Tokyo
Japan
Tokyo
Japan
No Registration Fee Required.
Thermal Interface Materials (TIMs) come in a wide variety of options and are used in a range of applications. Thermal greases, phase-change materials, and silicon pads are just a few examples of TIMs that are used in today’s devices. Each has its own benefits and downsides, but they are all limited in their effectiveness in performing the one essential function of a TIM, conducting heat in an efficient manner. Zeon’s new technology combines the physical characteristics of an elastomer pad with the thermal benefits of a carbon filler to achieve a thermal conductivity of 38 W/mK, a value that is unmatched in the industry.
Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.
This webinar will focus on the performance and technology of such a material while also discussing how it can best benefit the MEMs and Sensors community by creating solutions to thermal problems plaguing the packaging space.
Nikhil Jani is a Business Development Specialist representing Zeon Specialty Materials, a San Jose based company and subsidiary of the Zeon corporation a company you may be familiar with for its widely used Electron Beam Resist ZEP520A. He studied Material Science and Engineering at Rutgers University with a focus on semiconductors and polymers. He has co-authored a paper on polymer nanocomposites titled “Non-Destructive Investigation of Dispersion, Bonding, and Thermal Properties of Emerging Polymer Nanocomposites Using Close-Up Lens Assisted Infrared Thermography”. Prior to joining Zeon, he had worked at Morgan Advanced Materials.
Online, Virtual
United States
Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.
Join us for the 3rd in our Innovative Sensors Webinar Series to explore how Zeon has solved this perennial issue for electronics.
Registration is underwritten by SEMI MSIG
Tom Kornack, Chief Scientist, Twinleaf LLC
Abstract: Quantum sensing often uses atomic systems in vapor phase. This talk will briefly review Twinleaf’s wafer-scale atomic vapor cell fabrication capabilities and some of the applications that have been addressed.
Speaker Bio: Dr. Kornack is an expert in the design, fabrication and operation of atomic magnetometers. At Twinleaf, he has commercialized a wide variety of high performance magnetic field sensors. As a graduate student and a postdoctoral research assistant working with the magnetometer research group at Princeton University, he developed the first laser zero-field SERF magnetometer. He has also developed co-magnetometers for use as a sensitive gyroscope and as a probe into fundamental laws of physics.
Dr. Dirk Lewke, Team Leader Technology Innovation Management
Abstract: This presentation provides a deep inside into a laser-based annealing technology for GMR/TMR sensors, which enables the programming of advanced sensor structures at wafer level. The key feature is the combination of reaching the Curie-Temperature by applying a selective laser spot and an in-situ rotatable magnetic field while wafer travelling at high speed. Unique single sensor field programming enables high quality sensor read-out repeatability.
Speaker Bio: Dr. Dirk Lewke studied mechatronic engineering at the University of Erlangen-Nuremberg. He received his doctorate in 2017. From 2011 to 2017 he worked at Fraunhofer IISB in the field of semiconductor manufacturing equipment as a scientist. Since 2017, Dr. Lewke has been working working at 3D-Micromac as a team leader for process development and technology manager for laser production equipment for semiconductor and photovoltaic industry.
Online, Virtual
United States
We continue our Advanced Sensor webinar series with dual webinar presentations from technical leads at Twinleaf and 3D-Micromac, covering advanced magnetic sensor design and fabrication.
These amazing devices play a critical role in measuring what we cannot see by their ultra-sensitivity to magnetic currents. Thinking about adding a magnetic sensor to extend the functionality of your device? Then this is the webinar series for you.
Join these technology experts to see how magnetic sensors work, are built and how to utilize them in your products or research.
Member Price: $49
Non-Member Price: $99
Registration is final. No refunds provided. No substitutions.
Lin Tso
Email: [email protected]
Phone: +1.408.943.7920
Become a Sponsor
Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Silicon Valley & Northeast Virtual Forum.
Contact Lin Tso, [email protected] or Paul Cohen, [email protected] to learn about available sponsorship opportunities.
Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers.
Join us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain in the near and long term, including regional and global economies, and the CHIPS Act.
Speakers will discuss strategies for mitigating the impact and how to capture value.
Topics include:
Market Trends & Forecast & Outlook
Accessing Chips Act Funding and Roll out of Incentives
Geopolitical Impact
Advanced Packaging & Chiplets
Emerging and Expanding Markets
This Virtual Forum is 8:30–11:00am Pacific Time, 11:30am–2:00pm Eastern Time
United States
The SEMI Silicon Valley and Northeast Chapters Present:
Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession
This year’s theme for the International Trade Partners Conference—ITPC—will guide an exploration of geopolitics, contentious trade and national security concerns, and our deep-rooted ambitions to maintain the global footprints we have created. Our manufacturing infrastructures, trade connections, and supply chains are now part of the geopolitical state – something few could have anticipated. We are finally witnessing governments, the media, and the general public taking notice of semiconductors and their critical importance.
Meet your branding and marketing objectives with a customized sponsorship package. Become a sponsor and brand your company to an influential audience of executives at ESDA/CEDA Phil Kaufman Awards.
Contact Tim Janes, [email protected], +1.720.939.4992 to learn more.
Sponsorship opportunities are available! (View the brochure.)
For information, contact Tim Janes, [email protected].
Hayes Mansion
200 Edenvale Avenue
San Jose, CA 95136
United States
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers.
Registration covers all 3 days of Workshops. No discounts given for partial attendance. Full refunds through December 17, 2022. December 18-January 19 - substitutions only.
SEMI, FlexTech, NBMC & NextFlex Members: $199
Non-Members: $499
If you have any questions, please contact Gity Samadi, [email protected].
