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Drive Tomorrow’s Critical Policy: Help Shape Key Federal Policy and the Future of the Semiconductor Industry

The semiconductor industry stands at a generational inflection point with national economic and security priorities converging to define the role of semiconductors for the future. While the semiconductor and microelectronics industry is powering the future from AI to next-gen computing, federal policies on trade, tax, workforce and more are also poised to reshape the industry landscape.

The annual SEMI Washington Fly-In is a critical opportunity for SEMI members to advocate for the industry’s top priorities, share real-world insights on how federal policy impacts the industry and highlight the overwhelming contributions SEMI members make to the U.S. economy and national security.

The SEMI North American Advisory Board encourages the full SEMI membership to weigh-in with policymakers and share the industry’s most compelling strategies, opportunities, and challenges ahead. As Washington lawmakers assess the political landscape and develop priorities, the annual fly-in is an opportunity for SEMI members to shape policy on key issues from trade, tax and export controls to talent shortages and supply chain constraints. 

Join us as we champion the semiconductor industry in Washington, DC.
 


Watch our recap video to see highlights from the 2026 SEMI Washington Fly-In
 


 

SAMPLE AGENDA from 2026

Tuesday, March 3

  • Breakfast programming and training
  • Hill meetings
  • Congressional dinner

Wednesday, March 4

  • Congressional breakfast
  • Hill meetings
  • Hill reception

Thursday, March 5

  • Roundtable event on export controls
  • Additional government meetings
     

U.S. Capitol Hill
Washington, DC 20515
United States

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SEMI Americas and SEMI Global Public Policy & Advocacy hosted our annual Washington Fly-In for 2026 from March 3-5. SEMI North American Advisory Board members joined with additional member company representatives from across the supply chain in Washington, DC to engage directly with lawmakers in Congress to help shape the policy priorities that matter most to the semiconductor and microelectronics industry.  Stay tuned for details on our 2027 Washington Fly-In next spring.

Off Add to Calendar 2026-03-03 00:00:00 2026-03-05 00:00:00 SEMI Washington Fly-In SEMI Americas and SEMI Global Public Policy & Advocacy hosted our annual Washington Fly-In for 2026 from March 3-5. SEMI North American Advisory Board members joined with additional member company representatives from across the supply chain in Washington, DC to engage directly with lawmakers in Congress to help shape the policy priorities that matter most to the semiconductor and microelectronics industry.  Stay tuned for details on our 2027 Washington Fly-In next spring. U.S. Capitol Hill Washington, DC 20515 United States SEMI.org [email protected] America/New_York public America/New_York
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Petershausen, Germany—December 17, 2025. camLine, a leading provider of Manufacturing Execution Systems (MES) and process excellence solutions, has achieved DIN ISO/IEC 27001:2024 certification. This internationally recognized certificate underscores camLine’s unwavering commitment to data security and operational excellence in high-tech manufacturing software—a promise the company has been delivering for more than 35 years.

Protecting what matters the most: manufacturing continuity
Information security has become imperative and even a brief downtime in production can cost millions. camLine's investment in a comprehensive Information Security Management System (ISMS) addresses this reality to ensure that MES deployments maintain the highest standards of confidentiality, integrity, and availability.
"When manufacturers entrust their production operations to our MES solutions, they're not just looking for software. They want a partner who genuinely understands that their business continuity depends on the reliability of the system. Our ISMS framework prioritizes business continuity to minimize potential business losses," explains Frank Bölstler, Managing Director of camLine GmbH.

From compliance to competitive edge
ISO 27001 certification validates camLine's systematic approach through proactive incident prevention using continuous compliance assurance with annual audit across all units and a security-aware culture with role-based security training.
For manufacturers in regulated industries with multiple, ever-changing compliance requirements and standards, partnering with an ISO 27001-certified MES provider streamlines audit processes.

