SEMI News

SEMI Korea is back on track. New confirmed COVID-19 cases in Korea now average about 50 per day – with more than half from abroad – after peaking in early March, setting the stage for the Seoul office’s first on-site program since the global coronavirus outbreak began.For four days in late July, SEMI Korea held the Semiconductor Process Technology Tutorial (SPT Tutorial) at COEX, home to SEMICON Korea. Nearly 180 university students and chip engineers gathered for two semiconductor manufacturing courses (beginner and intermediate) taught by professors from schools including Hongik and Sungkyunkwan Universities and senior engineers from major semiconductor makers. The beginner’s course covered the end-to-end chipmaking process and the intermediate class examined key phases of semiconductor manufacturing including silicon wafer preparation, cleaning and CMP, lithography, etch, metrology and inspection, implantation and diffusion, deposition and packaging.Social distancing, now part of daily life in Korea, and other protective measures implemented by SEMI Korea to ensure the safety and well-being of the attendees and lecturers made the event possible. SEMI Korea followed best COVID-19 practices including the following.Step 1. Site check of COVID-19 prevention systemCOEX is amply equipped with sanitizers and thermal imaging cameras, with medical staff available in case of an emergency. COEX also constantly monitors air quality at the entire facility while keeping it well-ventilated. Step 2. Screening of registrants Online medical questionnaire review: After attendees completed a SEMI Korea medical questionnaire and submitted it prior to registration, SEMI Korea checked the health status of each attendee and whether they had recently traveled overseas to a high-risk COVID-19 region. Registrant identification: Upon each registrant’s arrival at COEX, SEMI Korea confirmed that the identification of each attendees matched the registrant who completed the questionnaire. Temperature measurement and sanitizer use: SEMI Korea required all attendees to apply hand sanitizer before entering the classroom and measured the body temperature of each. Anyone running a temperature would have been denied entry. Mask Wearing: All attendees were required to wear mask socially distance during check-in and the lectures. Attendees line up for registration while social distancing. Step 3. Badge Distribution and Classroom Entry: Once attendees had passed through all the safety protocols, they were given badges and admitted to the lecture room. Each classroom table was equipped with acrylic desktop social distancing shields to contain the respiratory aerosols of the students. In addition, only one-way passage was allowed through entrances and exits to minimize contact among participants. Acrylic desktop shields helped with social distancing. "Thanks to SEMI's thorough COVID-19 prevention plan for COVID-19, both the speakers and attendees participated in the tutorial confident that the environment was safe,” said speaker Professor Taesung Kim of Sungkyunkwan University. “I look forward to seeing SEMI continue to take these precautions to help the semiconductor industry remain connected and grow.”SEMI Korea moves forward with nine on-site events in 2020Webinars will continue to serve as important forums for SEMI Korea to help members connect, collaborate and innovate while preventing the spread of COVID-19. But to help the industry grow and prosper, SEMI Korea’s on-site events – which have always and will continue to make safety the top priority – will remain robust.In 2020, SEMI Korea will host nine on-site events including the MEMS Sensor Forum and SMC Korea. We appreciate the industry’s support and cooperation as the world continues to battle COVID-19 and look forward to connecting with members in webinars and at on-site events again soon!Jaegwan Shim is a marketing specialist at SEMI Korea.

At SEMICON West 2020, the Honorable Al Gore, former U.S. Vice President and recipient of the Nobel Peace Prize for environmental activism, commented on the world being in the midst of a “sustainability revolution.” Just what did he mean by that, and why bring that message to us? The answer is that he believes the digital transformation wields the magnitude of the agricultural and industrial revolutions, but with the exponential speed that the semiconductor industry created and enabled. Ok, that would put him in the right place… SEMICON West.Among a rich lineup of speakers to mark the 50th anniversary of the event – and 50 years of the semiconductor industry facilitating the innovation of the Information Age -- Gore joined other icons in their fields who graced the virtual stage for our featured keynotes. Each analyzed how microchip advances are critical to solving some of the world’s greatest challenges.As host of the conference, I had the privilege of introducing Gore; Gary Dickerson, President and CEO of Applied Materials; and, Dr. John Kelly III, Executive Vice President and Director of IBM Research, along with other renowned speakers. Their insights seemed especially timely for how our global supply chain can help to build a more sustainable future. Following are a few of the highlights from their discussions. Al Gore – The Planet Faces Existential CrisisIn his keynote conversation with Greenbiz editorial director Heather Clancy kicking off SEMICON West 2020, Gore emphasized that digital technology advances – and in particular microchip innovation – provide the greatest opportunities to overcome the world’s most epic challenges. Chip breakthroughs will be the cutting edge of what he called the rapidly growing sustainability revolution to improve energy efficiency, reduce our reliance on fossil fuels, and optimize the performance of renewable energy generated by solar, wind, and electric battery sources.“We face an inflection point as we rely more on data and communications technology, particularly in areas like cloud computing and artificial intelligence,” Gore said. “Industry is aware of this and working on it, but this meeting (SEMICON West 2020) with your present leadership marks a real turning point. It’s something to be proud of, something to be celebrated. It’s what gives me hope.”Citing Moore’s Law and enormous strides made in chip efficiency and effectiveness, Gore said that within two years smart chips will make everything from solar panels and batteries to renewable energy plants and electric vehicles to be both cost- and performance-competitive with traditional energy sources. Afterwards, renewable energy will be more attractive. Gore urged the energy-intensive semiconductor industry to shift to more renewable power sources for manufacturing. To meet this challenge, Gore encouraged the industry to embrace strategies for “step changes”: First, collaborate and share best practices more transparently across the entire microelectronics value chain. Examples already abound where “cutting-edge apps, AI, and deep learning reduced data server energy use significantly without hardware changes,” he said. Second, reduce electricity required to manufacture smarter and smaller semiconductors. Gore encouraged “all of the equipment manufacturers to work together to reduce the amount of carbon dioxide emissions in manufacturing these advanced semiconductors.” Third, follow the lead of a growing number of companies that “continue decarbonizing the power supply on which data centers operate,” he said. Fourth, work with government through the Science Based Target Initiative, which sets decarbonization limits that keep global temperatures no more than two degrees Celsius above preindustrial levels. Finally, rely on “diversity of thought” and “collective thinking” when innovating for the digital future. Research and experience prove that different points of view lead to better decisions. The technology industry has made progress in workforce diversity, but more can be done, Gore said. This last point plays to our collaborative strengths as SEMI members and an industry. “It is just unbearable to imagine a future generation living with the kinds of consequences scientists tell us would ensue if we don’t heed their warnings and solve this crisis,” Gore said, drawing parallels to the COVID-19 pandemic. “We have to accept the situation and make sure we do everything we can. I am inspired by this industry’s leadership, innovation, and spirit to rise to the challenge and make a difference.”Gary Dickerson – Making Possible A Better FutureTo ensure another 50 years of accelerating growth and innovation, today’s semiconductor leaders must share a deep commitment to a more sustainable and just supply chain industrywide.