In Person

Bobby Brennan

Program Director

GlobalFoundries

Panelists

Michael Colello

Director, Semiconductor Workforce Innovation

UAlbany

Michael Guttman

Strategic Program Manager

Micron Technology

Ethan Arnault

Assistant Professor

Institute for Quantum & Information Sciences

Mandy D'Andrea

Coordinator for Workforce Development & Post-Secondary Pathways

BOCES

Chloe Perazzelli

Work Based Learning Coordinator

BOCES

4:55 pm

Closing Remarks

5:00 pm - 6:00 pm

Networking Hour with Panelists

Sep 15, 2026

The SEMI Northeast Chapter Presents—

Fabricating the Future: Emerging Technologies and the Workforce of Tomorrow

SEMI Northeast Fall Forum 2026

SEMI Northeast Fall Forum
September 15, 2026

11:30 am - 6:00 pm Off Add to Calendar 2026-09-15 11:30:00 2026-09-15 18:00:00 SEMI Northeast Fall Forum 2026 The SEMI Northeast Chapter Presents—Fabricating the Future: Emerging Technologies and the Workforce of Tomorrow Albany NanoTech Complex 257 Fuller Rd Albany, NY 12203 United States SEMI.org [email protected] America/New_York public Sep 11, 2026 America/New_York Register Now

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Future of Computing

SEMI Member: $175
Non-Members: $225

This Event is SOLD OUT

Cancellations received on or before October 4, 2024 will be fully refunded. After this date, only substitutions will be accepted.

Please email your cancellation request to Agnes Cobar at [email protected]. Refunds will not be issued for cancellations (including no-shows) made after October 2. Substitutes are only accepted with written permission from the original registrant.

For questions, please contact Pushkar Apte at [email protected]

United States 800x800_Futrue_Computing Business Executive Technical

As AI proliferates rapidly, AI models and datasets are also growing rapidly in size, giving rise to two fundamental challenges. First, this growth far outpaces performance improvement in hardware systems and infrastructure, and second, the energy consumption for AI continues to grow unsustainably.

These challenges are formidable and cannot be solved by one entity or in isolated silos. SEMI (semi.huihuidehui.workers.dev), a global electronics industry association with 3300 member companies, is organizing this workshop under its Smart Data-AI Initiative. We are bringing together experts to discuss the latest innovations in the entire-AI ecosystem – including novel devices, 2D materials, analog computing, advanced packaging, chiplets, photonics, hardware-software co-optimzation and energy-efficient architectures & algorithms for data centers, cloud & edge.

Please join us on March 19th in Milpitas, CA. We will start with an inspiring keynote from Tristan Holtam, GVP, CEO Chief of Staff, Corporate Strategy and Development, Applied Materials, and continue through the day with industry leaders (AMD, Arm, ASE, Google DeepMind, IBM, Intel, Lam Research, Mckinsey, Micron, Nvidia, Qualcomm, SK Hynix); exciting start-ups (Cerebras, LightMatter, Mentium) and leading-edge academic researchers (Stanford U. and U. of California). Together, let us explore collaborative, system-level solutions for sustainable progress in AI systems.

SEMI
673 S. Milpitas Blvd
Milpitas, CA 95035
United States

8:00 am - 8:30 am

Registration, Coffee/Tea + Pastries

8:30 am - 8:35 am

Welcome

Pushkar Apte, Smart Data-AI Lead and Strategic Technology Advisor, SEMI

8:35 am - 8:45 am

SEMI Perspective

Ajit Manocha, CEO, SEMI

8:45 am - 9:30 am

Accelerating Energy-Efficient Computing

Tristan Holtam, GVP, CEO Chief of Staff, Corporate Strategy and Development, Applied Materials

9:30 am - 10:00 am

Future of Computing Landscape- Opportunities and Challenges

Jim Sexton, Fellow, IBM

10:00 am - 10:15 am

Coffee Break

10:15 am - 11:30 am

Chair/Moderator: Gity Samadi, Senior Director of R&D Programs, SEMI

David Fried, Corporate VP, Lam Research

Eric Pop, Pease-Ye Professor of Electrical Engg., Stanford University

Geoffrey Burr, Distinguished Research Scientist, IBM Research

Saif Islam, Professor, Dept. of Electrical & Computer Engg., U. of California, Davis

Ashonita Chavan, Distinguished Member of Technical Staff, Micron

11:30 am - 11:40 am

SEMI Technology Communities

Melissa Grupen-Shemansky, VP & CTO, SEMI

11:40 am - 12:55 pm

Chair/Moderator: Melissa Grupen-Shemansky, SEMI

Steve Klinger, LightMatter, VP of Product

Jaesik Lee, VP of Package Engineering, SK Hynix

Debendra Das Sharma, Senior Fellow, Intel and Chair of UCIe & CXL Consortium

Boris Vaisband, Asst. Professor, UC Irvine

12:55 pm - 2:00 pm

Lunch

2:00 pm - 2:10 pm

Market Overview for AI

Wendy Zhu, McKinsey & Co.