"Information security is not a one-off project—it’s a continuous process. Our ISMS framework ensures optimal protection through clear process ownership, complete documentation, and measurable security objectives aligned with business strategy," emphasizes Kilian Thomas, Information Security Officer at camLine.

Reinforce the foundation of trust through standardization and certification
camLine combines decades of manufacturing expertise with cutting-edge security practices. This ISO 27001 certification is not an endpoint but represents a milestone in the company's commitment to continuous improvement.

"The road to success is always under construction, and we're already implementing enhanced security policies company-wide and preparing for additional certification. Our customers deserve nothing less than excellence in both operational performance and security standards," says Bölstler.

More information & interview requests:
Elisa Industriq Mediadesk, [email protected], tel. +358 50 305 1605

About camLine
camLine, a business unit of Elisa Industriq, delivers intelligent software solutions for high-tech manufacturing environments. With over 35 years of expertise in Manufacturing Execution Systems (MES) and process excellence, camLine empowers manufacturers in semiconductors, electronics, automotive, renewable energy, and medical devices to achieve operational excellence through data-driven decision-making.
As part of Elisa Industriq’s ecosystem of industrial innovators, camLine combines deep domain knowledge with AI-powered operational intelligence to optimize production quality, reduce costs, and accelerate growth. Serving more than 1,200 customers across 50 countries, camLine drives measurable value and long-term digital transformation in high-tech manufacturing. elisaindustriq.com/camline

About Elisa Industriq
Elisa Industriq creates software solutions for operational intelligence by multiplying industrial knowledge with AI innovation. Our businesses—camLine, sedApta, Polystar, CalcuQuote, TenForce, and Gridle—serve over 2,000 clients internationally in the manufacturing, telecommunications, and energy sectors.
Elisa Industriq delivers business value for customers by reducing costs, improving quality, and generating growth. Our software solutions integrate with customers’ existing systems to optimize their operations in areas including manufacturing execution, supply chain optimization, network analytics, and energy management.
Elisa Industriq is part of Elisa, a pioneer in telecommunications and digital services headquartered in Finland. Our shared mission is a sustainable future through digitalization. Elisa Industriq employs nearly 1,600 experts in Europe, Asia, and North America. elisaindustriq.com

Gütenbach, Germany – December 16, 2025 – RENA Technologies is proud to be a key industrial partner in a new 1.3 million Euro Government-funded project led by the National Physical Laboratory (NPL) and supported by the Department for Science, Innovation and Technology (DSIT). The initiative will establish critical new metrology capabilities to strengthen the UK’s semiconductor innovation infrastructure and accelerate the development and adoption of next-generation semiconductor materials and processes.

This strategic investment underlines the UK’s commitment to maintaining global competitiveness in semiconductors, helping to attract private investment, strengthen supply chains, and support long-term economic growth. As advanced semiconductor materials become central to technologies such as electric vehicles, renewable energy, 5G communications and advanced electronics, robust measurement, verification and standards are increasingly essential.

The project brings together a broad consortium spanning industry and academia. Together, the partners cover the full innovation landscape, from materials research and process development to device fabrication and performance verification.

“At RENA, we develop advanced wet processing and surface treatment solutions that are critical in manufacturing of compound semiconductors and emerging materials. Through this collaboration, RENA will contribute industrial insight and process expertise to ensure that new measurement and testing capabilities are closely aligned with real manufacturing challenges.” States Peter Schneidewind, CEO of RENA Technologies.

While silicon remains the foundation of much of today’s semiconductor industry, many high-growth applications increasingly depend on advanced materials such as gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), and indium phosphide (InP). These materials offer superior performance in high-power, high-frequency and optoelectronic applications, but they also introduce new complexities in processing, characterization and quality assurance. Reliable standards and independent measurement methods are therefore essential to derisk innovation and support scale-up.