“The first thing we need to do is decouple our growth from environmental impacts,” Dickerson said in his keynote. “Our responsibility as leaders is to leave the world a better place.”Dickerson said that while he firmly believes the explosion of processing and storage data has “the potential to change the world,” the downside is that it also has the potential to rapidly expand our industry’s carbon footprint. Without dramatic change, electrical usage will continue to rise as machines generate and consume more data, compute performance progresses, and workloads from the edge to the cloud grow.“It will be impossible to create neural networks (using AI) with the rate of today’s power consumption,” Dickerson said, noting that more improvements must be made in the performance and efficiency of semiconductor devices, architectures, structures, materials, and advanced packaging.Dickerson urged the electronics ecosystem to “permanently think and act differently” by breaking down communication barriers among systems integrators, equipment suppliers, design and manufacturing service providers, and other industry players. Sharing learnings and best practices will be vital to this change, he said. Dickerson unveiled SuCCESS2030 (Supply Chain Certification for Environmental and Social Sustainability) – Applied Materials’ 10-year roadmap for creating a more sustainable supply chain – during his talk. Under the SuCCESS2030 initiative, Applied Materials will hold its suppliers to the company’s own high standards for committing to renewable energy and workforce diversity by setting targets such as: Reducing supply chain carbon emissions 15 percent in four years by relying more on intermodal shipping than air freight Transitioning the supply chain to recycled content packaging, with a target of 80 percent by the end of 2023 Eliminating phosphate-based, pre-treatment of metal surfaces by 2024 Working with trade associations like SEMI to develop diversity and inclusion strategies to increase underrepresented minorities in the workplace Dickerson said that deeper and more open partnerships between Applied Materials and its customers and suppliers have led to a number of promising outcomes. Examples include hardware and software upgrades, product and service optimizations, and improvements in chip architectures that increased throughput density for higher system performance while decreasing power and chemical consumption, costs, and space requirements. What’s more, Applied Materials recently introduced its Selective Tungsten Process Technology, which uses new materials, atomic-level designs, and ultra-clean rooms to improve the performance of interconnected transistors while lowering power consumption.Dickerson said the COVID-19 pandemic has awakened the world to the power of digital technologies that make it possible to communicate, collaborate, and share data across the globe while sheltering in place. “When I think of the world’s grand challenges, it’s clear the semiconductor industry has a critical role to play,” Dickerson said. “I strongly believe we’re in a position to shape the future and leave the world a better place.”John E. Kelly III – 50 Years That Changed The World … And We’re Just Getting Started During the past half century, semiconductors have given rise to essentially every major technology advance, Kelly said in his keynote. Microchip innovation has played a central role in rocketing humans to the moon, simulating nuclear weapons on a supercomputer, connecting people to nearly everything via mobile devices, and keeping people alive with pacemakers and other electronic medical devices.The strides in innovation have been staggering. In 1970, a semiconductor chip featured a few thousand components. Today, that number stands at 50 billion. Breakthroughs in everything from materials and chemicals to polishing, processes and interconnectivity have driven gains in power-efficiency and performance while reducing chip size.Moore’s Law is far from dead. Paraphrasing Winston Churchill, Kelly said, semiconductor innovation today is not at “the beginning of the end, but at the end of the beginning, and the best is yet to come – driven by extreme collaboration and extreme innovation to solve the world’s biggest challenges.”Kelly said he believes technology is the only answer to the onslaught of grand challenges confronting societies and people today, including air and water pollution, climate change, diminishing natural resources, storm-related disasters, food supply shortages, and the COVID-19 pandemic.Kelly lamented that the world’s response to COVID-19 illustrates that “not much has changed” since the Spanish Flu crisis a century ago. The same technology – masks – remains the primary defense. “I think if we had used digital technologies and computer modeling earlier on, we could have detected the spread of this flu” to minimize its impact, Kelly said.Today’s computer modeling and analytics capabilities aren’t quite ready yet to tackle such complex problems as pandemics, global warming, or water contamination. However, Kelly said, several game-changing technologies – all powered by semiconductors – are emerging as promising answers to our most daunting challenges.“It’s all about the data, and artificial intelligence is the way forward – it’s analytics on steroids, and many new devices will be required to drive AI at the scale of these problems,” Kelly said. “The second technology revolves around not just cloud computing but edge computing and cloud at the edge. Data will be generated in enormous amounts at the edge, which is where we will need to store and compute the data. The next is Quantum Computing. Frankly, we do not have enough computing power yet to look at some of the biggest challenges we have.”All these advances will present new challenges for the semiconductor industry, such as developing new materials, new chip architectures and new mapping structures for AI-embedded devices to reach their full potential.With many of these disruptive innovations too large for any company to solve singlehandedly, Kelly advised industry players to form more “radical partnerships.”“Extreme collaboration and extreme innovation will drive solutions to all these world challenges,” Kelly said. “The best is yet to come.”Radical partnerships… Sustainable revolutions… Extreme innovation… It’s been 50 years of SEMICON West, but it sounds like we’re just getting the real magic started. Like John Kelly said and the other keynoters emphasized, the best is yet to come.Dave Anderson is president of SEMI Americas.

