Lessons from the SPACE Deployment Project: Implementation at Qorvo Wafer Fab

9:05 am - 9:30 am
FormFactor & Olsson

Transforming a Mature Semiconductor Factory to Meet FormFactor’s Advanced Manufacturing Needs

9:30 am - 9:55 am
Polar Semiconductor & Mortenson

Polar Semiconductor Expansion and Modernization Project

9:55 am - 10:05 am
ControlSoft

Break Sponsor Presentation - ControlSoft

10:05 am - 10:35 am

Coffee Break #2 – Sponsored by ControlSoft

ControlSoft
10:35 am - 11:00 am
Analog Devices & ControlSoft

Transformation in Motion: A solution for 200mm fab AMHS upgrades

Agentic AI in Manufacturing (Case Study)

11:00 am - 11:25 am
Intel & Seeq

Intel + Seeq’s Multi-Agent Architecture to "Dim the lights" in facilities Operations

11:25 am - 11:35 am
Michelle Williams-Vaden
Executive Director, SEMI Foundation
SEMI

Thursday Lunch sponsor presentation - WFOA

11:35 am - 1:30 pm

Lunch - All Members & Speakers

Lunch will be in rooms: Sycamore A&B, Bluebonnet and Wrangler

SEMI Foundation

Continuation Day 2 - February 26, 2026

1:30 pm - 6:00 pm

Session 3 - General Meeting

Meeting room: Lone Star Ballroom

1:30 pm - 1:45 pm
Mark da Silva

SEMI Technology Community Update

Improving Fab Efficiency (Case Studies)

1:45 pm - 2:10 pm
Qorvo & Siconnex

Improved Fab Productivity

2:10 pm - 2:35 pm
FOA DM & Flexciton

Solving Fab-Level Execution Gaps with Intelligent Action Prioritization and Quantified Impact Modeling

2:35 pm - 3:05 pm
Taimur Burki
Sustainability Consultant
SEMI

Sustainability - Waste Management and how to Make $$ off of your waste

3:05 pm - 3:35 pm

Coffee Break #3

3:35 pm - 4:00 pm
Analog Devices & Seertech Solutions

Driving Fab Efficiency Through Automated Workforce Qualification and MES-Integrated OJT Enforcement

4:00 pm - 4:25 pm
M.I.T. Lincoln Laboratory & Eyelit

Enhancing Semiconductor R&D Workflow Flexibility and Traceability through Eyelit’s Manufacturing Operations Management Platform

Deployment of Digital Twins (Case Study)

4:25 pm - 4:50 pm
GlobalFoundries & D-SIMLAB Technologies

Dynamic Simulation Enabled Prescriptive Analytics for the AI-Driven Autonomous Factory of the Future

4:50 pm - 5:05 pm
Peilun Sun
Consortium Manager, SCC
SEMI

From Fab Floor to Climate Impact: How SCC Supports Manufacturing Decarbonization

5:05 pm - 5:25 pm
Karim Somani

FOA – Inside the Fab (@ Northrop Grumman Jul 28 – Jul 30) & Wrap-up

7:00 pm - 10:00 pm

FOA Annual Poker Tournament: Austin Marriott South

Poker Tournament: Sycamore A&B, Bluebonnet and Wrangler

Inficon logo

FOA Events - February 24, 2026

- FOA Workforce Development

Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits.  

This event is for FOA Members only.  To learn more about becoming an FOA member, email [email protected]. Visit the FOA web pages.

8:00 am - 10:00 pm Off Add to Calendar 2026-02-24 08:00:00 2026-02-26 22:00:00 FOA Summit (Q1 Collaborative Forum) Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits.  This event is for FOA Members only.  To learn more about becoming an FOA member, email [email protected]. Visit the FOA web pages. Austin Marriott South 4415 South IH-35 Austin, TX 78744 United States SEMI.org [email protected] America/Chicago public America/Chicago
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Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/new-gdsi-dicing-process-webinar-on-demand.html MSIG WEbinar tile Business Executive Technical Featured Speakers

About the Speaker:  Rich Boardman is a 15-year veteran of the Semiconductor industry whose expertise lies in equipment sets, process technology and consumables related to wafer or substrate dicing, grinding or polishing. Rich is a Senior Sales Engineer at GDSI, located in San Jose, California.

United States

Richard Boardman GDSI
Richard Boardman
Senior Sales Engineer
GDSI

Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. 

In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.

The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.

Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. .