2:10 pm - 2:20 pm

SEMI Smart Data-AI Initiative Overview

Pushkar Apte

2:20 pm - 3:35 pm

Chair/Moderator: Jim Sexton, IBM

Evgeni Gousev, Senior Director, Qualcomm; and Chair, Board of Directors, TinyML Foundation

Mirko Prezioso, CEO, Mentium

Wilfred Gomes, CEO, Mueon

Chloe Jian Ma, Vice President, Arm

3:35 pm - 3:45 pm

Coffee Break

3:45 pm - 5:00 pm

Chair/Moderator: Pushkar Apte, SEMI

JP Fricker, Founder and Chief System Architect, Cerebras

Cliff Young, Software Engineer, Google DeepMind

Nuwan Jayasena, AMD Fellow

John Hu, Director of Advanced Technology, Nvidia

5:00 pm - 5:05 pm

Wrap up and Next Steps, Pushkar Apte

5:05 pm - 6:45 pm

Networking and Reception

Mar 19, 2025 Smart MFG Smart Data & AI MSIG

THIS EVENT IS SOLD OUT

Future of Computing

Sustainable AI Systems
[In-Person Event]

8:00 am - 6:45 pm Off Add to Calendar Disabled May 11, 2026 America/Los_Angeles

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Advanced Packaging Summit 2023

REGISTRATION

Early-bird Registration Close: 5 pm, Tuesday, August 29(KST)

Registration Fee

Pre-Registration (Until August 29)

Price	SEMI Members	Non Members
1 Session	KRW 120,000	KRW 150,000
2 Sessions	KRW 200,000	KRW 240,000

On Site

Price	SEMI Members	Non Members
1 Session	KRW 150,000	KRW 180,000
2 Sessions	KRW 240,000	KRW 290,000

South Korea Register Now APS_Banner_2023.06.14_squre2.jpg Business Technical

OVERVIEW

Date: September 5(Tue), 2023
Time: 09:00 – 17:30
Venue: Hall 3, Suwon Convention Center
Language: Korean / English (Simultaneous interpretation will be provided)
Organizer: SEMI

NOTICE

The agenda will be subject to change without notice.
Presentation files agreed by speakers will be provided to attendees.

CONTACT

SEMI Korea Program Team ([email protected])

Suwon Convention Center
South Korea

Session 1: High-Performance Computing

9:00 am - 9:30 am

Xin Wu

Corporate Vice President, Silicon Technology

AMD

Hetero Integration, High Performance Computing and AI

Xin Wu received PhD and MSc from University of California Berkeley USA and Peking University, China, respectively. Since 1993, he has worked in Xilinx (acquired by AMD in 2022) from 0.6um till 2nm generations of technologies and products, from many foundries and suppliers. His responsibilities include silicon, hetero-integration, advanced packaging, thermal mechanical solutions and many other technologies development.

9:30 am - 10:00 am

Ki Ill Moon

VP, Head of PKG Tech. Development

SK hynix

PKG Interconnection Technology for HBM

Mr. Moon is currently working as a technical leader (VP) for package technology development, in SK hynix. He has more than 25 years’ experience in semiconductor package development including wafer level, flip chip and 2.5D/ 3D packaging as well as conventional package.

He previously served as package development project manager for package material, process and equipment until assuming his current role in 2022. And he has been involved in the development and mass production of NAND Flash, DRAM/ Mobile, MCP, RDL, Flip chip, WLCSP and TSV.

He received degree in chemistry from Sogang University in Seoul, Korea.

10:00 am - 10:30 am

Donghan Kim

Sr Staff / Head of SCSD

Synopsys

The next wave of Semiconductor Innovation – Multi-die system solution

Donghan Kim is a leader of Strategy Collaboration Solution Development at Synopsys Korea. He is responsible for leading 2.5D and 3D multi-die system solution business aiming to offer a complete end-to-end solution for efficient multi-die system integration.
He has more than 20 years of experience in semiconductor industry and has worked extensively on SOC mobile chip designs such as Exynos series at Samsung Electronics. He had a strong track record of successfully developing modem, WiFi and Bluetooth chipset products.
He received MS degree in electronic engineering from Sogang university in Seoul Korea where he did research topics on wireless communications and Semiconductor.

10:30 am - 11:00 am

Stefan Chitoraga

Technology and Market Analyst, Packaging and Assembly

Yole Group

Status of High-End Performance Packaging (2.5D & 3D) - Technology and Market Trends

Stefan Chitoraga is a Technology and Market Analyst specializing in Packaging and Assembly at Yole Intelligence, part of Yole Group. Within the Semiconductor, Memory & Computing division at Yole, Stefan is focused on advanced packaging platforms and processes, substrates, and PCBs. He is involved daily in the production of technology & market reports and custom consulting projects.

Prior to Yole, Stefan served as a Package Design Engineer at Teledyne E2V for 4 years, where he was in charge of the ceramic package and glass lid development for image sensors, developing mechanical design, routing, electrical and thermal simulations.

Stefan holds a Bachelor’s in Electronics and Computer Science for Industry Applications from the Polytech Grenoble (France).

11:00 am - 11:20 am

Break

11:20 am - 12:30 pm

Panel Discussion

Session 2: Interconnection Technology for HPC

2:00 pm - 2:30 pm

Jongsoo Choi

Principal Professional

Samsung Electronics

Advanced Heterogeneous Integration

Jongsoo Choi, Ph.D. was appointed as head of marketing strategy part at Business Development Team of AVP Business, Samsung Electronics in December 2022, after completing Advanced PKG Task Force for six months. Before his new role, Dr. Choi was responsible for SoC product marketing as a director at System LSI Business from 2014.