SEMI President and CEO Ajit Manocha has voiced his support for amendments the United States House of Representatives and Senate included in the Fiscal Year 2021 National Defense Authorization Act (NDAA) that would authorize important programs to support semiconductor manufacturing and research in the U.S.“SEMI is very pleased the House and Senate included in the NDAA provisions to support semiconductor manufacturing and research in the United States,” Manocha said. “The U.S. has not kept pace with the growth of semiconductor manufacturing abroad. The U.S. share of global semiconductor manufacturing capacity has been cut in half to just 12 percent over the past 20 years and is forecast to fall to 10 percent by 2023. We applaud the sponsors for their support, leadership and hard work to win House and Senate approval to increase federal government support for the industry. However, this is just the start of what needs to be done to reverse this 20-year decline. The CHIPS for America Act’s investment tax credit for new and expanded semiconductor manufacturing facilities is essential to provide a robust, transparent and reliable federal incentive that will be the foundation of renewed growth of U.S. fabs.”In addition to authorizing a new grant program, the House and Senate amendments would direct the Defense Department to create programs with the private sector to: Direct the Defense Department to create programs with the private sector to encourage the development of advanced, measurably secure microelectronics, Establish a Multilateral Microelectronics Security Fund the U.S., its allies and partners will use to reach agreements promoting consistency in their policies related to microelectronics, Direct the President to establish a subcommittee on semiconductor technology and innovation within the National Science and Technology Council, and Direct the Secretary of Commerce to establish a national semiconductor technology center and other important new programs. The House amendment would authorize an additional $1.2 billion for semiconductor research. Both the House and Senate are expected to complete debate and pass the NDAA bills this week.SEMI members operate semiconductor supply chain facilities across the U.S. Of the 25 states with at least one major facility, 18 boast large semiconductor manufacturing fabs and other facilities while seven offer semiconductor equipment and materials production. Operating for decades, many of these facilities are key pillars of local economies and underpin hundreds of small businesses that supply components and materials. The U.S. semiconductor supply chain accounts for about 240,000 high-skill and high-wage jobs nationwide.Joe Pasetti is Vice President of Global Public Policy and Advocacy at SEMI.

Humanity has survived almost unimaginable challenges over the past 5,000 years of documented human history. From war, famine and natural disasters to the first global pandemic in the last 100 years, more often than not, people have relied on one another to survive and thrive again. As the industry association representing the global microelectronics industry, SEMI has similarly made collaboration and community integral to the fabric of its organization. From helping members to succeed through the COVID-19 pandemic to facilitating member-driven industry standards around environmental health and safety, materials, and manufacturing capabilities, this approach shows members that standing together is better than standing alone.On the eve of the 50th annual SEMICON West (July 20-23, 2020) — the first virtual edition in SEMI’s history — I spoke with SEMI’s vice president of technology communities, Michael Ciesinski, about the role of SEMI in tackling big challenges through an active member community intent on solving problems through collaboration.SEMI: How long have you worked with SEMI and in what capacity?Ciesinski: In January 2016, I started my second tour at SEMI when FlexTech, the industry consortium I’d been leading, became SEMI’s first strategic partner. Nearly two years into that role, SEMI President CEO Ajit Manocha asked me to form Technology Communities to engage members with common interests. After FlexTech, we brought on the Fab Owners Alliance, then MEMS Sensors Industry Group (MSIG), and later the Electronic System Design Alliance (ESD Alliance).SEMI now has more than 20 communities in all, including Smart MedTech, Smart Data AI, Smart Manufacturing, Electronic Materials, and Integrated Packaging, Assembly and Test.SEMI: What is your role with Technology Communities — and how do members stand to benefit?Ciesinski: The leadership of Technology Communities ensures that SEMI’s benefits and services align to our members’ interests so we can provide member benefits that matter most. This spans forming communities where people hold common interests (e.g., advanced packaging) to facilitating standards that will promote intelligence in manufacturing (e.g., data standards for AI and machine learning) as well as providing R D funding.I’m especially proud that over the past three years, SEMI has brought more than $40 million in R D funding to our members, with most grants in the $500,000-$1 million range. We’ve been especially successful in securing funding in flexible hybrid electronics (FHE) through U.S. Army Research Laboratories (ARL), a model we first developed through FlexTech.Two recent recipients of FHE funding, GE Research and ITN Energy Systems, show how the grants are spawning partnership opportunities among commercial enterprises, R D organizations and universities. In developing lightweight, non-invasive wearables, including a human-performance sweat-monitoring patch that remotely analyzes sweat to detect hydration levels and other vital signs, GE Research is using key components such as sensors and lightweight batteries in its designs.ITN Energy Systems designed a flexible all-solid-state lithium battery that’s printed on light, flexible substrates to power small and incredibly thin applications.Universities are also benefiting by plugging into the SEMI ecosystem. In fact, 40-50 percent of funded projects are seeding commercialization by universities. This is another validation that SEMI’s collaborative, community approach to microelectronics is working.SEMI: Position, Timing and Navigation (PNT) is another hot area where SEMI has secured ARL funding. What makes this funding different and why is it important?Ciesinski: The PNT grant makes ARL funding available to the MEMS Sensors Industry Group (MSIG) members through SEMI for the first time. If you’ve ever lost GPS signal while coming out of a tunnel, you know how frustrating that is. For us, that’s an inconvenience, but for a healthcare worker in a remote location who’s waiting for a delivery of medication by drone, it could be life-critical. While that’s just one example of why we need PNT to operate when GPS isn’t available, I can imagine dozens of other important dual-use cases, including autonomous driving.SEMI: How else do Technology Communities benefit under SEMI?Ciesinski: Technology Communities need access to diverse resources to spur continuous innovation. Electronic Materials Group participants, for example, need to stay informed on regulations coming out of Asia, the U.S. and Europe that may affect their businesses. Where else other than SEMI can like-minded stakeholders congregate with people up and down the supply chain to determine whether