Through this project, consortium partners will work with NPL to:
• Develop new UK measurement and test capabilities for advanced semiconductor materials by combining academic research excellence with world-leading metrology expertise.
• Apply these capabilities to critical industry challenges, including assessing material integrity, verifying RF performance, and testing device reliability under demanding operating conditions.
• Share the resulting capabilities openly with industry, helping to build national consensus and strengthen the UK’s influence in international standards development for novel semiconductor technologies.

Following extensive consultation the consortium has identified three priority application areas where the UK can have the greatest global impact: power electronics, RF-communications, and optoelectronics. These areas align closely with RENA’s customer base and technology roadmap, particularly in power and compound semiconductor manufacturing.
By participating in this program, RENA reinforces its commitment to supporting the UK semiconductor ecosystem with industrially relevant innovation, enabling customers to adopt advanced materials with confidence, and helping position the UK as a global leader in next-generation semiconductor technologies.

About NPL
The National Physical Laboratory (NPL) is the UK's National Metrology Institute (NMI), developing and maintaining the national primary measurement standards, as well as collaborating with other NMIs to maintain the international system of measurement. As a public sector research establishment, it delivers extraordinary impact by providing the measurement capability that underpins the UK's prosperity and quality of life. NPL develops the metrology required to ensure the timely and successful deployment of new technologies and work with organizations as they develop and test new products and processes.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, and the glass industry. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

Kitchener, Ontario, December 15, 2025 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, has appointed IBM Japan Ltd. as its exclusive distributor in Japan.

Under this agreement, IBM Japan manages sales and provides frontline support for PEER Group’s full suite of automation, connectivity, and test products, as well as its comprehensive Professional Services offerings, for all customers based in Japan. Previously, Mizuho Research & Technologies, Ltd. acted as PEER Group’s exclusive Japanese distributor.

“We are honored to partner with IBM Japan to serve our current and future customers in the Japanese market,” says Mike Kropp, Co-founder, President, and CEO of PEER Group. “IBM Japan’s leadership in semiconductor manufacturing technology and highly respected engineering and sales capabilities make them the ideal representative of PEER Group’s products and services,” says Kropp, while adding: “We also extend our thanks to Mizuho for their support over the past 18 years.”

Founded in 1992, PEER Group supplies high-quality, high-performance, and cybersecure solutions for both semiconductor OEMs and fabs. Its software portfolio includes flagship automation and connectivity products PEER® Tool Orchestrator (PTO®), PEER FACTORY® Station Controller (PFSC™), EIB® OEM, as well as a host of other communications and test applications, such as GWGEM®Plus, ConX300™, and SECSIM Pro®+. As an active contributor to SEMI Standards development, PEER Group helps customers achieve compliance with the latest automation, connectivity, and emerging cybersecurity standards.

“This marks the beginning of a long-standing partnership between two industry leaders that will greatly benefit OEMs and factories in Japan,” says Mike Barrett, Vice President, Global Sales at PEER Group. “PEER Group’s best-in-class products and expertise in SEMI Standards compliance are a natural fit with IBM’s proven capabilities and deep knowledge in factory automation and MES software.”

PEER Group and IBM Japan will kick off the partnership at SEMICON Japan. Attendees are encouraged to visit booth E6527 and connect with representatives to discuss factory or equipment automation and connectivity projects. For more information, visit: https://www.peergroup.com/news-events/events/semicon-japan-2025.

About PEER Group
PEER Group® is the leading global supplier of innovative factory and tool automation and connectivity software for the semiconductor industry. Since our founding in 1992, we have been committed to developing best-in-class solutions that help OEMs and factories reduce their time to market, risk, and costs by solving their most challenging automation, connectivity, and SEMI Standards compliance problems. Follow PEER Group on. Follow PEER Group on LinkedIn.

