Nijmegen, October 20, 2025 – Chip Integration Technology Center (CITC) will become part of TNO. This strategic move marks a significant step toward ensuring the long-term continuity and stability of CITC’s research and operations. The integration emphasizes TNO’s ambition to take a leading position in the innovation of chip packaging technologies and strengthen the regional semiconductor ecosystem in Nijmegen.

“In the coming years, TNO aims to play a key role in the development of advanced chip packaging in the Netherlands,” says Arnaud de Jong, director of High Tech Industry at TNO. “By integrating CITC into TNO, we can intensify and expand our research efforts. We also contribute to the further development of Lifeport in Nijmegen as a strong, future-proof semiconductor ecosystem.” With the investment in CITC, TNO connects chip technology activities between Nijmegen and other semiconductor hubs such as Eindhoven.

Advanced chip packaging
CITC was founded in 2019 by TNO and Delft University of Technology (TU Delft), among others, as an independent innovation center for advanced chip packaging technology. Within an ecosystem of companies, research institutions and educational organizations, CITC has developed into a broad R&D hub that collaborates on technological breakthroughs in advanced chip packaging.

“CITC’s integration into TNO marks a noteworthy moment for CITC. This step underscores our shared vision for the future of chip integration and packaging technology,” says Jeroen van den Brand, general manager of CITC in Nijmegen. “This provides room for growth, accelerates innovation, and strengthens CITC’s international position as a center of expertise for chip packaging.”

Strategic choice for Nijmegen
CITC’s integration into TNO will formally take effect on January 1, 2026. CITC will become part of TNO’s High Tech Industry business unit and will remain located at the Noviotech Campus in Nijmegen. Toni Versluijs, chairman of the CITC Supervisory Board: “CITC continues on its current course. For the Supervisory Board, it is essential that, with TNO’s ambition and investment, we secure continuation of the CITC activities, while building on the existing talent and technology and give CITC room to grow further.”

Lucas van Vliet, member of the CITC Supervisory Board on behalf of TU Delft: “The collaboration between TU Delft and TNO within CITC will change form as of January 1 but remains as strong as ever. TU Delft believes in the importance and growth potential of chip packaging and sees incorporating CITC into a strong organization like TNO as an opportunity to further accelerate innovation in chip technology.”

- ENDS -

About CITC
CITC is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. With the aim of bridging the gap between academia and industry, CITC has created an effective ecosystem where companies, research and educational institutions collaborate. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by the province of Gelderland and Nijmegen municipality. Located on Noviotech Campus Nijmegen, CITC is perfectly situated in the heart of the Dutch semiconductor industry.
www.citc.org

About TNO
TNO is the largest independent research and technology organization in the Netherlands and one of the largest in the EU. We innovate, investigate, and orchestrate, collaborating closely with governments, universities and the private sector. We inform government on policies and empower evidence-based decision-making through rigorous investigations, cutting-edge scientific insights, and reliable measurements. By building national and international consortia and ecosystems, we drive technological and methodological breakthroughs that help to realise a secure, sustainable, healthy, and digital society, and strengthen the earning power of the Dutch economy.
www.tno.nl/en/

Contact
Christian Ketelaars, Communications Manager
E [email protected]
M +31 (0)6 48 15 42 92

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Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities

• Donation includes open-source system integrity tests for core and SoC certification
• Unique Breker tests complements existing test sets
• Breker’s RISC-V SystemVIP will be demonstrated at booth #P4 during RISC-V Summit North America 2025

SAN JOSE, CALIF. –– October 16, 2025––Breker Verification Systems today announced a donation to RISC-V International of a subset of its RISC-V advanced test suite developed through its work with more than 20 RISC-V core producers.

The donation is designed to be complementary to the existing Architectural Compliance Test (ACT) and ongoing ISA compliance activities, consisting of unique tests not available from other sources.

Breker provides test suites for the complete verification of RISC-V cores and SoCs from detailed microarchitectural analysis to advanced system integrity validation. The radonation will consist of a subset of these tests to target ISA compliance. The test donation will cover both core and SoC certification and will include, but is not limited to, coherency, hypervisor, vectors, advanced interrupt architecture, IOMMU and other scenarios. Each component is designed to complement existing tests.