industry-wide action is needed on regulation?SEMI: What is the importance of SEMI’s global footprint?Ciesinski: I’ve worked with many associations and managed major industry consortia. The clear advantage of SEMI is our global footprint. And that’s vital because microelectronics is a global industry involving a multitude of stakeholders that play essential roles in the supply chain.Let’s say you want to discuss EU regulations on hazardous chemicals. Rather than decipher these complexities alone, you can pick up the phone to speak with someone on SEMI’s European team to learn what’s critical.What if you’d like more information on the 20-plus new fabs that are going up in China? You can explore that question with our SEMI China or SEMI Industry Research and Statistics teams.SEMI: How has SEMI evolved over the years?Ciesinski: SEMI has a long history of providing what the industry cares about. We started in trade shows and pivoted to industry standards. We began with small silicon wafers and wafer carriers, and now within the span of 50 years we’re working on data-format standards that will support the application of AI and machine learning (ML) in the semiconductor industry.While highly varied today, data-format standards will help component manufacturers refine processes to create more efficient solutions. This ARL-funded program, which pairs SEMI members with the grant recipient, Cornell University, may offer dramatic gains in the productivity of semiconductor manufacturing.SEMI: How does SEMI’s approach to COVID-19 reflect core values of collaboration and community?Ciesinski: Together with Ajit Manocha, CMO Terry Tsao and other team members at SEMI, we pulled together a task force to help SEMI members navigate the pandemic.We tapped two existing groups, Environment, Health and Safety (EHS) and Information Technology Leadership (ITL) from the start, documenting their strategic and tactical approaches to help all members through the COVID-19 resource section of our website. The EHS section provides tips on facilities and meetings, employee policies, business travel and communications, while the ITL section lists insights on computing hardware for staff, licensing, networks, security and employee policies.Our EHS leadership team, which includes Entegris, Axcelis, Versum, and Intel, immediately started sharing best practices for sanitizing facilities. As a result of team meetings, SEMI EHS shared best practices on keeping the workforce remote and guidelines for returning people to work safely. From securing PPE and safeguarding employees and visitors by performing thermal scanning to outlining communications around potential employee exposures, EHS has provided meaningful resources for the benefit of all members.SEMI also took immediate steps in the area of advocacy. Our advocacy team in Washington, D.C., together with regional SEMI presidents around the world, have ensured that semiconductor facilities were and still are considered essential businesses in the U.S., Europe and Asia. That’s because microelectronics are foundational to fighting the pandemic.Microfluidics are critical to the Reverse Transcription (RT) Polymerase Chain Reaction (PCR) tests most commonly used for COVID-19. Sensors are embedded in the pulse oximeters that allow patients and healthcare professionals to monitor a vital rubric: oxygen saturation level. If oxygen saturation level drops into the low 90 percentiles or below, it may be time to go to the hospital for treatment.Microcontroller units are essential components in a wide range of hospital equipment, including the ventilators that may make the difference between life and death in the most seriously ill patients.SEMI: How can the ingenuity realized through microelectronics continue to help us tackle other big problems? Ciesinski: We have MEMS and sensors to thank for distributed intelligence, giving us the ability to put sensors anywhere, locally based in the field or in the packaging house.Food production is a prime example. Leveraging miniaturized wirelessly connected sensors, we can trace food through the entire production lifecycle, from the seed in the ground to the food in the warehouse and, ultimately, to the product that lands on the table.From larger enterprise such as IBM Food Trust to small startups, we’re using MEMS and sensors to improve crop yields so we can feed a human population that’s growing each year.There’s a sustainability piece as well. We’re using MEMS and sensors to reduce the amount of fertilizer or other nutrients or chemicals in the soil. That’s good for the environment and for the agricultural workers who labor in the fields.MEMS and sensors can also condense the time it takes to perform a specific task, conserving human resources.SEMI: Where do you think SEMI will go in the next decade?Ciesinski: Ten years from now, I believe we will still have our global footprint in place. I expect it will expand, particularly in Asia.We may also expand into new areas such as Latin America and Central America, which would provide at least two major benefits: People working in microelectronics would, I hope, have access to better quality of life. And diversifying the supply chain would allow nations and regions to have more control over the products they need, from PPE to medications, which may help us to better manage through the next pandemic.I am also hopeful that SEMI will be on the leading edge of helping our members communicate in much different fashion from what we have today. We’re already expanding beyond the paradigm of in-person meetings for standards meetings and conferences. As we move forward, I think we’ll see a hybrid solution to doing business, combining in-person meetings with virtual conferences and digital content that’s available 24/7.Whatever changes we see in SEMI, I’m confident that we will continue to see a global footprint in an industry association that prioritizes connections among members.Engage in the SEMI experience at upcoming SEMICON WestRegister today to hear from keynote speakers such as environmental advocate and former U.S. Vice President Al Gore, futurist and author Steve Brown, and IBM Research senior vice president and director Dr. John E. Kelly III, and Lea Gabrielle, special envoy of the Global Engagement Center for the U.S. State Department, at SEMICON West , July 20-23, 2020. Content will be live streamed and available on-demand. Michael Ciesinski is vice president of Technology Communities for SEMI, the global microelectronics industry association, appointed in August 2018. At SEMI, he directs activity for more than 20 industry groups, oversees the association’s R D funding program, and develops new technology initiatives to serve SEMI’s 2,400 members. Prior to re-joining SEMI, Ciesinski was president/CEO of FlexTech Alliance, an industry consortium focused on new methods of creating electronics. From 1995-2008, Ciesinski served in a similar role at the U.S. Display Consortium (USDC), a private/public partnership chartered with building the infrastructure for electronic display and flexible electronics manufacturing. Both FlexTech and USDC annually sponsor multimillion dollar technology development programs and provide industry technical, financial and market services. Ciesinski is a graduate of the University of Albany, NY, and a former member of the Dean’s Advisory Committee at California Polytechnic State University.Maria Vetrano is a PR consultant at SEMI.