Validation underscores DAS EE’s 35 years of leadership in advanced and sustainable abatement solutions
Dresden, Germany, November 28, 2025 — As the semiconductor industry intensifies its efforts to reach net-zero emissions, the recently published SEMI SCC Whitepaper “Overview of F-GHG and Nitrous Oxide Semiconductor Abatement Technologies” (2024) establishes new industry performance benchmarks for greenhouse gas abatement. The report defines a minimum Destruction and Removal Efficiency (DRE) for CF₄ of >95% and a maximum goal of >99% for process gas abatement systems.

These new reference points represent a significant step beyond the legacy assumptions used in many ESG reports and supplier requirements, which have historically relied on conservative default values for greenhouse gas abatement performance. However, even the upper range of the SEMI SCC targets does not yet represent the full potential of modern technology.

DAS Environmental Expert GmbH demonstrates with its TILIA abatement system that destruction efficiencies exceeding 99.9% for CF₄ and other F-GHGs are both technically feasible and economically advantageous. These systems outperform the benchmarks set forth by the SEMI SCC whitepaper and contribute directly to the industry's carbon reduction goals.

“Systems like TILIA prove that it is not only possible but also economically rational to exceed the current industry benchmarks,” says Stephan Raithel, Chief Operating Officer Gas Treatment at DAS Environmental Expert GmbH. “With rising carbon taxes and tightening sustainability targets, investing in high-efficiency abatement translates directly into operational and financial benefits.”

The global semiconductor industry emits thousands of tons of CF₄ annually, a gas with a Global Warming Potential (GWP) of 7,390. Even a few tons of unmitigated emissions correspond to millions of tons of CO₂ equivalents. While current industry practice aims to meet the SCC-recommended minimum DREs, only systems operating consistently above 99.9% will enable the industry to meet its net-zero commitments.

The SEMI SCC Whitepaper emphasizes that achieving these higher efficiencies is crucial for the industry’s sustainability roadmap and requires broad adoption of next-generation abatement technologies. DAS Environmental Experts’ proven TILIA platform exemplifies this transition – setting a new benchmark for “Best in Class” abatement performance in the semiconductor industry.

About the Company
DAS Environmental Experts Group (DAS Group), headquartered in Dresden, Germany, was founded in 1991 and is now a global organization with subsidiaries on three continents and more than 950 employees worldwide. Over the past three decades, DAS Group has become one of the leading technology and equipment providers for waste gas abatement solutions with a focus on semiconductor industry.
In addition, DAS Group develops advanced process and system solutions for industrial water treatment, with extensive expertise in the recycling and reuse of wastewater from the semiconductor industry.
DAS solutions are engineered to meet the stringent purity requirements of semiconductor manufacturing, helping clients comply with global environmental standards.

SEOUL, SOUTH KOREA, November 18, 2025 — As the semiconductor industry accelerates global collaboration and complex supply chain operations, sensitive design and process data are increasingly exposed, not just through files, but through screens. Fasoo, the leader in data-centric security, warns that unsecured screens have become a blind spot in protecting semiconductor intellectual property (IP) and operational integrity.

“Hybrid work has blurred the traditional security boundaries. For semiconductor supply chains, visibility and accountability are essential more than ever,” said Jason Sohn, Executive Managing Director at Fasoo. “Design layouts, calibration dashboards, or live engineering sessions often contain proprietary information that can be captured, photographed, or recorded within seconds. Enhancing user security awareness and maintaining auditable activity logs are key to building a trusted and resilient ecosystem.”

While traditional security tools protect stored or shared files, the industry continues to face growing data from exposed screens. Engineers viewing CAD/EDA layouts, operators monitoring yield dashboards, and suppliers accessing systems remotely all create potential breach points. Once sensitive visuals appear on a screen, they can be lost through screenshots, photos, or unauthorized screen sharing, often without detection or traceability.

Fasoo’s screen security solutions address these challenges by blocking unauthorized screen capture, applying persistent watermarks, and maintaining detailed activity logs that record viewing and capture attempts. These capabilities provide visibility and accountability across both on-premise and remote environments, ensuring that any attempt to capture or redistribute sensitive visual information is prevented or immediately traceable.