“Breker is now working with over 20 commercial entities and other organizations to verify their RISC-V cores, providing us with unique experience of the myriad of unusual verification issues inherent in these processors,” says David Kelf, Breker’s CEO. “We are giving back to the RISC-V community by providing a subset of these tests, open source, that can target ISA compliance and for other purposes.”

The announcement of the donation coincides with the RISC-V Summit North America Tuesday, October 21, through Thursday, October 23, at the Santa Clara Convention Center in Santa Clara, Calif. As a Platinum Sponsor, Breker will exhibit in Booth #P4 and offer five presentations as part of the RISC-V Summit program.

“At RISC-V International, we greatly value the expertise of the Breker team and the contributions they have made to ongoing ISA compliance work,” remarks Andrea Gallo, RISC-V International’s CEO. “I am looking forward to Breker’s donation and the impact it can have in complementing and extending our existing ACT test suites.”

Breker’s donation provides alignment with RISC-V International programs. This will provide value to the company’s customers, as well as the RISC-V designer community, by aligning Breker’s full RISC-V verification test suite with RISC-V test developments.

In addition to existing test suites and generators, which are focused on random instruction generation for instruction set architecture testing, with SystemVIPs, Breker has been able to significantly extend testing to advanced system-level integrity. Using test suite synthesis technology, Breker is able to provide a high degree of coverage by driving cross functional stress verification and unpredictable corner case discovery. The donation will include tests generated using test suite synthesis.

David Kelf and Adnan Hamid, Breker’s Executive President and CTO, were elected Chairperson of the Requirements Working Group and Vice-Chairperson of the Test Plan Working Group, respectively, in the RISC-V International Certification Steering Committee.

Breker at RISC-V Summit North America 2025
Breker will demonstrate its RISC-V CoreAssurance and SoCReady SystemVIPs and Trek Test Suite Synthesis solutions at RISC-V Summit North America, Tuesday, October 21 through Thursday, October 23, at the Santa Clara Convention Center.

Presentations featuring Breker executives include:
Member Day: “Framework for RISCV Certification—Software, Hardware and Systems”
Nambi Ju, Lyle Technologies, LLP
Tuesday at 4 p.m. in Grand Ballroom H (Level 1)

Demo: “RISC-V AIA Expanding Interrupts: Applications, Implementation and Verification”
Adnan Hamid
Wednesday at 1 p.m.
Exhibit Hall A, Demo Theater

“RISC-V System Level Certification from Verification Foundations”
Adnan Hamid
Wednesday at 3:15 p.m.
Theater (Level 2)

Lightning Round: “Leveraging AI to understand the RISC-V ISA Specification”
Dave Kelf and Nambi Ju
Wednesday at 4:15 p.m.

“Unleashing ML Processing Power Through RISC-V Vectors: Applications, Implementation and Verification”
Brian Baker, Solutions Architect
Thursday at 2:35 p.m.
Grand Ballroom G (Level 1)

To arrange a demonstration or private meeting, send email to [email protected].

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

TrekSoC, TrekSoC-Si, RISC-V CoreAssurance SystemVIP and RISC-V SoCReady SystemVIP are registered trademarks of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

• Read more about Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities

FOR IMMEDIATE RELEASE

Media contact: M. Guilbert, [email protected]

RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution to Test E84 and SECS/GEM SEMI Standard Compliance of Wafer Handling and Tracking Equipment

Global French manufacturer of automated handling equipment, wafer sorters, and equipment front-end modules (EFEMs) saves significant fab equipment integration time and enhances customer satisfaction

PHOENIX, October 7, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance. The global company headquartered in Toulouse Blagnac, France, which specializes in the design, manufacturing, and installation of automated equipment for semiconductor wafer handling, needed a fast and effective solution to validate the compliance of its products with SEMI’s E84 and SECS/GEM standards before they are shipped and implemented at customers’ semiconductor manufacturing sites all over the world.