Data recently collected by SEMI points to only a moderate slowdown in the industry’s pursuit of talent, illustrating the growing and significant need for attracting workers at all levels of the organization. With COVID-19’s devastating impact on many sectors of the economy, the time is ripe to sharpen the industry’s focus on attracting and training a new wave of workers to meet the growing talent needs across our industry.To help illuminate the state of microelectronics industry hiring during the pandemic, following are three takeaways from recent workforce development data. Key Takeaway 1 – Emsi Hiring Data and Analytics ReviewIn a May 5 SEMI webinar on the Future of Work, presenter Andrew Crapuchettes, CEO at Emsi, a labor data analytics firm based in Moscow, Idaho, revealed that the U.S. semiconductor equipment and device manufacturing sectors posted 199,326 total jobs (32,022 unique positions) from March through June 2020 with an advertised median annual salary of $68,500 – the highest posting intensity for all other occupations and companies in the U.S. Crapuchettes noted that “although the job postings number was actually down from the previous quarter, some of the large companies have shown flat or growing postings during this period. At Emsi, we are evangelists for more accurately establishing the requirements for the job to more closely match the skills actually being sought.”He pointed to a gap between the skills employers list in job postings and those employees itemize in their resumes. Today’s use of algorithmic resume analysis, however, may reveal false gaps in hiring. Emsi is working with several Fortune 500 companies in the electronics sector to help them analyze their job postings. The goal: to better understand if they have identified the right skills for their business and the recipe for attracting top talent. Emsi supports programs such as the SEMI Works workforce development initiative that are out to more closely align job seekers and curriculum development with the skills needed for microelectronics design, development and manufacturing.During COVID-19, Crapuchettes sees companies across all industries doubling down on employee training. For many organizations, a business slowdown is an opportunity to identify and work to fill employee skill gaps and prepare companies to emerge stronger once the pandemic has passed. Key Takeaway 2 – SEMI COVID Impact SurveyIn March, April and June, SEMI surveyed members to evaluate the impact of COVID-19 and help inform SEMI’s response. Among the questions in the June survey was “How has COVID-19 impacted your hiring plans?” Of the more than 300 respondents, just 13% reported a hiring freeze and 55% said their hiring plans remain unchanged.Figure 2: Data from SEMI COVID-19 Impact Survey All SEMI regions show a similar pattern. Japan, Korea and China reported little to no slowdown in hiring as shown in Figure 2. Differences across regions were notable with more cautious approaches to hiring adopted by North America, Europe and Taiwan, with some companies slowing hiring for certain positions.Key Takeaway 3 – SEMI Survey of Workforce Development Advisory CouncilSEMI relies on members for industry insights we use to build, evolve and prioritize our programs. A June survey of SEMI America’s Workforce Development and Diversity Inclusion Advisory Council showed that, while some member companies have delayed hiring until the pandemic’s impact of the industry is clearer, most respondents see this period as an opportunity to attract talent to the electronics industry and maintain hiring programs to meet the growing demand for talent the digital revolution is fueling. The survey data, as shown in Figure 3, is consistent with Emsi’s results and a larger SEMI member survey. Our June survey also illustrated the strong desire by the Council for SEMI to support diverse communities and lead efforts to connect talent from these groups with career opportunities in electronics. All survey respondents urged SEMI to place the highest priority on promoting Diversity Inclusion in the workforce, with 57% ranking university outreach as a high priority. Visit the Workforce Development Pavilion at Virtual SEMICON West 2020 for More InformationThe microelectronics industry is making a huge impact in the COVID-19 era – from developing the tools to run algorithms for companies working on a vaccine, to keeping the internet humming for home workers and online ordering for homebound seniors. But these services will only continue to evolve at a rapid clip with the right talent. SEMI programs remain laser-focused on pursuing and developing that talent.Thank you to all members who responded to the surveys and Emsi for contributing to understanding of the workforce need in the current climate. We invite all members to connect with SEMI Workforce Development activities. We need your help to align skills to curriculum (SEMI Certs), presenting at our workforce development events and donating to the SEMI Foundation, which provides financial support for much of our work.Learn more about how you can help the industry grow its talent pipeline at the SMART WorkForce Pavilion at the virtual SEMICON West – July 21-23! Checking out the pavilion is free, but there’s a modest fee for the content. Register now for a discounted all-in pass to enjoy blister- and COVID-free access to the first virtual SEMICON West ever. Shari Liss is Executive Director of the SEMI Foundation. She oversees the development and success of all programs from K-12 through re-skilling for veterans.