8:00 am - 9:00 am Off Add to Calendar 2022-03-30 08:00:00 2022-03-30 09:00:00 MSIG Webinar GDSI Dicing Process Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.  In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications. The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting. Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. . United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format
GDSI logo

This webinar graciously underwritten by GDSI.  Registration is free to all attendees.

GDSI logo
Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/designing-mems-with-ge-polaris-process-webinar-on-dem… 20220302 MSIG Webinar GE Business Executive Technical Featured Speakers

About the Speaker:  Robert MacDonald is a MEMS engineer at GE’s Research. His research is focused on high performance inertial sensors. He has over 20 years of experience in the MEMS and semiconductor industries. His work has covered the product life cycle of chemical, inertial and optical sensors from design through market introduction and manufacturing.

United States

Robert MacDonald, GE Research
Robert MacDonald
MEMS Engineer
GE Research
MSIG

Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.

In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs.

8:00 am - 9:00 am Off Add to Calendar 2022-03-02 08:00:00 2022-03-02 09:00:00 MSIG Webinar GE Polaris Process Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

Registration

Complimentary for SEMI Members.

$99 Non-Members. 

Belgium France Germany Ireland Italy Japan Singapore South Korea Taiwan United States Register EMG Webinar tile Business Executive Expositions Technical Featured Speakers

Read the Speakers' Biographies.

United States

Scotten Jones
Scotten Jones
President
IC Knowledge
Naotao Horiguchi imec
Naoto Horiguchi
Program Director, Logic CMOS device technology
imec
Galya Stoeva
Galya Stoeva, moderator
Co-Chief Sales Officer
IceMOS Technology
EMG ESD Alliance FOA SOI Standards Workforce Development

Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET).  As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.

In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format
United States https://r6.ieee.org/scv-eps/?p=2865 Business Executive Technical
Highlighted content

Virtual, Online
United States

- CAST Standards

SEMI is pleased to once again partner with the HIR Symposium for this 5th Annual Symposium.  See the full Agenda.

Don't miss the plenary talk by SEMI President and CEO, Ajit Manocha at 7:40 am PST!

7:30 am - 12:30 pm Off Add to Calendar 2022-02-23 07:30:00 2022-02-24 12:30:00 Fifth Annual Symposium on Heterogeneous Integration SEMI is pleased to once again partner with the HIR Symposium for this 5th Annual Symposium.  See the full Agenda. Don't miss the plenary talk by SEMI President and CEO, Ajit Manocha at 7:40 am PST! Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Contact

Member Price: $49

Non-Member Price: $99

Registration is final. No refunds provided. No substitutions.

Lin Tso
Email: [email protected]
Phone: +1.408.943.7920

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United States Register Now Silicon Valley Forum - Environmental Sustainability Business Executive
ASNA
Edwards 170x65
UCT

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley Virtual Forum.

Contact Shane Poblete, +1.202.847.5983 or Eric Rude, +408.943.7047 to learn about available sponsorship opportunities.

Environmental Sustainability—Semiconductor Industry Challenges

High demand for semiconductor chips is driving significant growth and increased visibility of the industry. At the same time, the world is becoming more environmentally conscious and the topic of sustainability of semiconductor manufacturing is coming to the forefront. This requires the entire semiconductor value chain to concurrently support this growing demand while minimizing waste, toxic chemicals and gas emission to produce these chips. 

Join us for a Virtual Webinar on March 18, 2022 as the SEMI Silicon Valley Chapter presents “Environmental Sustainability—Semiconductor Industry Challenges” for a great line-up of industry leaders from their own perspectives.

Topics include:

  • SEMI’s Sustainability Initiative 
  • Sustainability trends in the industry
  • Smart sustainable semiconductor chips 
  • Lowering utilities consumption, reducing carbon footprint 
  • Addressing chemicals and materials of concern 
  • Increasing fabrication/production energy efficiency 
  • Net Zero Strategy; multiple company perspectives 

 

United States

Virtual Forum | Friday, March 18, 2022 | Pacific Time

9:00 am - 9:05 am
Cheryl Knepfler
Vice President Marketing
Ultra Clean Technology & SEMI Silicon Valley Chapter Committee Chair

Welcome Remarks

9:05 am - 9:25 am
James Amano, SEMI
James Amano
Senior Director, Standards, EHS, and Sustainability
SEMI

Introduction to SEMI Sustainability Initiative

9:25 am - 9:45 am
Dean Freeman, Freeman Technology and Market Advisors
Dean Freeman
Chief Analyst
Freeman Technology and Market Advisors

Searching for Sustainability in the Microelectronics and AI World

9:45 am - 10:05 am
Andrew Byrnes, Micron Technology
Andrew Byrnes
Venture Capital, AI
Micron Technology