Prior to joining the System LSI, Dr. Choi was Principal Engineer, and has led 4G mobile communication standards project at DMC R&D Center (now Samsung Research) since he joined Samsung Electronics in 2005, where he contributed to the 3rd Generation Partnership Project (3GPP) specifications which cover cellular telecommunications technologies, and also served as a vice chairman of 3GPP TSG GERAN from 2007 to 2011.

Dr. Choi received a Ph.D. degree in Electrical Engineering from the University of Ottawa, Ontario, Canada, where he focused research topics on wireless communications and adaptive signal processing.

2:30 pm - 3:00 pm

Vikas Dubey

Senior Scientist Systems Packaging

Fraunhofer ENAS

Interconnect via scaling and challenges with hybrid bonding

Dr. Vikas Dubey, is a senior scientist at Fraunhofer ENAS since 2021 with system packaging department. He is into advanced system packaging for more than 10 years. He is currently leading the research activities related to hybrid bonding, collective die to wafer bonding and several other wafer bonding technologies for MEMS/NEMS integration. Besides, in his current role he is directly responsible for project acquisition, managing public and industrial projects and related to advance system integration, hybrid wafer bonding and assembly.
Prior to joining Fraunhofer ENAS he worked as a technology manager at national nanofabrication center (NNFC) at Indian Institute of Sciences, Bangalore. During his time at APTIV services located in hungary, he was responsible for several six sigma projects which lead to million of euros in earnings.
Dr. Dubey received his PhD degree from materials engineering department from KU Leuven, where he worked at imec with his research focused on self-aligned assembly for fine pitch integration.

3:00 pm - 3:30 pm

7_Biography-Advanced Packaging Summit.jpg

Dongshun Bai

Senior Technologist & Business Development Director

Brewer Science

Novel Materials for Advanced Packaging

Dongshun Bai, Ph.D. has been with Brewer Science, Inc. since 2007. Dongshun works as the Senior Technologist & Business Development Director in the Packaging Solutions Business Unit, in charge of technology roadmap direction of new material development for advanced packaging. He also leads the Business Development team and oversees the global business activities for advanced packaging materials.

Dongshun spent his first 10 years at Brewer Science in its Advanced Technologies R&D group. Working as Senior Program Manager and Senior Scientist, he led an R&D team focused on material design and development for advanced packaging. Many materials developed by his team went to commercialization and became the major products in the portfolio.

Dongshun earned a Ph.D. degree in Chemical Engineering from Vanderbilt University, Nashville, TN, USA and a Master of Engineering degree in Chemical Engineering from the National University of Singapore. Dongshun has published numerous papers and patents and delivered many talks, including invited talks at international conferences. He currently serves as a technical committee member for IMAPS and EPTC.

3:30 pm - 4:00 pm

SeokHo Na

Master, Sr. Director, R&D

Amkor Technology Korea

Laser Assisted Bond (LAB) Technology Overview

SeokHo Na joined Amkor Technology Korea in 1996 and worked for R&D engineer until now with responsibility of semiconductor material & process development. Major work is chip to substrate interconnection technology development such as wire bonding, Material Characterization, Flip Chip package CIP (chip to package interaction) and LAB (Laser Assisted Bonding) technology.

Prior to joining Amkor Technology Korea, Na received a bachelor’s degree and master’s’ degree in Material Science & Technology from Yeungnam University, Korea

4:00 pm - 4:20 pm

Break

4:20 pm - 5:30 pm

Panel Discussion

Sep 5, 2023 APHI

The Advanced Packaging Summit is a conference dedicated to exploring the latest advancements in packaging technology for high-performance computing (HPC) and interconnection. The summit brings together leading experts, researchers, and industry professionals to share their insights and experiences on advanced packaging solutions that enable high-density, high-bandwidth, and low-latency interconnects for HPC systems. Topics covered at the summit include 3D packaging, hybrid bonding, LAB(Laser Assisted Bonding), heterogeneous integration, supply chain management, and more. Attendees will gain valuable insights and have the opportunity to network with experts in the industry.

Advanced Packaging Summit 2023

September 5(Tue), 2023 | Hall 3, Suwon Convention Center

9:00 am - 5:30 pm Off Add to Calendar 2023-09-05 09:00:00 2023-09-05 17:30:00 Advanced Packaging Summit 2023 The Advanced Packaging Summit is a conference dedicated to exploring the latest advancements in packaging technology for high-performance computing (HPC) and interconnection. The summit brings together leading experts, researchers, and industry professionals to share their insights and experiences on advanced packaging solutions that enable high-density, high-bandwidth, and low-latency interconnects for HPC systems. Topics covered at the summit include 3D packaging, hybrid bonding, LAB(Laser Assisted Bonding), heterogeneous integration, supply chain management, and more. Attendees will gain valuable insights and have the opportunity to network with experts in the industry. Suwon Convention Center South Korea SEMI.org [email protected] Asia/Seoul public May 27, 2025 Asia/Seoul DISCOVER APS 2025

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FOA General Meeting and Networking Lunch

SEMICON West Technical

Highlighted content

Due to the shortened timeframe between SEMICON West 2026 and SEMICON West 2027, the FOA meeting in San Francisco will follow a one-time revised format this year.

As part of this one-time format, we will NOT be holding the following at this year's SEMICON:

Device Maker Morning Meeting
Speed Networking Session

Action Required for Solution Providers:
We are currently seeking case studies to include in the program. If your company is interested in presenting a case study, please share a short abstract with the SEMI FOA team (Deadline to submit abstract Sept 30th)

FOA Registration Only - Click HERE (you must register for SEMICON West, separately using the link below).