Emerging applications powered by 5G and artificial intelligence (AI) are expected to be a boon to the semiconductor industry, but only once chipmakers overcome a key challenge: Architecting chips that meet the exacting performance, power consumption, size and cost requirements of devices for mid- to high-end applications. One technology – heterogeneous integration – promises to meet these demands and help drive future leaps in semiconductor innovation in the post-Moore era. To help the industry better grasp the technology challenges and business opportunities associated with deploying highly integrated chip and packaging technologies, SEMI and AI on Chip Taiwan Alliance recently gathered industry leaders from organizations including ASE, Unimicron, Dialog Semiconductor, Cadence and AITA to discuss technology trends and the vital importance of building a cross-industry exchange platform to advance next-generation manufacturing processes critical to heterogeneous integration. Following are key takeaways from the forum, Heterogeneous Integration Enables 5G and AI. Overcoming Heterogeneous Integration Technology Challenges Key to Advances in Taiwan High-End Semiconductor Manufacturing The introduction of the Heterogeneous Integration Roadmap (HIR) by the International Technology Roadmap for Semiconductors team in 2016 was an important first step, Dr. C.P. Hung, Vice President of ASE Group, noted in his opening remarks. The HIR is designed to stimulate pre-competitive collaboration to advance heterogeneous integration technology development and accelerate electronics innovation. The roadmap provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. Today, the HIR working group focuses on high-performance computing (HPC), 5G and other leading-edge technologies.Dr. Hung predicted that heterogenous integration will reshape traditional collaborations between the semiconductor ecosystem and supply chain in order to clear I/O bottlenecks that hamstring high-performance applications. The retooled industry connections will also need to enable high I/O pin counts, ultra-thin devices, and high-frequency signal shields. In an important step forward, the chip industry today is developing a platform that enhances wafer-level advanced packaging services and deepens cooperation with Oversea Assembly and Testing (OSAT) and substrate supply chain partners. Overcoming the current limits of IC substrates – the connection between IC chips the PCB – is one key for heterogeneous integration technology to flourish, said Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron. He noted that the industry must tackle limits to PCB thickness, substrate density, fine pitch and automation to meet the needs of high-end packaging customers. Another barrier the industry must be surmounted is to make the currently inscrutable confidentiality requirements for patents of foreign materials – key to improving chip yields – easier to access and understand for substrate engineers. Chen said partnerships across the entire industry will be necessary to break through this and other technology breakthroughs. Supply Chain and Cross-Border Ecosystem to Strengthen Partnerships for Further DevelopmentTaiwan has long invested heavily in advancing semiconductor manufacturing and application engineering technologies to become a top global chipmaking hub and, in the process, has been behind significant leaps in optimizing chip functionality, said Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany). With its semiconductor manufacturing prowess, Taiwan can also play a central role in maturing advanced heterogeneous integration packaging technology while managing development costs by partnering with its international supply chain community to overcome technical challenges more effectively, Liu said. The region can also help forge partnerships, even among competitors, to build the ecosystem essential for heterogeneous integration technology to shine.EDA tools will be critical in understanding and resolving heterogeneous integration technical issues since IC substrate, packaging and chip design all pose interdisciplinary engineering challenges, said Julian Sun, Product Marketing Director at Cadence. To help the industry navigate these challenges, Cadence has launched intelligent system design products – solutions that address a wide range of design problems with semiconductor nanometers, micrometers on packaging and testing, and PCB level micro/millimeters to Pin/Pitch, I/O models, and thermals and electricity. By supporting various technical designs, Cadence helps customers shorten the design cycle to strengthen design quality and reduce costs.Sun also pointed to the vital importance of overcoming the significant challenge of designing silicon interposers for heterogeneous integration. Today’s EDA tools are capable of optimizing the design of complex structures including 5GAiP and HBM and are instrumental in aiding Taiwan’s semiconductor ecosystem players to quickly adapt to shifts in the evolving heterogeneous integration market.Heterogeneous Integration Enables 5G and AI speakers (L-R): Julian Sun, Product Marketing Director at Cadence, Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron, Dr. C.P. Hung, Vice President of ASE Group, Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany), Dr. Shih-Chieh Chang, AITA Executive Secretary Designing AI chips is particularly difficult as semiconductor makers struggle with high costs and low yields, said Dr. Shih-Chieh Chang, AITA’s Executive Secretary. That’s why the chip industry now uses FPGAs for small-volume production of AI chips, which makes it easier to improve manufacturing yield through redundant design. For its part, AITA has formed a special interest group (SIG) to help form connections among the chip industry, academia and research institutes. The association’s goal is to build a platform for mass production of AI chips.To get involved in SEMI Taiwan Heterogeneous Integration related events, please contact Ula Huang, outreach senior specialist, at [email protected] Fang is a coordinator and Ashley Huang is a specialist in marketing and public relations at SEMI Taiwan.

Many companies are applying Fourth Industrial Revolution initiatives in manufacturing, though only a few have managed to successfully integrate the smart manufacturing technologies at a scale that allows them to realise significant economic and financial benefits.Known as lighthouse companies, these organisations have taken their smart manufacturing journeys from pilot to integration at scale, serving as beacons to others in overcoming challenges in their production systems through the adoption of leading-edge technologies such as artificial intelligence, additive manufacturing and advanced analytics.At the recent SEMI Southeast Asia webinar Journey to Recovery of the E E Industry, Dato' Azman Mahmud, Chief Executive Officer of Malaysian Investment Development Authority (MIDA), spoke about building Malaysia’s very own Lighthouse Project comprising multinational corporations that will act as anchors to help guide local players into this new venture.During the webinar, Dato' Azman elaborated about Malaysia’s competitive edge – its diversified economic structure and government support. He said the key to sustaining this competitive edge, however, is that the Malaysian economy must be digitally empowered. The Lighthouse Project is one programme that will help achieve this objective. We are inspired and encouraged by this initiative. As firm believers in connecting and collaborating, SEMI Southeast Asia supports programmes that advance the entire microelectronics ecosystem. We look forward to seeing MIDA drive this project, and we encourage Malaysian E E companies to tap MIDA’s expertise in this field. Ultimately, we are confident that through this initiative and the adoption of Industry 4.0 technologies, Malaysia will be repositioned as a top global manufacturing nation. Bee Bee Ng is president of SEMI Southeast Asia.