SEMI has secured a Group Rate at the Staybridge Suites at 321 Cypress Drive, Milpitas, CA, at the special rate of $202/night with breakfast included.
To reserve the rate visit Staybridge Suite website and follow these steps:
Step 1 – Enter your dates
Step 2 – Choose Rate Preference, then group rate, type in SJ1
Alternatively, you may email the General Manager at [email protected]
Your health and safety are our top priority. We monitor developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events. For international attendees arriving from outside of the United States, please review the government travel guidance to confirm eligibility and requirements for travel.
FACE COVERINGS
Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.
SEMI FlexTech FHE Technical Gap Analysis Workshop - Tues. 1/17 - 8 am-12 noon
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.
SEMI NBMC Technical Gap Analysis Workshop - Tues. 1/17 - 1:00-5:00 pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. A networking reception will follow the workshop.
SEMI FlexTech - FHE Standards Workshop - Wed 1/18 - 8:00am - 1:00pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
Many topics and paths were identified at the previous, very successful workshop in July 2022. This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components. This workshop includes a continental breakfast and lunch.
NextFlex - Hybrid Electronics for Advanced Packaging Workshop - Wed 1/18 2:00 - 7:00 pm & Thurs 1/19 - 8:00 am - 5:00 pm
@NextFlex, 2244 Blach Place, Suite 150, San Jose, CA
As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex is hosting a workshop to align the ecosystem’s vision on how additive hybrid electronics manufacturing can shape the future of domestic advanced semiconductor packaging. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.
Breakout topics include:
SEMI & NEXTFLEX
Milpitas & San Jose, CA
United States
For a detailed program agenda for this workshop visit NextFlex.us
Join us for three-days of technology assessments, updates, discovery and planning workshops focused on the development of the electronics ecosystem and flexible, hybrid electronics, medical monitoring sensors, and their application to driving development in new electronics packaging approaches.
Industry experts and leaders will come together to focus on identifying gaps in technology development, including in design, manufacturing, standards and environmental sustainability.
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Harvey Kauget practices in the firm's Corporate Practice Group with a focus on intellectual property litigation and prosecution.
Harvey serves a wide-range of clients in the areas of patent, trademark and trade secret litigation, patent and trademark prosecution, IP risk management, portfolio licensing, and client counseling.
Harvey’s litigation and patent prosecution background consists of dealing with matters related to technologies such as: semiconductor processing, plasma dicing, welding systems, lighting and LEDs, hot plates, software, computer integration and networking, satellites, solar power, hydrogen fuel cells, biodiesel, gaming, jewelry, gift cards, cups, davit lift, suntan lotions, power tools, paint rollers, flow systems, nuclear control rods, shirt pressers, air filters, hot water systems, fans, contact lenses, blood plasma expander, disposable blood measuring device, urine analysis, teeth whitening, suture anchors, and medical devices. In addition, he also has experience in a wide-range of other areas including firearms, speakers, waste fuel flare stacks, furniture, exercise equipment, recycling equipment, cement materials, fence posts, and tidal gates.
Mr. Kauget has experience presenting cases before the Court of Appeals for the Federal Circuit and Eleventh Circuit. He is also a registered patent attorney admitted to practice before the U.S. Patent and Trademark office. Before Harvey began his legal career, he worked as an engineer and as a product manager in the semiconductor industry as well as a certified high school chemistry and physics teacher.
Honors & Recognitions
United States
CAST EMG ESD Alliance FlexTech MSIG SOIReceive practical information on designing, writing and protecting your patents from an experienced and knowledgeable source. This course will review the latest thinking in what is a patentable invention and how to protect your invention. You will learn the basics of disclosing your invention for maximizing your protection, with an opportunity for Q&A at the end. A course useful to inventors at every stage of your careers and every stop in our industry ecosystem.
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that combines the best of conventional and printed circuitry. By enabling flexibility and digital manufacturing without compromising on processing capability, it promises to remove the constraints of rigid PCBs while reducing costs and hence enable new applications.
This webinar from Dr Matthew Dyson of IDTechEx provided the status of FHE, including examples that are already commercialized.
Standards and other attributes required for mass manufacturing was outlined, and the scope for FHE to be used for novel applications (including harsh environments) assessed. Finally, a roadmap covering the near, medium, and long term was presented, including how FHE development fits with the ongoing development of heterogeneous integration.
ABOUT THE SPEAKER
Matthew is a Senior Technology Analyst at IDTechEx, specializing in printed/organic/flexible/hybrid electronics and sensors. He has an MRes and PhD in Physics from Imperial College London, which aimed to better establish processing/structure/property relationships in organic semiconductors. This was followed by two years post-doctoral researcher at Eindhoven Technical University in the Netherlands, focusing primarily on organic photodetectors (OPDs). His academic research, which has been cited over 500 times, also included work on perovskite photovoltaics and aggregation induced emission materials.
At IDTechEx, Matthew analyses technical innovations and applications across the printed/flexible/hybrid landscape, attending multiple conferences and interviewing companies to establish a clear picture of the technical and commercial landscape. This analysis is published in reports on topics such as 3D electronics and printed/flexible sensors, and applied to consulting projects evaluating commercialization opportunities across printed/flexible electronics. He also manages a team of analysts covering wearable technologies, AR/VR, and emerging photovoltaics.
United States
This webinar featured Dr. Matthew Dyson of IDTechEx outlining the status of FHE, including examples that are already commercialized. Standards and other attributes required for mass manufacturing were discussed, and the scope for FHE to be used for novel applications (including harsh environments) assessed. In addition, he presented a roadmap covering the near, medium, and long term will be presented, including how FHE development fits with the ongoing development of heterogeneous integration.