Speech Scenario is a software that emulates the fab host to validate SECS/GEM tool scenarios before shipping brand-new production equipment to fabs. The E84 PIO Box is a compact and lightweight device that serves as an interface between Speech Scenario and E84 passive equipment. Used together, these products allow RECIF Technologies to generate complete test reports that can be communicated to its customers, ensure fast detection of non-compliance and errors to avoid downtime, as well as quick and reliable SEMI E84 and SECS/GEM compliance testing, especially in the management of complex cases. The company has now better control over host-sorter interactions, with customizable scenarios related to automatic carrier delivery defined in the E84 standards. With Speech Scenario, RECIF teams can more effectively replicate customer use cases when resolving anomalies.

“We were using less flexible software where automation messages were not easily modifiable and old emulation technology for validation of only the PIO part of the E84 standard, which meant that more complex cases and host-sorter interactions had to be tested and adapted in the field during machine integration at customer sites,” explains Thomas Brillouet, research and development director for RECIF Technologies SAS. “We selected Agileo’s all-in-one Speech Scenario and E84 PIO Box solution because we believe that it is the most efficient and competitive product currently on the market. The flexibility and time savings we have garnered since using Agileo’s solution has translated into enhanced overall customer satisfaction for our company.”

“Over the past 40 years, RECIF Technologies has built a solid reputation as an innovative industry leader in advanced semiconductor equipment manufacturing and as an early adopter of SEMI standards,” adds Marc Engel, CEO of Agileo Automation. “Agileo Automation, whose origins are closely tied to RECIF Technologies, benefits from a strong cultural and technical proximity with the company. We are proud to contribute to RECIF Technologies’ success, both as a technology partner and by supporting them in demonstrating quality and reliability to their customers.”

- ends -

About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo Automation is a key contributor to the development and integration of industry standards such as SEMI and OPC UA. For more information, please visit our web site or follow us on LinkedIn.

About RECIF Technologies
RECIF Technologies, headquartered in Toulouse-Blagnac, France, has been providing advanced robotic solutions for semiconductor wafer handling since 1985. The company designs and manufactures reliable sorters, EFEMs, and compact handling tools that help leading semiconductor manufacturers worldwide improve productivity, ensure reliability, and reduce total cost of ownership. As a member of SEMI and the Aeneas association, RECIF Technologies actively contributes to the industry standards and collaborative projects shaping the future of the semiconductor industry. For more information, please visit our web site or follow us on LinkedIn.

• Read more about RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution to Test E84 and SECS/GEM SEMI Standard Compliance of Wafer Handling and Tracking Equipment

Rogue Valley Microdevices (RVM) and the MiQro Innovation Collaborative Centre (C2MI) have signed a Memorandum of Understanding (MOU) to strengthen collaboration in MEMS and semiconductor manufacturing. By combining complementary expertise, the organizations will accelerate innovation and expand customer access to advanced technologies.

Rogue Valley Microdevices is a MEMS foundry specializing in the design, prototyping, and manufacture of MEMS devices for a diverse global customer base. C2MI is a world-class innovation centre in manufacturing MEMS, advanced semiconductor assembly, printed electronics and quantum superconductive chips. Together, they will create a stronger value chain for organizations in the MEMS and semiconductor fields—supporting the journey from ideas to proof of concept, in order to speed up commercialization of new technologies and products.

“This partnership between Rogue Valley Microdevices and C2MI allows us to collaborate and share resources,” said Jessica Gomez, CEO and founder of Rogue Valley Microdevices. “By leveraging each other’s facilities and complementary capabilities, we can fast track the creation and deployment of next-generation MEMS platforms, including advancements in 300mm technology.”

Marie-Josée Turgeon, CEO of C2MI added, “We are delighted to join forces with Rogue Valley Microdevices. By combining our strengths and sharing access to our world-class facilities, we will be opening new opportunities for customers on both sides of the border. This collaboration exemplifies our commitment to supporting our partners’ growth and to advancing innovation in the next generation of MEMS.”