On June 20, President Trump signed an executive order (EO) suspending the issuance of H-1B, H-2B, J-1 and L visas for applicants residing outside of the United States without an active work permit. The order took effect today and will be in force through the end of 2020. The suspension of H-1B and L-1 visas, in particular, likely will impact negatively the ability of U.S. companies in the semiconductor manufacturing supply chain and the broader technology community to recruit and retain global talent and to temporarily transfer international engineers and executives to support critical operations in the U.S.According to the administration, the issuance of visas for skilled temporary workers into the U.S. poses a “significant threat to employment opportunities for Americans affected by the extraordinary economic disruptions caused by the COVID-19 outbreak.” Although SEMI fully supports administration efforts to address economic disruptions and job losses caused by the pandemic, we believe blanket restrictions on high-skilled immigration will be counterproductive to government and industry initiatives supporting a broad-based economic recovery. Semiconductors are the foundation of all electronics and information technology (IT), enabling innovation and growth in countless other industries including medical devices and the IT solutions that enable remote work and the connectivity desperately needed in current economic times. Access to global engineering talent and the worldwide mobility of technology executives are central to supporting the industry’s efforts to contribute to economic recovery in fields ranging from healthcare and telecommunications to transportation infrastructure.The EO authorizes the Secretaries of State, Homeland Security and Labor to establish criteria for exceptions to the blanket ban, including employment categories that: are critical to the defense, law enforcement, diplomacy, or national security in the U.S. provide medical care to currently hospitalized COVID-19 patients provide medical research at facilities to help the U.S. combat COVID-19 are necessary to facilitate the immediate and continued U.S. economic recovery The Department of Homeland Security’s Cybersecurity and Infrastructure Security Agency (CISA) has classified workers in the semiconductor supply chain as essential to the effective operation of critical economic activity as the nation addresses the economic fallout of COVID-19. In lieu of rescinding the total ban on visa applications, SEMI urges the Secretaries to incorporate the CISA guidelines for semiconductor supply chain workers as they assess categories for application exceptions. SEMI will continue to advocate for programs and policies that enhance U.S. economic competitiveness, including immigration rules that ensure the U.S. can attract and retain the highest skilled talent from around the world without compromising employment opportunities for U.S. workers. As Senate Judiciary Chairman Lindsey Graham noted following the issuance of the EO, “Legal immigration is a positive for the American economy, and visa programs allowing American companies to secure qualified, legal labor throughout the world have benefitted economic growth in the United States.”Karl Kailing is manager of Public Policy and Advocacy at SEMI.

As the fight against COVID-19 presses ahead, many healthcare workers, especially those on the front lines, are being pushed to their limits and beyond to ensure our health and safety. To help doctors and nurses combat the virus, SEMI Taiwan mobilized six leading Taiwan semiconductor companies last month to donate personal protective equipment (PPE) designed for industrial operation to medical staff. The gear included powered air purifying respirators (PAPR), half facepiece respirators, head tops, protective coveralls, and air filter canisters.On behalf of the semiconductor industry, SEMI Taiwan worked closely with industry leaders and the government to deploy the direly needed resources to support the domestic medical community. The Taiwan Association of Medical Technologists accepted the donations in the ceremony attended by Taiwan CDC Deputy Director-General Chuang Jen-hsiang. The largesse is the result of public-private partnership to provide medical supplies to 35 hospitals and medical laboratories across Taiwan. Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan, and six Taiwan semiconductor companies stepped up to help combat the coronavirus pandemic. TSMC Charity Foundation responded with PPE giveaways in March in a first wave of protective equipment donations to medical personnel. Before long, Vanguard International Semiconductor Corporation (VIS), ​​​​​​​​​​​Macronix, Micron, United Microelectronics Corporation (UMC), and 3M Taiwan also answered the call for more medical equipment for COVID-19 frontliners. Extending the Taiwan semiconductor industry’s rich tradition of making charitable contributions in the region, including financial assistance for emergency relief efforts, the companies donated more than 1,000 pieces of PPE after balancing the giveaway with inventory needs in their fabs. Fab workers responsible for machinery, raw materials, and other goods and gear used in semiconductor manufacturing wear the protective devices. One piece of equipment, powered air purifying respirators (PAPR), features a battery-powered that sends filtered air flowing into a hood or head top covering the wearer’s head or face to protect against respiratory hazards. In healthcare, PAPRs protect medical staff as they test blood and tissue samples for traces of COVID-19. Dr. N.S. Tsai, CEO of TSMC Charity Foundation, notes that respiratory protection equipment can offer integrated protection against multiple hazards and is comfortable for medical technologists working long shifts to wear. Medical facilities across Taiwan quickly depleted PPE supplies after the rapid response to the January outbreak by healthcare providers across the region led to quick containment. The PPE donations were critical in minimizing exposure risks to medical staff. The chip industry’s protective clothing and equipment offered another benefit: Medical technologists found the gear – designed to be worn over long periods in semiconductor manufacturing facilities – comfortable as they worked marathon shifts early in the COVID-19 outbreak. “Coronavirus testing requires a much higher level of protection than is needed in many healthcare settings,” said Chuang Jen-hsiang, the Deputy Director for the Taiwanese Centre for Disease Control (CDC) and the spokesperson of Taiwan Central Epidemic Command Center. “Medical technologists must work in a poorly ventilated labs for more than eight hours a day, causing sweating and damp heat. The high-performance PPEs provided by the industry help healthcare workers breathe more naturally without wearing a mask while greatly reducing infection risk in hot, humid environments.”For their COVID-19 response, Taiwan’s government and well-trained medical workers drew lessons from the SARS outbreak in 2003 to quickly activate emergency management structures to fend off the emerging threat – one that put the Taiwan semiconductor industry and its round-the-clock operations at risk.“Taiwan’s swift response to the COVID-19 was vital in preserving the business continuity that is the lifeblood of the semiconductor manufacturing,” said Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan. “We are honored to do our part to support the heroes of this fight – the medical technologists on the front lines – as an expression of our great respect and gratitude for their extraordinary work.”SEMI Taiwan has long partnered with TSMC Charity Foundation to care for people in need, drive positive environmental and social changes, and support emergency aid in Taiwan. The goal our joint corporate social responsibility efforts is to warm the hearts of our people and build a better society.Irene Huang is a public relations and marketing specialist at SEMI Taiwan.