By extending protection from files to the screens, Fasoo is strengthening its leadership in data-centric security and driving broader adoption across the semiconductor ecosystem. This expansion reinforces the company’s commitment to enabling secure innovation across the value chain, protecting high-value IP assets, enhancing compliance readiness, and supporting the industry’s digital resilience.

For more information, visit https://en.fasoo.com/products/fasoo-smart-screen/.

 

About Fasoo

Fasoo provides unstructured data security, privacy, and enterprise content platforms that securely protect, control, trace, analyze, and share critical business information while enhancing productivity. Fasoo's continuous focus on customer innovation and creativity provides market-leading solutions to the challenges faced by organizations of all sizes and industries. For more information, visit https://en.fasoo.com/.

Second-generation platform delivers advanced control, in-cycle annealing, and high-throughput performance for Wide Bandgap power and RF device manufacturing

Espoo, Finland, November 24, 2025 – Beneq introduces the Beneq Transform® XP, a second-generation ALD platform developed to meet the performance demands of Wide Bandgap (WBG) power and RF device technology development and manufacturing. Building on the proven Beneq Transform® platform, the new system adds advanced ALD control, faster cycle times, and greater process capabilities in a high-throughput format.

The Beneq Transform® XP features a second-generation, flow-optimized 25-wafer mini-batch thermal ALD reactor that achieves breakthrough deposition rates with single-digit-second cycle times for common ALD oxides and nitrides. Refined flow and pressure dynamics ensure exceptional within-wafer and wafer-to-wafer uniformity – even at a few nm film thicknesses – while precise dwell-time control delivers excellent conformality on high-aspect-ratio structures.

Transform® XP also introduces advanced PEALD process control to precisely manage low-energy ions. This enables optimized plasma pre-cleaning and deposition, resulting in improved interface quality, tunable passivation, and enhanced device performance and reliability. The system integrates in-cycle annealing, a proprietary step that densifies and purifies films to achieve stoichiometric, low-impurity materials and crystalline alignment, such as AlN lattice orientation.

“Transform® XP is our response to the next wave of device challenges in power and RF manufacturing,” said Dr. Mikko Söderlund, Head of Sales, Semiconductor ALD at Beneq. “Customers value the original Transform® for its versatility and reliability. With XP, we introduce capabilities they specifically asked for – improved ion control, faster cycles, and in-cycle film densification – all in a versatile platform.”

With over a dozen Beneq Transform® clusters installed globally for WBG pilot and production use, and more than 100 process modules shipped, Beneq continues to support leading IDMs, foundries, and RTOs advancing More-than-Moore technologies.

About Beneq

Beneq pioneered industrial production of Atomic Layer Deposition (ALD) with the introduction of the first commercial ALD equipment in 1984. Today, Beneq advances ALD adoption and validation with a portfolio that includes the Beneq Transform®, Transform XP, Transform 300, Transmute™, and Prodigy™ for specialty semiconductor device fabrication; TFS 200 and TFS 500 for R&D; the P400A, P800, and P1500 batch systems for coating critical semiconductor chamber components and complex part geometries; and spatial ALD platforms such as the C2R™ and Genesis for roll-to-roll processing. Headquartered in Espoo, Finland, Beneq enables ALD integration from lab to fab for semiconductors, optics, and functional coatings.

Press Contact
Charlotte Bärlund
Event and Communications Lead
[email protected]

Breker Verification Systems today confirmed its RISC-V functional verification solutions were pivotal for verification of the NOEL-V, one of Frontgrade Gaisler’s fault-tolerant RISC-V processor IP cores.

“The development of Frontgrade Gaisler’s IP cores is guided by a philosophy that does not tolerate design issues,” notes Jan Andersson, Director of Engineering at Frontgrade Gaisler. “This demands the most robust verification environment, something Breker’s verification solution has contributed to improve, with its broad range of tests and in-depth corner case coverage.”