Through this MOU, the two organizations will pool expertise and infrastructure to give customers greater access to essential resources. As demand for 300mm technology grows, Rogue Valley Microdevices and C2MI will collaborate to open new pathways for innovation in advanced microelectronics and MEMS.

Update on RVM’s 300mm-capable MEMS Fab

Rogue Valley Microdevices is continuing the build-out of its new 50,000-square-foot microfabrication facility in Palm Bay, Florida—expected to become the first 300mm-capable pure-play MEMS foundry in the U.S. Since 2003, RVM has partnered with customers to take designs from lab to fab, successfully commercializing MEMS and sensor technologies from its Medford, Oregon facility. With the addition of Palm Bay, the company will offer a strategically located second source, strengthening both manufacturing excellence and supply chain resilience. As the facility nears its anticipated opening, RVM expects to begin accepting orders for dielectric and conductive films in December, followed by MEMS devices and post-CMOS processing in early 2026.

Today, MEMS and related devices are central to industries ranging from biotechnology and industrial sensing to photonics. With the migration to larger substrates, RVM’s new facility will deliver modern capabilities and scalable manufacturing to meet the evolving needs of its customers.

Update on C2MI Fab

Anchored in Canada’s semiconductor manufacturing ecosystem, C2MI nears completion of new 11,000 square feet extension, mostly made of class ISO4 cleanroom. The extension will host advanced packaging and wafer post-processing capabilities on both 200mm and 300mm wafers, while also establishing the first pure play industrial-scale facility for superconducting quantum chips.

With this extension, C2MI will continue to offer a truly unique bridge between academia and industry—combining a collaborative research environment with an innovative approach to intellectual-property management and a fully integrated industrial development chain, accelerating the creation of cutting-edge technologies and significantly reducing commercialization risks for our customers.

Visit Rogue Valley Microdevices at SEMICON West

Rogue Valley Microdevices welcomes meeting with prospective customers and partners at SEMICON West, October 7-9 in Phoenix, AZ, at booth #777. Please email [email protected] to set up a meeting or just drop by the booth. To schedule a media briefing with Jessica Gomez during SEMICON West, please reach out to Maria Doyle at [email protected].

About C2MI

The MiQro Innovation Collaborative Centre (C2MI) serves as a reference in research and development to accelerate the commercialization of components essential to digital technologies, being a transversal vector for all the economic sectors and critical to wealth creation. Backed by a world-class infrastructure in the manufacturing fields of micro-electro-mechanical systems (MEMS), advanced semiconductor packaging, quantum and printed electronics, C2MI is at the core of all industry sectors integrating components essential for the use and deployment of digital technologies. The Centre is strongly committed to being a unique model of collaboration, where synergy between industrial and academic partners is necessary, even essential, for the development of next-generation products. Visit: www.c2mi.ca

About Rogue Valley Microdevices

Rogue Valley Microdevices is a full-service precision MEMS and photonics foundry that combines state-of-the-art process modules with the engineering expertise to go seamlessly from custom design to manufacturing. RVM also maintains the broadest and most comprehensive set of wafer services commercially available—with over 50 unique dielectric and conductive thin films and all services performed in its own Class 100 cleanroom. With headquarters in Medford, Oregon, and a new 300 mm fab under construction in Palm Bay, Florida, RVM offers a flexible, customer-focused approach to manufacturing. Visit: www.roguevalleymicro.com and follow us on LinkedIn.

RVM Media Contact:
Maria Doyle
Doyle Strategic Communications
781-964-3536
[email protected]

C2MI Media Contact:
Maryse Demers
C2MI
450-534-8000 ext. 1000
[email protected]

• Read more about Rogue Valley Microdevices and C2MI Sign MOU to Offer Fast-Track MEMS Platform Creation and Deployment

Semiconductor company with a 50-year Arizona history funds 50 school field trips to Arizona Science Center

PHOENIX, (September 24, 2025) - Semiconductors power everything from TikTok videos to Mars rovers, but does anyone actually know how these tiny tech wonders work? ASM, a semiconductor equipment company with a nearly 50-year history in Arizona, is launching an exhibition titled "From Sand to Stars: A Semiconductor Adventure" at Arizona Science Center to pull back the curtain on this magical world.