SEMICON Registration - Please use the registration link here to sign up for West if you have not done so already.

Please note: This format change applies only to SEMICON West 2026. We plan to return to our traditional Device Maker Morning Meeting and Speed Networking format at SEMICON West 2027.

We appreciate your flexibility and look forward to seeing you in San Francisco.

If you have any questions, please reach out to Karim Somani - [email protected]

Moscone Center
San Francisco, CA
United States

General Meeting - Thursday, October 15th - Moscone South Upper Mezzanine Level - Room #158

8:00 am - 8:25 am

Gathering

8:25 am - 8:30 am

Welcome Remarks

8:30 am - 9:00 am

Surya Iyer

President, Board Member

Polar Semiconductor

9:00 am - 9:30 am

Seeq & Intel

Detecting PID Loop Degradation Early: Scalable PID Control Loop Monitoring for Semiconductor Facilities with Seeq Agentic AI

9:30 am - 10:00 am

camLine & onsemi

Implementing a Single Source for Recipe Selection and Management for Greater Quality & Efficiency at Onsemi Nampa, ID

10:00 am - 10:15 am

Break

10:15 am - 10:45 am

Flexciton & Diode

From Static Capacity Moder to Dynamic Capacity Planning: Depolyment Case Study at Diodes

10:45 am - 11:15 am

AI Technicians Readiness Survey (SEMI & NextFlex)

11:15 am - 11:45 am

Geno Fallico

Vice President of Chandler Fab Operations

NXP Semiconductors

NXP Semiconductor

11:45 am - 12:00 pm

Lunch Sponsor Speaking Moment - Seeq

12:00 pm - 1:30 pm

Networking Lunch

For all FOA members (Device Makers and Solution Providers)

Oct 15, 2026 FOA

This is an FOA Members Only Event - For questions on membership or anything FOA-related contact us at [email protected]

General Meeting and Networking Lunch

8:00 am - 1:30 pm Off Add to Calendar 2026-10-15 08:00:00 2026-10-15 13:30:00 FOA General Meeting and Networking Lunch This is an FOA Members Only Event - For questions on membership or anything FOA-related contact us at [email protected] General Meeting and Networking Lunch Moscone Center San Francisco, CA United States SEMI.org [email protected] America/Los_Angeles public Oct 2, 2026 America/Los_Angeles

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SEMI Oregon Golf Classic

REGISTRATION PRICING

Member: $250
Non-Member: $275

CANCELLATION POLICY:
Cancellations received on or before August 15, 2026 will be fully refunded. After this date, only substitutions will be accepted.

Krish Raghunath
Program Manager, Programs & Committees, SEMI
[email protected]

United States Stone Creek Golf Club Business

Become a Sponsor

Sponsorship is an excellent way to promote your brand, especially on the golf course where many business transactions take place.
Sponsorships are tailored to meet your branding and marketing objectives.

To learn more please contact Tim Janes ([email protected] | 1.720.939.4992).

MULLIGANS + RAFFLE TICKETS

PURCHASE A TICKET—SUPPORT THE SEMI PACIFIC NORTHWEST STEM SCHOLARSHIP

The scholarship will be awarded to a deserving university and/or college in the region. Mulligans and Raffle Tickets are sold onsite, $5 per ticket.

Proceeds from the sales directly fund the scholarship. Players and non-players are welcome to participate.

To donate a raffle prize please contact—Krish Raghunath, Program Manager, SEMI Americas at [email protected]

REGISTRATION INCLUDES

Golf Cart
Grab & Go Breakfast
Contests and Prizes
Beverage Ticket
Award Ceremony and Lunch

PLAYER AWARDS

Closest to Pin
Longest Drive
Putting Contest
Best Foursome
Needs Most Improvement

DRESS CODE

Stone Creek Golf Club requires generally accepted dress for golf tournaments. Shirts and shoes must always be worn. Stone Creek Golf Club is a soft-spike only facility. Following is a list of unacceptable clothing:

Tank tops
Cut-offs
Swimwear
Gym shorts

Stone Creek Golf Club
14603 South Stoneridge Drive
Oregon City, OR 97045
United States

Tuesday, September 15, 2026 | 7:00am–3:00pm Pacific Time

7:00 am - 8:00 am

Registration | Breakfast | Networking

8:00 am - 1:00 pm

Shotgun Start

1:00 pm - 3:00 pm

Award Ceremony | Lunch | Networking

Sep 15, 2026

4th Annual SEMI Oregon Golf Classic

Join us for a morning of golf, fun, and networking at the beautiful Stone Creek Golf Club in Oregon City, Oregon. Whether you're a beginner or a pro—enjoy friendly competition and camaraderie with your colleagues and customers.

The Stone Creek Golf Club is a a Peter Jacobsen/Jim Hardy designed golf course. Presenting spectacular views of Mt Hood, the course perfectly depicts the Pacific Northwest. Stone Creek is laid over 165 acres of land with old growth Douglas Firs, Lakes, and features some of the best greens in Oregon (OR).

Visit Stone Creek Golf Club for additional course details.