SEMI estimates there exist about 80,000 surface mount technology (SMT) and printed circuit board assembly (PCBA) manufacturing lines globally. With that many lines, standards are incredibly important to adding and implementing upgrades and harnessing the power of the data going into and out of the equipment on those lines in the pursuit of efficiency and productivity. Standardized communication system backbones allow individual lines to integrate the latest equipment and software and increase their ROI.SEMI is developing a suite of standards for assembly line scenarios, like SMT and PCBA. The new SMT Equipment Link Standards (SEMI SMT-ELS) address Horizontal Communication (HC) between different equipment on the line and Vertical Communication (VC) between equipment and higher-tier hosts (for example, a line controller/equipment host or a factory automation host).Semiconductor Front-end processing vs. flow-oriented processing Flow-oriented processes such as SMT are different than typical semiconductor front-end processing, which contributed to the need for the SMT-ELS suite of standards. In the semiconductor front-end space where SECS/GEM was first utilized, the factory host is very involved with equipment control and the process is very job-centric. In addition to configuring and logging information, the host controls equipment execution and has to handle many job and recipe scenarios. For the SMT case, there is more operator interaction on the line and the factory host is currently not really involved with the control aspect and has minimal data collection requirements. In the front-end space, the Automated Material Handling System (AMHS) can take the material anywhere in the factory, including back to a tool where it had been before. For SMT, there is a very fixed flow on where material can go. The SEMI A1 interface provides a way to simultaneously transfer information about the material and material metadata being handed off to the adjacent equipment. Front-end equipment can buffer material for processing using carriers and internal storage locations. With assembly lines, the product comes in, gets processed, and leaves with minimal queuing. The equipment is also very simple. Sometimes, equipment does not even have a PC. Instead, it is controlled by dedicated real-time systems such as programmable logic controllers (PLCs). In these cases, SECS/GEM imposes too much overhead and infrastructure for the functionality required. Some other considerations: Being job-based, front-end equipment can support more execution permutations. For example: Jobs can be created before or after material arrives at the tool. There are many different carrier validation scenarios to ensure correct material is at the equipment (using either host-based or equipment-based verification). Jobs themselves can support many scenarios with pause, resume, stop, and abort functionality. With SMT lines, There can be up to 10 tracks on the line (although typically there are only one or two and they flow in one direction.) Recipes are pre-downloaded and automatically selected by material data attached to the product when it arrives at the equipment. The SMT-ELS Standards suite consists of: SEMI A1 – Specification for Production Equipment Smart Connection Interface (PESCI) This standard handles point-to-point communications and propagation of messages down the equipment line (similar to a bucket relay), as well as simultaneous material and material data transfer between two pieces of equipment next to each other. SEMI A1.1 - Specification for TCP/IP Interface for PESCI outlines how to implement SEMI A1 with TCP/IP. SEMI A2 – Specification for Surface Mount Assembler Smart Hookup (SMASH) This standard defines how to apply SEMI A1/A1.1 to an Equipment Host (provided by Placement Equipment Suppliers) and equipment communication, as well as equipment to equipment communication.The F-GEM Task Force (under the Japan Automation Technology Technical Committee) is developing a new Standard to support vertical communications using SEMI A1 (and co-existing with SEMI A2) to support a higher-tier host such as the factory automation host that wants to communicate with the line equipment. In the future, this standard could be expanded to support other flow-oriented industries beyond SMT (using only SEMI A1).Systems and vendors need to work from the same version of the standards to communicate with each other properly. To help ensure compatibility, SEMI is applying Freeze version management to the SMT-ELS Standards suite. Freeze Version 0, announced in October 2019 and specifying the 1019 versions of the SMT-ELS standards, was implemented, and the Automation Technology Technical Committee members are working on updates and prototyping for Freeze Version 1.For more information about the SMT-ELS standards, visit the SEMI SMT-ELS website or explore the broader SEMI Standards program. SEMI Standards activities are open to all interested parties, but you must be a registered SEMI Standards Program Member to participate in SEMI Standards meetings. SEMI Standards Program Membership is independent of the Corporate, Associate or Affiliate SEMI memberships, but participants are encouraged to join to help support this vital work for the continued growth of the industry.About the AuthorsTerry Asakawa (Principal, VistaIdeal Consulting) has been involved in developing SEMI Standards for over 25 years, focusing on equipment physical interfaces and communication for semiconductor factories. In recent years, he has turned his focus to communication protocol standards for flow-shop manufacturing. Mr. Asakawa currently co-chairs the Japan Automation Technology Committee and leads the F-GEM Task Force.Albert Fuchigami is Senior Software Developer, at The PEER Group Inc. He is involved in the SEMI Standards development of SMT-ELS so that the effort takes into consideration the differences between front end processing and flow-based assembly lines in collecting data and communicating with factory host systems. He hopes to identify the different use cases and control scenarios, and help users understand the differences, so they know when SECS/GEM and SMT-ELS standards are appropriate.