S3: Startups for Semiconductor Sustainability

10:05 am - 10:25 am
Chris Librie, Applied Materials
Chris Librie
Director, ESG
Applied Materials

Make Possible a Better Future ESG from OEM Perspective – Applied Materials

10:25 am - 10:45 am
Bill Seymour, Entegris
Bill Seymour
Vice President and Co-Chair of Corporate Social Responsibility (CSR) Council
Entegris

ESG Strategy from Materials Manufacturer's Perspective – Entegris

10:45 am - 11:05 am
Mark Patel, McKinsey & Co
Mark Patel
Senior Partner
McKinsey & Company

Decarbonization Priorities in the Semiconductor Value Chain

11:05 am - 11:25 am

Q&A - Moderated by James Amano

11:25 am - 11:30 am
Cheryl Knepfler
Vice President Marketing
Ultra Clean Technology & SEMI Silicon Valley Chapter Committee Chair

Closing Remarks

The SEMI Silicon Valley Chapter Presents:
ENVIRONMENTAL SUSTAINABILITY—Semiconductor Industry Challenges

9:00 am - 11:30 am Off Add to Calendar Disabled America/Los_Angeles
Event format

REGISTRATION

China CSM forun Business Executive Expositions Technical

Traffic Reminder

Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan City, Guangdong Province)

  • Venue to Humen Railway Station 22 miles, 45 minutes’ drives.
  • Venue to Shenzhen Bao'an International Airport 55 miles, 65 minutes’ drive.
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China

8:30 am - 9:00 am

Registration

9:00 am - 9:15 am

Opening Remark

9:15 am - 9:45 am
wang jiangbo
Jiangbo Wang
Vice President
HC SemiTek Corporation

Key Technologies for Mass Manufacturing of MicroLEDs

9:45 am - 10:15 am
Neng Zhang
Neng Zhang
Product Director
Sinopatt Technology Co.,Ltd.

Application and Developing Trend for Patterned Sapphire Substrate

10:15 am - 10:45 am
Qian Fan
Qian Fan
Vice President
Suzhou HanHua Semiconductor Co.,Ltd

Applications and Prospects of 3DIC Technology in Compound Semiconductor Devices

10:45 am - 11:15 am
Liang Wu
Jason Wu
CEO
Ultratrend Technologies Inc.

Latest Progress and Challenges on High-quality and Large-size AlN Single Crystals Grown by the PVT Method

11:15 am - 11:45 am
Yang Wang
Yang Wang
Vice Director
Songshan Lake Materials Laboratory

Micro&Nano Fabrication Platform of Compound Semiconductor Materials and Devices

11:45 am - 1:30 pm

Break

1:30 pm - 2:00 pm
Tiejun Zhou
Terry Zhou
GM
Vital Micro-Electronics Technology Co., Ltd

Processing and Application Prospectives of Large-Scale Compound Semiconductors

2:00 pm - 2:30 pm
Zhengwei Chen
Zhengwei Chen
GM
Beijing Ming Gallium Semiconductor Co., Ltd.

Industrialization Analysis of Ultra-wide Bandgap Semiconductor Material Gallium Oxide and Its Devices

2:30 pm - 3:00 pm
De'ang Liu
De'ang Liu
Scientist
ETARESEARCH

HVPE Growth of 4 Inch GaN Freestanding Wafer

3:00 pm - 3:30 pm
Kangfu Ma
Kangfu Ma
GMA
Shanxi Shuoke Crystal Co.,Ltd.

Analysis of SiC Single Crystal Growth Technology and Application Prospect of SiC Materials

3:30 pm - 4:00 pm
Yong Ji
Yong Ji
CEO
Guizhou Haotian Optoelectronics Technology Co.,Ltd.

Large Scale Deposition Technology of AlN and AlScN for SMR BAW

4:00 pm - 4:30 pm
Zhang Xing
Xing Zhang
CEO
Compound Semiconductor (Xiamen) Technology Co., Ltd.

The Latest Progress in The Industrialization of Diamond Wafer and Diamond Heat Sink

Standards Workforce Development

Compound Semiconductor Materials Technology Forum

Time: TBD

Location:Dongguan, Guangdong, China

 

Event Contact information:

Cassie Li

SEMI China

Email: [email protected]

Phone: 86.21.6027.7645

 

Ein Wu

SEMI China

Email: [email protected]

Phone: 86.21.6027.8509

8:30 am - 5:00 pm Off Add to Calendar Disabled
Event format