SEMI Oregon Golf Classic

September 15, 2026
7:00am–3:00pm | Pacific Time

7:00 am - 3:00 pm Off Add to Calendar 2026-09-15 07:00:00 2026-09-15 15:00:00 SEMI Oregon Golf Classic 4th Annual SEMI Oregon Golf ClassicJoin us for a morning of golf, fun, and networking at the beautiful Stone Creek Golf Club in Oregon City, Oregon. Whether you're a beginner or a pro—enjoy friendly competition and camaraderie with your colleagues and customers. The Stone Creek Golf Club is a a Peter Jacobsen/Jim Hardy designed golf course. Presenting spectacular views of Mt Hood, the course perfectly depicts the Pacific Northwest. Stone Creek is laid over 165 acres of land with old growth Douglas Firs, Lakes, and features some of the best greens in Oregon (OR).Visit Stone Creek Golf Club for additional course details. Stone Creek Golf Club 14603 South Stoneridge Drive Oregon City, OR 97045 United States SEMI.org [email protected] America/Los_Angeles public Sep 9, 2026 America/Los_Angeles REGISTER NOW

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SEMI Texas Spring Breakfast Forum

Registration

PRICING
Regular Pricing:
Member: $100 | Non-member: $125

Cancellation Policy
Registration is final. No refunds provided. No substitutions.

United States REGISTER NOW SEMI TX Spring Breakfast Chapter Tile Business Technical

Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Texas Chapter Spring Breakfast Forum.

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.

Program Questions

Contact Eric Rude, [email protected]

HOST—

Texas at Scale: From Fab to Cloud, AI, Power, and the Future of the Semiconductor Ecosystem

The SEMI Texas Spring Forum brings together industry executives, technologists, policymakers, academic leaders, and downstream enterprises — from GPU/accelerator companies to cloud, automotive, industrial, and system OEMs. Together, we will explore how Texas can harness AI, digitalization, and cross-ecosystem collaboration to lead in next-generation chip production and full-stack system integration.

A central focus will be aligning materials and equipment suppliers, foundries, OSATs, and EDA providers, and advanced packaging organizations with the roadmaps of AI and HPC leaders, ensuring silicon, systems, and software evolve cohesively and efficiently.

Applied Materials
9700 US HWY 290 East, Building 32
Austin, TX 78724
United States

8:00 am - 8:30 am

Registration, Networking Breakfast, & Sponsors Showcase

8:30 am - 8:35 am

Andrea Valencia

Marketing Communications & Events, Semiconductor Materials

EMD Electronics

Welcome Remarks

8:35 am - 8:45 am

Joe Stockunas

President

SEMI Americas

State of the Semiconductor Industry

8:45 am - 9:05 am

Steve Gustafson

VP of Worldwide Manufacturing

Applied Materials

Keynote

9:05 am - 9:25 am

Stephen Davis, PhD

Director

Texas CHIPS Office

Texas Semiconductor Ecosystem

9:25 am - 9:45 am

Da Yang, PhD

Senior Director of Product, Semiconductor and EDA

NVIDIA

AI‑Accelerated Design: Transforming EDA Workflows with Accelerated Computing and AI Agents

9:45 am - 10:05 am

Chuck Alpert, PhD

AI Fellow

Cadence

Design for AI and AI for Design

10:05 am - 10:35 am

Networking Break & Sponsors Showcase

10:35 am - 10:40 am

Mike Glavin

Program Director, Workforce Development

SEMI Foundation

Workforce Development Update

10:40 am - 11:00 am

Hetul Sanghvi

Director of Embedded AI @ Kilby Labs

Texas Instruments Inc.

Intelligence at the Edge: Smaller, Faster, Smarter

11:00 am - 11:20 am

Brett Wilkerson

Fellow

AMD

Advanced Packaging in the AI Era

11:20 am - 11:40 am

Joseph Rivers PhD

Senior Director, Product Management

Entegris

Everything's Purer in Texas: How Entegris Is Building the Semiconductor Supply Chain Where It Matters

Steve Putna, Ph.D.'s Biography

11:40 am - 12:25 pm

Moderator

Steve Putna, PhD

Associate Vice Chancellor for Research; Director

Texas A&M Semiconductor Institute

Panel Discussion and Q&A—Texas at Scale: From Fab to Cloud, AI, Power, and the Future of the Semiconductor Ecosystem

Hear from leaders across the ecosystem, including Applied Materials, AMD, Cadence, Entegris NVIDIA, Texas Instrument, and Texas Chip Office.

12:25 pm - 12:30 pm

Adrian Franco

Senior Client Consultant, Semiconductor

Olsson

Closing Remarks

12:30 pm

Adjourn

May 14, 2026

SEMI Spring Breakfast Forum

Organized by the SEMI Texas Chapter

Texas Spring Breakfast Forum

In-Person | May 14, 2026
8AM–12:30PM CT

8:00 am - 12:30 pm Off Add to Calendar 2026-05-14 08:00:00 2026-05-14 12:30:00 SEMI Texas Spring Breakfast Forum SEMI Spring Breakfast ForumOrganized by the SEMI Texas Chapter Applied Materials 9700 US HWY 290 East, Building 32 Austin, TX 78724 United States SEMI.org [email protected] America/Chicago public May 12, 2026 America/Chicago 2

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Let your LinkedIn connections know you’re attending the SEMI Texas Spring Breakfast Forum!

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Phil Kaufman Award & Banquet

United States P.Kaufman Thumbnail_690x448 Business Executive

Diamond

Gold

Become a Sponsor

Meet your branding and marketing objectives with a customized sponsorship package. Become a sponsor and brand your company to an influential audience of executives at ESDA/CEDA Phil Kaufman Awards.

Contact Tim Janes, [email protected], +1.720.939.4992 to learn more.