Running September 26 through December 24, 2025, this hands-on exhibition invites students to jump into the nano-world of microchips. ASM is sponsoring field trips for 50 low-income Phoenix-area schools, giving students the chance to experiment, play, and discover the atomic layers that power today's chips and tomorrow's dreams.

The exhibition showcases how ASMers work at the atomic scale—stacking layers of atoms so thin they’re nearly invisible—to create the chips that power everything from everyday devices like our phones and laptops, to life-saving medical technologies, and even the rockets that explore the farthest reaches of our universe. Students will dive into the nano-world of microchips, discovering how tiny grains of sand are transformed into the brains behind the technology that drives our world.

"The future of semiconductors – and everything they power, from AI data centers to your smartphone to spacecraft – it all depends on the brightest young minds joining our industry," said Vamsi Paruchuri Corporate VP, Technology, Innovation & Market Research. "By partnering with Arizona Science Center, we're showing students how they can shape tomorrow's technology at an atomic scale. Our new Scottsdale facility isn't just expanding ASM's footprint – it's creating a launchpad for Arizona's next generation of innovators who will master the art of atomic layering."

The exhibition showcases the periodic table’s semiconductor superstars—from silicon, the essential element found in beach sand, to hafnium oxide, which helps make our battery-powered devices faster and more efficient. Career videos introduce the pioneers of nanoscale technology, working at dimensions thousands of times smaller than a human hair, while imagination stations encourage guests to dream up the next world-changing innovation. Interactive displays feature a nearly 8-foot-tall, to-scale photo of equipment typically kept behind lock and key in ultra-clean semiconductor fabrication plants, including ASM’s massive XP8 Synergis machine.

Arizona's semiconductor boom needs brainpower to match its manufacturing might. The state leads the nation in semiconductor investments and supplier announcements, according to the Arizona Commerce Authority, creating a tech revolution that demands skilled talent. The Semiconductor Industry Alliance projects the industry will add nearly 115,000 jobs by 2030, with an estimated 58% at risk of going unfilled. It's not just about sending people to space or powering the latest smartphone – the semiconductor industry is racing to find the next generation of innovators who will shape the future at the atomic level.

ASM's multi-million-dollar investment in its new North American headquarters in Scottsdale is part of this growth story, bringing additional high-tech jobs to the local ecosystem and creating opportunities for today's students to become tomorrow's semiconductor pioneers.

“Kids can’t dream of careers they’ve never seen,” said Tammy Stewart, Interim Hazel A. Hare President & CEO. “We’re not just showing students how chips work—we’re uncovering the atomic magic behind everything they love, from gaming consoles to space exploration. When kids light up a circuit with their own hands or watch sand transform into technology, those ‘wow’ moments spark wonder that can grow into a lifelong passion. Together with ASM, we're turning complex semiconductor science into an adventure that might just inspire Arizona's next generation of innovators.”

Arizona Science Center exhibition’s timing coincides with SEMICON West 2025, which will be held in downtown Phoenix for the first time in the conference’s 50+ year history, October 7 through 9.

The "From Sand to Stars" exhibition will run from September 26 through December 24, 2025, at Arizona Science Center, located at 600 E. Washington St. in downtown Phoenix, just across the street from the Phoenix Convention Center, where SEMICON West will be held. The exhibition is displayed in the Arizona Science Center's lobby. To learn more visit, https://www.azscience.org/experience/all-exhibitions/level-1/from-sand-…

About ASM
ASM has been making the equipment that makes the chips inside the world's favorite devices for more than half a century. We enable the next generation of microchips by empowering leading semiconductor manufacturers with advanced wafer processing equipment. Through our mastery of thin-film deposition, we create the innovative tools and solutions that shape the materials at the heart of tomorrow’s technology – powering everything from AI and next-generation healthcare to cloud computing and smarter, more energy-efficient devices.