The ultra-high verification coverage afforded by Breker’s RISC-V SystemVIP and Test Suite Synthesis products make it a key technology in Frontgrade Gaisler’s development program. Breker provides test suites for the complete verification of RISC-V cores and SoCs from detailed microarchitectural analysis to advanced system integrity validation.

The NOEL-V processor by Frontgrade Gaisler, targets high-reliability applications, with its high-performance and fault-tolerant design. Built on the RISC-V architecture, NOEL-V offers customization options, allowing SoC designers to create solutions tailored to their specific needs. The processor is at the heart of the GR765, Frontgrade’s next-generation radiation-hardened space microprocessor.

“We are delighted to work with Frontgrade Gaisler to achieve their extreme coverage goals and eliminate unpredictable corner cases, both of which are necessary given the extreme environments in which their devices are deployed,” says David Kelf, Breker’s CEO. “Our RISC-V test suites have become an essential component in the development flows of over 20 commercial entities and other organizations, providing us with unique experience with the numerous unusual verification issues inherent in these processors.”

Breker extended testing to target advanced, system-level integrity, in addition to its existing test suites and generators focused on instruction set architecture testing, included in its RISC-V SystemVIP. It provides coverage by driving cross functional stress verification and unpredictable corner case discovery with its test suite synthesis technology applied across the verification flow from simulation, through emulation and prototyping to post silicon validation.

About Frontgrade Gaisler
Frontgrade Gaisler, a Frontgrade company, is a leading provider of radiation-hardened microprocessors and IP cores for critical applications, particularly in the space industry. The company’s processors are ideal for any space mission or other high-reliability application due to their reliability, fault tolerance, and radiation tolerance. Frontgrade Gaisler microprocessors can be found all over the solar system, from Mercury to Neptune. www.gaisler.com

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/

New platform delivers ALD film quality at production throughput for Wide Bandgap and other specialty device manufacturing

Espoo, Finland, November 19, 2025 – Beneq, a global leader in Atomic Layer Deposition (ALD) equipment and solutions, today announced Beneq Transmute™, a next-generation ALD platform designed for high-volume semiconductor manufacturing. Engineered for high volume production of Wide Bandgap (WBG) power electronics, advanced RF devices, μLED and other specialty devices, Beneq Transmute™ combines performance, scalability, and cost efficiency in one system.

Atomic precision at manufacturing speed

Beneq Transmute™ extends the performance of the Beneq Transform® XP platform into production environments with Beneq’s proprietary 3-step ALD architecture. By combining plasma pre-treatment, plasma-enhanced ALD (PEALD), and thermal batch ALD, the platform delivers conformal, high-performance dielectric stacks with atomic-level interface control – now at high throughput.

Its flow-uniform 25-wafer chambers, paired with advanced precursor dosing technology, enable rapid cycle times, optimized wafer coverage, and reduced precursor waste – resulting in a low cost of ownership across a broad range of semiconductor applications.

“Beneq Transmute™ represents a major leap forward in making ALD a truly high-volume manufacturing solution,” said Lucas Monteiro, Head of Product at Beneq. “By combining the precision of ALD with throughput and scalability that match production demands, we are giving our customers the ability to produce next-generation Wide Bandgap and RF devices at high throughput and low cost of ownership – with the uncompromised film quality that Beneq is known for.”

Designed for dedicated production requirements

Beneq Transmute™ supports both thermal and plasma-enhanced ALD within a modular cluster architecture that enables dedicated configurations. With up to two transfer chambers and eleven process module slots – including PEALD, Thermal, Buffer, and Preheater – each system can be tailored to match specific customer applications and fab roadmaps while ensuring long-term scalability.