Sponsorship opportunities are available! (View the brochure.)
For information, contact Tim Janes, [email protected].

View Past Phil Kaufman Award Recipients

Hosted by

SEMI ESDA

Hayes Mansion
200 Edenvale Avenue
San Jose, CA 95136
United States

Phil Kaufman Honoree

Master of Ceremonies

Ed Sperling

Editor in Chief

Semiconductor Engineering

Tribute Presenters

Feb 17, 2027 ESD Alliance

The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers.

Phil Kaufman Award & Banquet

6:30 pm - 9:00 pm Off Add to Calendar Disabled Sep 25, 2026 America/Los_Angeles 1

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FOA Q2 Fab Meeting

Registration

This meeting is open for FOA Members Only. It is free to attend, but registration is required.

If you are interested in becoming a member, please contact us at [email protected].

Belgium France Germany United States FOA Q2 2025 Membership Meeting Business Executive

Hotel Information

Suggested Hotels:

Residence Inn Minneapolis - 2.2 miles (7 min) from Honeywell

2750 Annapolis Cir N

Plymouth, MN 55441

(763) 577-1600

Hampton Inn & Suites Minneapolis - 2.3 miles (8 min) from Honeywell

10600 Wayzata Boulevard

Minnetonka, MN 55305

(952) 955-8855

Courtyard Minneapolis West - 2.4 miles (9 min) from Honeywell

9980 Wayzata Blvd

Saint Louis Park, MN 55426

(952) 769-8997

DoubleTree by Hilton Hotel Minneapolis - 5.2 miles (11 min) from Honeywell

1500 Park Place Blvd

Minneapolis, MN 55416

(952) 542-8600

If you have any questions on booking your stay, please call the hotel. Hotels are within ~5 miles or 10 min drive from Honeywell.

The closest airport is Minneapolis-St. Paul International Airport - MSP Airport

About us - Honeywell helps organizations solve the world's most complex challenges in automation, the future of aviation and energy transition. As a trusted partner, we provide actionable solutions and innovation through our Aerospace Technologies, Building Automation, Energy and Sustainability Solutions, and Industrial Automation business segments – powered by our Honeywell Forge software – that help make the world smarter, safer and more sustainable.

Honeywell
12001 Highway 55
Plymouth, MN 55441
United States

Day 1 - Wednesday, April 30th, 2025: Golf Event & Welcome Reception

11:00 am - 5:30 pm

FOA Golf Event - Rush Creek Golf Club

Address:
Rush Creek Golf Club
7801 County Road 101
Maple Grove, MN 55311

6:00 pm - 9:00 pm

Welcome Reception - Rush Creek Golf Club

Address:
Rush Creek Golf Club
7801 County Road 101
Maple Grove, MN 55311

Day 2 - Thursday, May 1st, 2025: Membership Meetings

8:00 am - 11:30 am

Device Maker Morning Meeting

Honeywell

11:30 am - 1:00 pm

Lunch

All FOA members: Honeywell

1:00 pm - 5:50 pm

General Meeting

All FOA members: Honeywell
General Session to include: (Welcome remarks, charitable contribution, guest speakers, case studies and an overview of the facility)

3:35 pm - 5:05 pm

DM Fab Tour & SP Window Tour

Fab Tour will be a longer tour than the window tour

5:05 pm - 5:50 pm

DM Feedback Discussion

6:15 pm - 9:00 pm

Evening Social - WhirlyBall

Address:
WhirlyBall - Maple Grove
13644 80th Circle North
Maple Grove, MN 55369

Apr 30, 2025 - May 1, 2025 FOA

The FOA Q2 Membership Meeting will occur at Honeywell in Plymouth, MN. Plan now to attend and experience this impressive facility.

Please plan to join us for golf and networking on Day 1 and a full day of meetings on Day 2. See below for the agenda.

Additional meeting details will be posted here as soon as they are confirmed. FOA is a member-only event. For questions on membership or anything FOA-related contact us at [email protected].

Sponsorships - Contact Karim Somani at [email protected]

FOA Q2 Membership Meeting

Honeywell - Plymouth, MN

8:00 am - 10:00 pm Off Add to Calendar 2025-04-30 08:00:00 2025-05-01 22:00:00 FOA Q2 Fab Meeting The FOA Q2 Membership Meeting will occur at Honeywell in Plymouth, MN. Plan now to attend and experience this impressive facility.Please plan to join us for golf and networking on Day 1 and a full day of meetings on Day 2. See below for the agenda.Additional meeting details will be posted here as soon as they are confirmed. FOA is a member-only event. For questions on membership or anything FOA-related contact us at [email protected] - Contact Karim Somani at [email protected] Honeywell 12001 Highway 55 Plymouth, MN 55441 United States SEMI.org [email protected] America/Los_Angeles public Apr 18, 2025

Event format

View Sponsorship Opportunities for the 2026 Arizona Golf Classic

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SEMI Arizona Golf Classic

REGISTRATION

Sold Out—Thank You for Your Interest!

CANCELLATION POLICY:

Cancellations received on or before April 6, 2026 are fully refunded. After this date, only substitutions will be accepted.

Please contact Karen Popp at [email protected] for any questions.