With over 4,500 employees in 15 key locations across three continents, we specialize in technologies that serve our customers' needs, including Atomic Layer Deposition (ALD), Plasma-Enhanced Atomic Layer Deposition (PEALD), epitaxy, silicon carbide epitaxy, Plasma-Enhanced Chemical Vapor Deposition (PECVD), and Vertical Furnaces.

At ASM, we care about the world we live in. Every day, we work to improve people's lives around the globe by enabling technology that bridges gaps, creates connections, and unlocks potential.

About Arizona Science Center
Located in downtown Phoenix, Arizona Science Center features more than 300 hands-on exhibits, a five-story giant-screen theater, live demonstrations, traveling exhibitions, and exciting science programs. The Center offers programs for all ages, including Science on Wheels, CAMP INNOVATION, Teen programs, Professional Development, and Adults' Night Out: Science with a Twist. Whether onsite or at your location–get ready to embark on a hands-on STEM learning journey you'll never forget. To learn more or to reserve tickets, visit azscience.org or call 602.716.2000. Follow us on Instagram, X, Facebook, LinkedIn, and YouTube.

• Read more about From Sand to Stars: ASM Launches Interactive Exhibition to Demystify Semiconductor Magic

Intel and Flexciton announce partnership to provide semiconductor manufacturers with a comprehensive Factory Automation and Optimisation Software Solution.

LONDON – September 25th, 2025 – Flexciton, a leader in autonomous planning and scheduling for semiconductor manufacturing, today announced a partnership with Intel. This collaboration will provide semiconductor manufacturers with a comprehensive, end-to-end set of software solutions to increase the level of automation and accelerate their transition to autonomous factory operations.

The partnership combines the power of  Intel® Automated Factory Solutions (Intel® AFS) software suite, including Intel® Operations Recon, and Intel® Factory Pathfinder, with Flexciton’s autonomous technology suite of Advanced Production Planning and Scheduling. The two companies will offer a synergic, holistic approach that provides complete visibility and control over complex semiconductor production workflows, enabling smart, autonomous decision-making and significant gains in key performance indicators.

"I am incredibly excited about this partnership. Intel® AFS solutions have been developed and tested within the most advanced fabs, and we see a great synergy with our cutting-edge planning and scheduling technologies," said Jamie, CEO & Cofounder, Flexciton. "With Intel® Factory Pathfinder and  Intel® Operation Recon combined with our Flex Planner and Scheduler suite, we will be able to provide an end-to-end optimisation solution that empowers our customers to unlock new levels of automation and significantly increase factory efficiency."

The partnership is designed to meet the growing demand for greater operational efficiency in the semiconductor industry. By leveraging high-speed simulations, AI, and advanced optimisation, the combined approach will enhance factory automation and deliver tangible benefits, including complete visibility of shopfloor operations, optimised planning and scheduling, and a significant uplift in factory key metrics such as throughput and cycle times.

Paul Schneider, Intel Principal Engineer, Director, said: "By combining our deep factory automation expertise with Flexciton's innovative scheduling solutions, we are providing manufacturers with the critical tools they need to enhance their operational efficiency and maintain a competitive edge." 

—------------

About Flexciton: Flexciton partners with semiconductor manufacturers to power their transition towards autonomous factories. Our suite of intelligent planning and scheduling applications combines advanced optimisation techniques with the power of AI to orchestrate complex fab workflows and achieve critical revenue-to-shop-floor alignment. Flexciton’s Autonomous Technology transforms fab operations by eliminating manual and reactive decision-making processes. This dramatically improves factory throughput and cycle times, enhances labour efficiency, and optimises overall costs and resource utilisation. Trusted by industry leaders including Seagate Technology, Renesas, and Microchip, Flexciton drives the next phase of digitalisation and transformation to an autonomous factory. Headquartered in London, UK, Flexciton operates globally with dedicated teams located in Europe and the US.
www.flexciton.com 

About Intel Automated Factory Solutions: Intel® Automated Factory Solutions (Intel® AFS) is a comprehensive software suite that optimises industrial processes.  It utilises advanced technologies such as Digital Twins, predictive analytics, high-speed simulation, and AI to improve efficiency and reduce downtime in factory operations and other complex operational processes with many interdependencies.