Enabling the next wave of electronics

Beneq Transmute™ directly supports key semiconductor market trends – including the electrification of transport, adoption of renewable energy, 5G and RF communications, data centers and next-generation displays. Its combination of atomic precision and production throughput positions Beneq as a technology enabler for a more efficient, connected, and sustainable future.

About Beneq

Beneq pioneered industrial Atomic Layer Deposition (ALD) with the introduction of the first commercial ALD equipment in 1984. Today, Beneq advances ALD technology adoption and validation with a portfolio that includes Transform®, Transform® 300, and Prodigy™ for specialty semiconductor device fabrication; TFS 200 and TFS 500 for R&D; and innovative spatial ALD platforms such as the C2R™ and Genesis for rolltoroll processing. Beneq’s systems support process innovation from lab to fab, enabling integration of ALD in advanced manufacturing. Headquartered in Espoo, Finland, Beneq operates globally to help customers scale ALD solutions for the future of semiconductors, optics, and functional coatings.

Press Contact:
Charlotte Bärlund
Event and Communications Lead
[email protected]

New SECS-II library helps fabs and OEMs integrate semiconductor tools with the MES in hybrid manufacturing sites, ensuring faster time to market and limiting integration costs

MUNICH, November 18, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, today unveils Agil’SECS-II at Booth #C2518 at SEMICON Europa 2025. This new SECS-II library, featuring built-in SEMI standard communication, enables a manufacturing execution system (MES) to accelerate the integration and validation of hybrid semiconductor and traditional manufacturing tools on production lines, ensuring faster time to market, lower integration costs, and reduced deployment risks. With this connection gateway, users can send and receive any SEMI SECS-II-compliant message as host or equipment for full GEM and GEM300 equipment integration and validation. This product can prove valuable for a variety of customers:

• Pure semiconductor original equipment manufacturers (OEMs) that need a practical way to develop an MES simulator and exercise their equipment under fab-like conditions. For small production lines or multi-tool set-ups exchanging data through SECS/GEM, Agil’SECS-II allows OEMs to design, test, and validate their equipment efficiently before shipping it to fabs.

• Customized, multi-industry, or low-volume production sites that use an MES system to integrate both traditional production machines and semiconductor tools. Agil’SECS-II simplifies integration in mixed equipment environments, especially where the MES cannot use SECS/GEM because most tools rely on protocols such as OPC UA, Modbus, or MQTT, yet semiconductor equipment using SECS/GEM must be integrated within the same MES.

• Laboratories and pilot lines without a full-featured MES that require a driver to collect data from various types of manufacturing equipment, including process, inspection, and metrology tools, to ensure quality and process control as well as complete traceability.

“With Agil’SECS-II, we wanted to provide a flexible tool that can serve multiple types of customers who can benefit from a proven software foundation built on more than 15 years of deployment experience in semiconductor fabs worldwide,” explains Marc Engel, chief executive officer of Agileo Automation. “Our SECS-II driver is especially useful for validating the processes of hybrid fabs that combine semiconductor and non-semiconductor manufacturing equipment, such as silicon carbide (SiC) wafer production lines or advanced packaging lines. It enables product and process traceability with legacy MES and helps OEMs developing equipment for these lines create MES simulators to verify information flow between tools using heterogeneous communication protocols.”

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About Agileo Automation
Agileo Automation is a trusted partner for equipment manufacturers, helping them build smarter, automated, and more connected machines that integrate seamlessly into advanced semiconductor fabs. Founded in 2010 in Poitiers, France, Agileo Automation helps OEMs optimize control, communication, data acquisition, and testing across their tools through proven software frameworks, applications, and expert support. Its flagship A²ECF-SEMI framework provides a solid foundation for developing equipment controllers fully aligned with SEMI SECS/GEM, GEM300, and EDA standards. As an active member of SEMI and the OPC Foundation, Agileo Automation contributes directly to shaping the standards that drive Industry 4.0 manufacturing. For more information, please visit our website or follow us on LinkedIn.