United States Raven Golf Club Business

Become a Sponsor

Sponsorships are tailored to meet your branding and marketing objectives. To learn about please contact:
Shane Poblete | 1.202.847.5983 | [email protected]

TEE IT HIGH & LET IT FLY

Perched on a mountain slope with panoramic views of the surrounding valley and Phoenix skyline, Raven Golf Club's upscale amenities rival those of America's finest private country clubs. The club boasts a beautiful clubhouse featuring a full-service golf shop with its Gary Panks/David Graham-designed championship layout as the centerpiece.

Check the Raven Golf Club for additional course details.

SEMI ARIZONA CHAPTER STEM SCHOLARSHIP—PURCHASE A MULLIGAN + RAFFLE TICKETS

PURCHASE MULLIGAN(s) and Raffle Tickets—SUPPORT THE SEMI ARIZONA CHAPTER STEM SCHOLARSHIP

The scholarship is awarded to a deserving University in the Arizona Region.
Raffle tickets and mulligans are $5 each, available for purchase electronically in advance or onsite. Proceeds from the sales directly fund the scholarship.
Players and non-players are welcome to support the scholarship.

To donate a raffle prize separately, please contact—Karen Popp | [email protected]

PLAYER AWARDS

Closest to Pin
Longest Drive
Putting Contest
Best Foursome
Needs Most Improvement

DRESS CODE

Proper golf attire must be worn at all times. All players are required to wear collared shirts. Slacks, shorts, or skirts must be hemmed and in good condition. Recommended short/skirt length is mid-thigh. Tank tops, swimwear, cutoffs, gym shorts, and the like are not acceptable.
Raven Golf Course is a spikeless facility. Metal Spikes are not allowed on the golf course.

HOTELS

If you are traveling from out of town, the following hotels are a short drive from the Raven Golf Course:

Raven Golf Course
3636 E Baseline Road
Phoenix, AZ 85042
United States

Thursday, May 7, 2026 | Mountain Time

6:30 am

Registration | Grab & Go Breakfast

Breakfast Sponsored by Sundt

7:30 am

Shotgun Start

1:00 pm

Networking Lunch | Awards Presentation

May 7, 2026

Sold Out—Thank You for Your Interest!

5th Annual SEMI Arizona Golf Classic

Join us for a morning of golf, fun, and networking at the beautiful Raven Golf Course in Phoenix, Arizona. Whether you're a beginner or a pro—enjoy friendly competition and camaraderie with your colleagues and customers.

SEMI Arizona Golf Classic

May 7, 2026
Raven Golf Course, Phoenix, AZ

6:30 am - 3:00 pm Off Add to Calendar Disabled May 6, 2026 America/Phoenix

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^{Austin Marriott South}

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FOA Summit (Q1 Collaborative Forum)

Registration

This meeting is open for FOA Members Only.

If you are interested in becoming a member, please contact Karim Somani - [email protected].

United States Austin Marriott South Business Executive Expositions Technical

Hotel Information and Airport Information

^{4415 South IH-35}

^{Austin, Texas, 78744}

^{Austin Marriott South for 219.00 USD per night}^-^{Last Day to Book: Monday, February 02, 2026}

^{Booking link:}^{Book your group rate for FOA Q1 Collaborative Forum}

Austin-Bergstrom International Airport
3600 Presidential Blvd
Austin, TX 78719

Austin Marriott South
4415 South IH-35
Austin, TX 78744
United States

10:30 am - 5:00 pm

FOA Golf Event (Tee Time Start) - Onion Creek Club

Onion Creek Club

2510 Onion Creek Parkway

Austin, TX 78747

5:00 pm - 9:00 pm

Women of FOA - Evening Dinner & Social Activity

Meeting room: Sycamore A&B

Day 1 -February 25, 2026 (times are subject to change)

8:00 am - 12:00 pm

Device Maker Morning Meeting - IDM's Only

Meeting room: Lone Star Ballroom

8:00 am - 8:30 am

Registration check-in & Gathering

8:30 am - 8:40 am

Karim Somani

SEMI

Meeting Start - Introductions, Agenda Review, Sponsor Recognition, Next Meetings

8:40 am - 9:40 am

Mark da Silva

SEMI

Open Forum Topics #1

9:40 am - 9:50 am

Rick Glasmann

MAX

Welcome Reception sponsor presentation - MAX

9:50 am - 10:30 am

Coffee Break

10:30 am - 10:40 am

Social Event sponsor presentation - INFICON

10:40 am

Mark da Silva

SEMI

Open Forum Topics #2

11:40 am - 11:50 am

Sean Tropsa

SEEQ

DM Lunch sponsor presentation - SEEQ

11:50 am - 1:00 pm

DM Lunch - IDM's Only

Lunch will be in rooms: Sycamore A&B and Bluebonnet

Continuation Day 1 - February 25, 2026 (times are subject to change)

12:00 pm - 6:00 pm

Exhibit Opens

Exhibits will be displayed in the foyer

1:00 pm - 6:00 pm

Session 1 - General Meeting for all FOA Members

Meeting Room: Lone Star Ballroom

1:00 pm - 1:10 pm

Mark da Silva

Welcome remarks & Updates

Removing Manufacturing Bottlenecks (Case Studies)

1:10 pm - 1:35 pm

GlobalFoundries & Semilab

Next-Generation In-Line AFM Metrology for Silicon and GaN Applications

1:35 pm - 2:00 pm

Northrop Grumman & Applied Materials

Reduction of Through-Silicon Via (TSV) Sidewall Roughness through Process Optimization in Bosch Dry Etch Process: A Collaborative Study