Intel® Factory Pathfinder: A high-speed discrete event simulator and digital twin designed for factory prediction and optimisation. It can function independently or integrate with production systems to streamline product assignments and reduce order fulfilment times.

Intel® Operations Recon: Provides a graphical digital twin of factory production equipment and automated systems, boosting operational visibility and enabling real-time troubleshooting and material movement simulations.
www.intel.com/content/www/us/en/software/automated-factory-solutions.html

• Read more about Intel and Flexciton announce partnership to provide semiconductor manufacturers with a comprehensive Factory Automation and Optimisation Software Solution

Sigma Design to Feature Omron^TM Collaborative Robot at SEMICON West 2025 Service-driven innovation combined with advanced automation can address key industry challenges 

Phoenix, AZ – September 10, 2025 — Sigma Design, a leading provider of engineering and product development services to the semiconductor industry, will showcase its capabilities at SEMICON® West 2025 in partnership with Omron^TM Automation, featuring live demonstrations of the Omron collaborative robot (Cobot) at Booth 1973 at the Phoenix Convention Center from October 7-9. 

The demonstration highlights how service-driven innovation combined with advanced automation can address key industry challenges in smart manufacturing, labor optimization, and operational flexibility. 

Key Highlights: 

• Live demo of the Omron^TM Cobot integrated into a service-centric automation solution, supporting assembly, inspection, and material handling tasks.
• Discussion of how Sigma Design applies collaborative robotics in client environments to reduce manual burden, increase uptime, and improve safety.
• Insight into workforce enablement strategies and scalable automation deployments tailored for semiconductor operations. 

Why It Matters: 

Themed “Stronger Together—Shaping a Sustainable Future in Talent, Technology, and Trade,” SEMICON West brings together global leaders from across the microelectronics industry to address critical industry priorities – from advanced manufacturing and supply chain resilience to sustainability and workforce development. Sigma Design and Omron^TM’s collaboration demonstrates how cross-industry partnerships can deliver real-world value through intelligent automation and engineering support. 

About Sigma Design 

As product development experts, we are driven by new challenges. We design, engineer, build, and test solutions for our partners' success. Sigma Design is a full-service product development and engineering firm dedicated to solving complex challenges. With a focus on quality, efficiency, and innovation, Sigma Design provides end-to-end product development solutions that encompass design, engineering, manufacturing, testing, and staffing services. 

Committed to excellence, we exceed client expectations with our dedicated approach. Challenges Accepted. Solutions Delivered. 

For more information, visit www.sigmadzn.com 

About Omron^TM Automation

Omron^TM is a global leader in industrial automation solutions, including robotics, sensing, and control systems. Its collaborative robots are designed to safely work alongside humans, delivering flexibility and precision in advanced manufacturing environments. 

Contact:

Jordan Rousseau 
Marketing Specialist 
[email protected] 
360.396.2600 

• Read more about Sigma Design to Feature Omron™ Collaborative Robot at SEMICON West 2025

Via Automation Debuts Agentic AI-Based Platforms for Smart Manufacturing at SEMICON West

• Set to revolutionize semiconductor manufacturing operations, paving the way for self-healing factories and resilient supply chains
• Demos of Via Connect and Via Co-Pilot available during SEMICON West October 7 to October 9 in Booth #7438
• Via Automation “Developing Explainable Digital Twins and Connecting to Via CoPilot Agents for Autonomous Tool Operations” at Smart Manufacturing Theater

FREMONT, CALIF.––September 23, 2025––Via Automation today unveiled Via Connect and Via Co-Pilot, Agentic AI-based platforms that combine edge data integration with AI-driven human collaboration to revolutionize enterprise manufacturing operations and pave the way for self-healing factories and resilient supply chains.

Demonstrations of Via Connect and Via Co-Pilot will be available during SEMICON West October 7 to October 9 at the Phoenix Convention Center in Phoenix, Ariz.