2:00 pm - 2:30 pm

Tosca Derrick

Baker Tilly

Industry – Tariff Updates

2:30 pm - 2:55 pm

Broadcom & Fabworx Solutions

Particles vs. Productivity: Root-Cause Solutions that Unlocked Tool Performance

2:55 pm - 3:25 pm

Coffee Break #1 – Sponsored by JST

Improving Fab Efficiency (Case Study)

3:25 pm - 3:50 pm

ST Microelectronics & INFICON

From Insight to Action: Elevating Employee Efficiency with Smart Detection and Targeted Data Delivery

3:50 pm - 4:20 pm

Inna Skvortsova

Market Research Manager, SEMI’s Market Intelligence

SEMI

SEMI Market Outlook - Fab Investments, Equipment and Materials Forecast

4:20 pm - 4:50 pm

Michelle Williams-Vaden

Executive Director, SEMI Foundation

SEMI

SEMI Foundation

4:50 pm - 4:55 pm

Wrap-up & directions to Welcome Networking Reception (within the hotel)

7:00 pm - 10:00 pm

Welcome Networking Reception

Room: Sycamore A&B and Bluebonnet - Sponsored by MAX Group

Day 2 - February 26 2026

8:00 am - 12:00 pm

Session 2 - General Meeting

Meeting Room: Lone Star Ballroom

8:00 am - 6:00 pm

Exhibits Open

8:00 am - 8:40 am

Karim Somani

Gathering & Welcome Remarks

Improve Long-Term Plant Viability (Case Studies)

8:40 am - 9:02 am

Qorvo & camLine

Lessons from the SPACE Deployment Project: Implementation at Qorvo Wafer Fab

9:05 am - 9:30 am

FormFactor & Olsson

Transforming a Mature Semiconductor Factory to Meet FormFactor’s Advanced Manufacturing Needs

9:30 am - 9:55 am

Polar Semiconductor & Mortenson

Polar Semiconductor Expansion and Modernization Project

9:55 am - 10:05 am

ControlSoft

Break Sponsor Presentation - ControlSoft

10:05 am - 10:35 am

Coffee Break #2 – Sponsored by ControlSoft

10:35 am - 11:00 am

Analog Devices & ControlSoft

Transformation in Motion: A solution for 200mm fab AMHS upgrades

Agentic AI in Manufacturing (Case Study)

11:00 am - 11:25 am

Intel & Seeq

Intel + Seeq’s Multi-Agent Architecture to "Dim the lights" in facilities Operations

11:25 am - 11:35 am

Michelle Williams-Vaden

Executive Director, SEMI Foundation

SEMI

Thursday Lunch sponsor presentation - WFOA

11:35 am - 1:30 pm

Lunch - All Members & Speakers

Lunch will be in rooms: Sycamore A&B, Bluebonnet and Wrangler

Continuation Day 2 - February 26, 2026

1:30 pm - 6:00 pm

Session 3 - General Meeting

Meeting room: Lone Star Ballroom

1:30 pm - 1:45 pm

Mark da Silva

SEMI Technology Community Update

Improving Fab Efficiency (Case Studies)

1:45 pm - 2:10 pm

Qorvo & Siconnex

Improved Fab Productivity

2:10 pm - 2:35 pm

FOA DM & Flexciton

Solving Fab-Level Execution Gaps with Intelligent Action Prioritization and Quantified Impact Modeling

2:35 pm - 3:05 pm

Taimur Burki

Sustainability Consultant

SEMI

Sustainability - Waste Management and how to Make $$ off of your waste

3:05 pm - 3:35 pm

Coffee Break #3

3:35 pm - 4:00 pm

Analog Devices & Seertech Solutions

Driving Fab Efficiency Through Automated Workforce Qualification and MES-Integrated OJT Enforcement

4:00 pm - 4:25 pm

M.I.T. Lincoln Laboratory & Eyelit

Enhancing Semiconductor R&D Workflow Flexibility and Traceability through Eyelit’s Manufacturing Operations Management Platform

Deployment of Digital Twins (Case Study)

4:25 pm - 4:50 pm

GlobalFoundries & D-SIMLAB Technologies

Dynamic Simulation Enabled Prescriptive Analytics for the AI-Driven Autonomous Factory of the Future

4:50 pm - 5:05 pm

Peilun Sun

Consortium Manager, SCC

SEMI

From Fab Floor to Climate Impact: How SCC Supports Manufacturing Decarbonization

5:05 pm - 5:25 pm

Karim Somani

FOA – Inside the Fab (@ Northrop Grumman Jul 28 – Jul 30) & Wrap-up

7:00 pm - 10:00 pm

FOA Annual Poker Tournament: Austin Marriott South

Poker Tournament: Sycamore A&B, Bluebonnet and Wrangler

FOA Events - February 24, 2026

Feb 24, 2026 - Feb 26, 2026 FOA Workforce Development

Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits.

This event is for FOA Members only. To learn more about becoming an FOA member, email [email protected]. Visit the FOA web pages.

FOA Summit (Q1 Collaborative Forum)

8:00 am - 10:00 pm Off Add to Calendar 2026-02-24 08:00:00 2026-02-26 22:00:00 FOA Summit (Q1 Collaborative Forum) Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits. This event is for FOA Members only. To learn more about becoming an FOA member, email [email protected]. Visit the FOA web pages. Austin Marriott South 4415 South IH-35 Austin, TX 78744 United States SEMI.org [email protected] America/Chicago public Mar 26, 2026 America/Chicago

Event format