“Predictive maintenance isn’t just about preventing breakdowns, it’s about enhancing yield and enabling smarter, safer and more efficient industrial operations,” remarks Nitin Parekh, CEO at Via Automation. “With Via Connect and Via Co-Pilot, enterprises can move beyond pilot projects into scalable, trusted and ROI-positive predictive maintenance programs.”

Introducing AI-Powered Industrial Automation
Unplanned equipment downtime cost manufacturers more than $1.5 trillion globally per year, a problem that grows more expensive annually. The cost of a single hour of downtime has surged by 50% in just two years.

Via Automation’s Via Connect and Via Co-Pilot powers real-time, AI-driven decisions across the factory floor, enhancing efficiency, optimizing operations, reducing unplanned downtime, elevating performance across all areas.

Via Connect
Traditional solutions rely on dashboards and complex visualizations that don't solve the root problem. Via Connect seamlessly offers data integration at the edge by acting as the digital fabric between assets, IoT sensors and enterprise systems. Via Connect can be connected into digital twin models to provide holistic monitoring capabilities as a software development kit (SDK) for equipment vendors to integrate with their equipment.

With its edge-ready processing capabilities, Via Connect can detect low-latency anomalies directly at the factory floor and integrates with manufacturing execution systems (MES), enterprise resource planning (ERP) systems and cloud platforms including AWS, Azure and Databricks using out-of-the box connectors.

For predictive maintenance, it ensures unified data collection of real-time vibration, temperature and process signals streamed from machines and IoT endpoints. Using Via Connect, predictive models can access clean, contextualized data without integration bottlenecks, one of the biggest hurdles in scaling predictive maintenance initiatives.

Via Co-Pilot
Where Connect enables data orchestration, Via Co-Pilot elevates operational intelligence, acting as a decision assistant to unite humans with AI tools for smarter decision making.

Via Co-Pilot turns predictive maintenance from a “black-box algorithm” into a trusted co-worker—accelerating adoption and building operator confidence by providing AI-Driven insights for warnings of equipment degradation using machine learning models trained on sensor data. Its diagnostics are easily explainable, interpretable and highlight root causes, such as bearing wear or lubrication breakdown. It enables collaborative workflows for engineers, operators and managers to interact with AI that delivers recommendations, validate insights and trigger automated work orders

It also offers continuous learning opportunities with its feedback loops that improve model accuracy over time and adapt to new operating conditions.

Via Automation can AI enable any equipment or fab with Via Connect and Via Co-pilot. An intuitive interface gives manufacturing teams the ability to build and deploy custom workflows without deep AI expertise and focus on keeping their equipment running smoothly and efficiently.

Early results show that Via Connect and Via Co-Pilot together reduce unplanned downtime by between 30-40% and maintenance costs by between 15-20%. They extend asset life by about 25% and improve operator safety and compliance reporting.

Via Automation at SEMICON West October 7-9 in Phoenix, Ariz.
Via Automation will exhibit and demonstrate its Connect and Co-Pilot at SEMICON West in Booth #7438 Tuesday, October 7, through Thursday, October 9, at the Phoenix Convention Center in Phoenix, Ariz.

Kiran Karunakaran, Via’s CTO, will present “Developing Explainable Digital Twins and Connecting to Co-Pilot Agents for Autonomous Tool Operations” Wednesday in the Smart Manufacturing Pavilion Theater.

To arrange a demonstration or private meeting, send email to [email protected].

About Via Automation
Via Automation is a pioneering technology company that specializes in creating advanced automation solutions designed to optimize and transform fab operations for advanced semiconductors. Leveraging cutting-edge AI and machine learning technologies, it develops intuitive, scalable and robust tools aimed at enhancing productivity, efficiency and data-driven decision-making. Via Automation’s commitment to innovation and customer-centric solutions make it a leader in the fab and equipment automation space, driving progress and operational excellence for improving operations and maintenance with AI.
Engage with Via Automation at:
Website: Getvia.ai/
Email: [email protected]
LinkedIn: https://www.linkedin.com/company/getvia/

For more information, contact:
Nanette Collins
Public Relations for Via Automation
[email protected]

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